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公开(公告)号：US06205657B1
公开(公告)日：2001-03-27
申请号：US08959154
申请日：1997-10-28
IPC分类号： H05K302
CPC分类号： H05K1/0373 , H05K2201/0769 , H05K2203/121 , Y10S428/901 , Y10T29/49155 , Y10T428/24802 , Y10T428/24917
摘要： A printed circuit board includes insulating layers formed by impregnating a base material with a resin and a metal foil pattern formed on a desired layer of the insulating layers. Ions for forming a hardly soluble metal salt by combining with metal ions free from a portion of the board or a sulfur-containing compound for reacting with the metal ion are present in the insulating layer or on a surface of the metal foil pattern. Furthermore, a method for producing the printed circuit board includes any one of the steps of adding the ions or the sulfur-containing compound to the resin varnish, impregnating a base material with the solution of the ions or the sulfur-containing compound, or applying the solution onto the surface of the metal foil pattern, in order to allow the ions or the sulfur-containing compound to exist in the printed circuit board.
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公开(公告)号：US06174589B1
公开(公告)日：2001-01-16
申请号：US09159376
申请日：1998-09-23
IPC分类号： B32B300
CPC分类号： H05K1/0373 , H05K2201/0769 , H05K2203/121 , Y10S428/901 , Y10T29/49155 , Y10T428/24802 , Y10T428/24917
摘要： A printed circuit board includes insulating layers formed by impregnating a base material with a resin and a metal foil pattern formed on a desired layer of the insulating layers. Ions for forming a hardly soluble metal salt by combining with metal ions free from a portion of the board or a sulfur-containing compound for reacting with the metal ion are present in the insulating layer or on a surface of the metal foil pattern. Furthermore, a method for producing the printed circuit board includes any one of the steps of adding the ions or the sulfur-containing compound to the resin varnish, impregnating a base material with the solution of the ions or the sulfur-containing compound, or applying the solution onto the surface of the metal foil pattern, in order to allow the ions or the sulfur-containing compound to exist in the printed circuit board.
摘要翻译： 印刷电路板包括通过用树脂浸渍基材而形成的绝缘层和形成在所述绝缘层的所需层上的金属箔图案。 在绝缘层或金属箔图案的表面上存在用于通过与不含板的金属离子结合形成难溶金属盐的离子或与金属离子反应的含硫化合物。 此外，制造印刷电路板的方法包括以下步骤之一：将离子或含硫化合物加入到树脂清漆中，用离子或含硫化合物的溶液浸渍基材或施加 溶液到金属箔图案的表面上，以便允许离子或含硫化合物存在于印刷电路板中。
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3.发明授权公开(公告)号：US07356916B2
公开(公告)日：2008-04-15
申请号：US10362448
申请日：2002-07-16
申请人： Toshihiro Nishii , Yasuharu Fukui , Kiyohide Tatsumi , Yoshihiro Kawakita , Shinji Nakamura , Hideaki Komoda
发明人： Toshihiro Nishii , Yasuharu Fukui , Kiyohide Tatsumi , Yoshihiro Kawakita , Shinji Nakamura , Hideaki Komoda
IPC分类号： H05K3/36
CPC分类号： H05K3/4069 , H05K1/0366 , H05K3/4614 , H05K3/4652 , H05K2201/0278 , H05K2201/029 , H05K2201/0355 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T428/24917
摘要： A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.
摘要翻译： 提供了具有可靠电气连接的电路板。 具有用于将层连接到另一层的连接的绝缘板材料包括加强构件。 整个绝缘板材料的厚度至少等于且不超过加强件厚度的1.5倍。
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公开(公告)号：US06866892B2
公开(公告)日：2005-03-15
申请号：US10607306
申请日：2003-06-27
CPC分类号： H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
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公开(公告)号：US08007629B2
公开(公告)日：2011-08-30
申请号：US10595157
申请日：2005-09-30
CPC分类号： H05K3/4652 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2201/068 , H05K2203/068 , Y10T29/49126
摘要： A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.
摘要翻译： 一种制造多层电路板的方法，包括制备由（i）其上具有电路图案的芯线电路板和（ii）具有填充有导电浆料的通孔的预浸料片形成的层叠构件，形成层压结构 使得层压构件被层压板夹持，并且对层压结构施加热和压力。 根据该方法，选择具有与核心电路基板的热膨胀系数相当的热膨胀系数的层叠板将保护导电膏不发生变形，从而提供具有可靠连接电阻的高品质多层电路板。
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6.发明申请Circuit formation substrate manufacturing method and circuit formation substrate material 失效电路形成衬底制造方法和电路形成衬底材料公开(公告)号：US20050198818A1
公开(公告)日：2005-09-15
申请号：US10517445
申请日：2004-05-14
CPC分类号： B32B37/22 , B32B37/226 , B32B38/18 , B32B2309/105 , B32B2457/08 , H05K1/0366 , H05K3/0052 , H05K3/022 , H05K3/4069 , H05K2201/0355 , H05K2203/0191 , H05K2203/068 , H05K2203/1461 , H05K2203/1545 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/53865
摘要： In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows connecting member, such as conductive paste, to electrically coupling between layers of the circuit forming board.
