公开(公告)号：US07622205B2

公开(公告)日：2009-11-24

申请号：US11104274

申请日：2005-04-12

申请人： Hiroyuki Uwazumi ,  Youichi Tei ,  Kengo Kainuma ,  Kazuhito Higuchi ,  Akira Iso ,  Hajime Kurihara

发明人： Hiroyuki Uwazumi ,  Youichi Tei ,  Kengo Kainuma ,  Kazuhito Higuchi ,  Akira Iso ,  Hajime Kurihara

IPC分类号： G11B5/64 ,  G11B5/00 ,  G11B15/70

CPC分类号： G11B5/667 ,  G11B5/7315

摘要： A disk substrate for a perpendicular magnetic recording medium is, disclosed. The substrate exhibits sufficient productivity, serves the function of a soft magnetic backing layer of the perpendicular magnetic recording medium, and scarcely generates noise. A perpendicular magnetic recording medium using such a substrate also is disclosed. The disk substrate comprises at least a soft magnetic underlayer formed on a nonmagnetic base plate by means of an electroless plating method. The thermal expansion coefficient of the soft magnetic underlayer is larger than a thermal expansion coefficient of the nonmagnetic disk-shaped base plate. A saturation magnetostriction constant λs satisfies a relation λs≧−1×10−5.

摘要翻译： 公开了一种用于垂直磁记录介质的盘基片。 基板表现出足够的生产率，起到垂直磁记录介质的软磁背衬层的功能，并且几乎不产生噪声。 还公开了使用这种基板的垂直磁记录介质。 盘状基板通过无电镀法至少包含在非磁性基板上形成的软磁性底层。 软磁性底层的热膨胀系数大于非磁性盘状基板的热膨胀系数。 饱和磁致伸缩常数lambdas满足关系lambdas> = - 1×10-5。

公开(公告)号：US08039045B2

公开(公告)日：2011-10-18

申请号：US11191170

申请日：2005-07-27

申请人： Youichi Tei ,  Akira Iso ,  Kazuhito Higuchi ,  Hajime Kurihara ,  Hiroyuki Uwazumi

发明人： Youichi Tei ,  Akira Iso ,  Kazuhito Higuchi ,  Hajime Kurihara ,  Hiroyuki Uwazumi

IPC分类号： B05D5/12 ,  B05D3/10 ,  B05D3/02 ,  C23C18/18 ,  C23C18/31 ,  C23C18/32 ,  C23C18/34 ,  C23C18/50

CPC分类号： C03C15/00 ,  C03C17/38 ,  C03C23/0075 ,  C23C18/1694 ,  C23C18/1893 ,  G11B5/8404

摘要： An object of the present invention is to provide a plating method on a glass base plate. The method allows forming a plating film on a base plate composed of a glass material with excellent adhesivity and homogeneity by means of an electroless plating method even to a thickness of 1 μm or more. Before forming a plating film by a step of electroless plating S6, a surface treatment process is conducted on a surface of the base plate composed of a glass material. The surface treatment process comprises at least a step of glass activation treatment S2 to increase quantity of silanol groups on the surface of the base plate at least by a factor of two using an aqueous solution of diluted acid, a step of silane coupling agent treatment S3, a step of palladium catalyst treatment S4, and a step of palladium bonding treatment S5.

摘要翻译： 本发明的目的是提供一种在玻璃基板上的电镀方法。 该方法允许通过化学镀方法在具有优异的粘合性和均匀性的玻璃材料的基板上形成镀膜，甚至至1μm以上的厚度。 在通过化学镀S6的步骤形成镀膜之前，在由玻璃材料构成的基板的表面上进行表面处理。 表面处理方法至少包括玻璃活化处理S2的步骤，以使用稀酸水溶液将基板表面上的硅烷醇基增加至少两倍，硅烷偶联剂处理步骤S3 ，钯催化剂处理步骤S4和钯结合处理步骤S5。

公开(公告)号：US20060024431A1

公开(公告)日：2006-02-02

申请号：US11191170

申请日：2005-07-27

申请人： Youichi Tei ,  Akira Iso ,  Kazuhito Higuchi ,  Hajime Kurihara ,  Hiroyuki Uwazumi

发明人： Youichi Tei ,  Akira Iso ,  Kazuhito Higuchi ,  Hajime Kurihara ,  Hiroyuki Uwazumi

IPC分类号： B05D5/12 ,  B05D3/00

CPC分类号： C03C15/00 ,  C03C17/38 ,  C03C23/0075 ,  C23C18/1694 ,  C23C18/1893 ,  G11B5/8404

摘要： An object of the present invention is to provide a plating method on a glass base plate. The method allows forming a plating film on a base plate composed of a glass material with excellent adhesivity and homogeneity by means of an electroless plating method even to a thickness of 1 μm or more. Before forming a plating film by a step of electroless plating S6, a surface treatment process is conducted on a surface of the base plate composed of a glass material. The surface treatment process comprises at least a step of glass activation treatment S2 to increase quantity of silanol groups on the surface of the base plate at least by a factor of two using an aqueous solution of diluted acid, a step of silane coupling agent treatment S3, a step of palladium catalyst treatment S4, and a step of palladium bonding treatment S5.