摘要翻译： 在制造电路形成板的方法中，具有第一方向的第一片在第二方向上被转印，使得第一片的第一方向平行于第二方向。 在与第一片的第一方向正交的第三方向上转印第一片时，将膜粘附在第一片的两个表面上。 该方法允许诸如导电浆料的连接构件在电路形成板的层之间电耦合。
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公开(公告)号：US06713688B2
公开(公告)日：2004-03-30
申请号：US09986453
申请日：2001-11-08
申请人： Shinobu Kokufu , Takeshi Suzuki , Fumio Echigo , Daizo Andoh , Tatsuo Ogawa , Yoshihiro Kawakita , Satoru Tomekawa
发明人： Shinobu Kokufu , Takeshi Suzuki , Fumio Echigo , Daizo Andoh , Tatsuo Ogawa , Yoshihiro Kawakita , Satoru Tomekawa
IPC分类号： H05K1204
CPC分类号： H05K3/4069 , H05K3/282 , H05K3/389 , H05K3/4614 , H05K2201/0239 , H05K2201/0355 , H05K2203/1461 , Y10T29/49126 , Y10T29/49128 , Y10T29/49153 , Y10T29/49155 , Y10T29/49165 , Y10T29/49171 , Y10T428/24917
摘要： A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2. Then, each dimension of interface regions 7 where the protective agent 6 does not exist is set to such a size that a plurality of conductive powders 4 constituting the via 3 can abutted on the wiring layer 2. Therefore, the plurality of conductive powders 4 and the wiring layer 2 are abutted each other in each interface region 7 where the protective agent 6 does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.
摘要翻译： 用于保护布线1的保护剂6在通孔3和布线层2之间的界面上分散并放置成斑驳状。然后，将不存在保护剂6的界面区域7的每个尺寸设定为 构成通孔3的多个导电粉末4可以与布线层2抵接的尺寸。因此，在保护剂6不是的各界面区域7中，多个导电粉末4和布线层2彼此抵接 存在电连接，从而稳定连接电阻长时间。
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公开(公告)号：US06596381B2
公开(公告)日：2003-07-22
申请号：US09962245
申请日：2001-09-26
IPC分类号： B32B300
CPC分类号： H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
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9.发明授权Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material 失效用于制造电路板的中间材料和使用这种中间材料制造电路板的方法公开(公告)号：US07828924B2
公开(公告)日：2010-11-09
申请号：US12088203
申请日：2006-12-06
IPC分类号： B29C65/00 , B29C63/00 , B32B37/00 , B32B38/10 , B32B38/04 , B32B15/08 , B32B9/00 , B32B33/00 , B31B1/60 , B65B33/00 , C09D5/00
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2201/09827 , H05K2201/09854 , H05K2201/10378 , H05K2203/0191 , H05K2203/0264 , H05K2203/1461 , Y10S428/901 , Y10T156/10 , Y10T156/1059 , Y10T428/14 , Y10T428/24322 , Y10T428/31522
摘要： An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t1 of the prepreg sheet, the minimum diameter rmin of the through-hole, the thickness tf1 of the first film, the diameter rf1 of the first hole, the thickness tf2 of the second film, the diameter rf2 of the second hole satisfy a relation: rf1/tf1≧3, rf2/tf2≧3, and rmin/(t1+tf1+tf2)≦1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.
摘要翻译： 适用于制造电路板的中间材料包括其中设置有通孔的预浸料片，设置在预浸料片表面上并具有与通孔连通的第一孔的第一膜，设置有第二膜 在所述预浸料片的另一表面上具有与所述通孔连通的第二孔，以及填充所述通孔，所述第一孔和所述第二孔的导电糊。 预浸片的厚度t1，通孔的最小直径rmin，第一膜的厚度tf1，第一孔的直径rf1，第二膜的厚度tf2，第二孔的直径rf2满足 关系：rf1 /tf1≥3，rf2 /tf2≥3，rmin /（t1 + tf1 + tf2）＆nlE; 1.5。 该中间材料提供了具有连接到金属箔的细通孔导体的电路板，并且稳定而稳定。
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公开(公告)号：US07816611B2
公开(公告)日：2010-10-19
申请号：US11619860
申请日：2007-01-04
CPC分类号： H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2203/068 , H05K2203/1461 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.
摘要翻译： 在具有填充有导电膏的导电孔的具有低压缩性的预浸料片的任一表面上设置金属箔之后，在保持在较低温度的状态下将预浸料片压缩，之后将温度在压力下升高至 熔融并硬化预浸料片中的树脂，从而使连接电阻稳定，并且可以获得高质量的电路板。
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