摘要翻译： 本发明的目的是提供一种在玻璃基板上的电镀方法。 该方法允许通过化学镀方法在具有优异的粘合性和均匀性的玻璃材料的基板上形成镀膜，甚至厚度为1um或更大。 在通过无电解电镀步骤S 6形成电镀膜之前，在由玻璃材料构成的基板的表面上进行表面处理工艺。 表面处理方法至少包括玻璃活化处理S 2的步骤，以使用稀酸水溶液至少增加2倍的基板表面的硅烷醇基团量，硅烷偶联剂处理步骤 S 3，钯催化剂处理工序S4，钯键合处理工序S 5。

公开(公告)号：US20050238929A1

公开(公告)日：2005-10-27

申请号：US11104274

申请日：2005-04-12

申请人： Hiroyuki Uwazumi ,  Youichi Tei ,  Kengo Kainuma ,  Kazuhito Higuchi ,  Akira Iso ,  Hajime Kurihara

发明人： Hiroyuki Uwazumi ,  Youichi Tei ,  Kengo Kainuma ,  Kazuhito Higuchi ,  Akira Iso ,  Hajime Kurihara

IPC分类号： G11B5/667 ,  C23C18/50 ,  G11B5/64 ,  G11B5/65 ,  G11B5/66 ,  G11B5/72 ,  G11B5/73 ,  G11B5/738

CPC分类号： G11B5/667 ,  G11B5/7315

摘要： A disk substrate for a perpendicular magnetic recording medium is, disclosed. The substrate exhibits sufficient productivity, serves the function of a soft magnetic backing layer of the perpendicular magnetic recording medium, and scarcely generates noise. A perpendicular magnetic recording medium using such a substrate also is disclosed. The disk substrate comprises at least a soft magnetic underlayer formed on a nonmagnetic base plate by means of an electroless plating method. The thermal expansion coefficient of the soft magnetic underlayer is larger than a thermal expansion coefficient of the nonmagnetic disk-shaped base plate. A saturation magnetostriction constant μs satisfies a relation λs≧−1×10−5.

摘要翻译： 公开了一种用于垂直磁记录介质的盘基片。 基板表现出足够的生产率，起到垂直磁记录介质的软磁背衬层的功能，并且几乎不产生噪声。 还公开了使用这种基板的垂直磁记录介质。 盘状基板通过无电镀法至少包含在非磁性基板上形成的软磁性底层。 软磁性底层的热膨胀系数大于非磁性盘状基板的热膨胀系数。 饱和磁致伸缩常数mus满足关系lambdas> = - 1×10 -5。

公开(公告)号：US20050287304A1

公开(公告)日：2005-12-29

申请号：US11149430

申请日：2005-06-10

申请人： Akira Iso ,  Youichi Tei ,  Kazuhito Higuchi

发明人： Akira Iso ,  Youichi Tei ,  Kazuhito Higuchi

IPC分类号： C23C18/28 ,  B05D1/18 ,  C23C18/18 ,  G11B5/73 ,  G11B5/738 ,  G11B5/82 ,  G11B5/84 ,  G11B5/858

CPC分类号： C23C18/1893 ,  C23C18/1865 ,  C23C18/1889 ,  G11B5/8404

摘要： The method of increasing adhesion between a substrate and an electroless plating layer, and treating the substrate for electroless plating, includes removing any excess alkali from the surface of the substrate, etching the surface of the glass substrate, forming an adhesion layer, forming a catalyst layer on the adhesion layer, and forming an electroless plating film on the catalyst layer.

摘要翻译： 提高基板与化学镀层之间的粘合力的方法以及对基板进行化学镀处理的方法包括从基板的表面除去过量的碱，蚀刻玻璃基板的表面，形成粘合层，形成催化剂 层，并且在催化剂层上形成化学镀膜。

公开(公告)号：US20050238926A1

公开(公告)日：2005-10-27

申请号：US11078199

申请日：2005-03-11

申请人： Hiroyuki Uwazumi ,  Norihiko Nakajima ,  Tatsumi Kawata ,  Kazuhito Higuchi

发明人： Hiroyuki Uwazumi ,  Norihiko Nakajima ,  Tatsumi Kawata ,  Kazuhito Higuchi

IPC分类号： G11B5/667 ,  A61B6/00 ,  G01N23/00 ,  G11B5/64 ,  G11B5/65 ,  G11B5/73 ,  G11B5/738 ,  G11B5/84 ,  G21K1/12 ,  H04N5/325 ,  H05G1/60

CPC分类号： G11B5/667

摘要： A substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using such a substrate are disclosed. The substrate exhibits sufficient productivity and functions as a soft magnetic backing layer of a perpendicular magnetic recording medium based on the substrate, ensuring surface hardness. The substrate comprises a nonmagnetic base plate composed of an aluminum alloy, an adhesion layer formed on the nonmagnetic base plate and composed of a material containing at least nickel, and a soft magnetic underlayer formed on the adhesion layer by means of an electroless plating method. The soft magnetic underlayer contains phosphorus in a range of 3 at % to 20 at %, and at least 25 at % of cobalt in proportion to the number of atoms of cobalt and nickel excluding the phosphorus (Co/(Co+Ni)). Thickness of the adhesion layer is at least 0.1 μm. Thickness of the soft magnetic underlayer is at least 0.2 μm, and a sum of the thickness of the adhesion layer and the thickness of the soft magnetic underlayer is at least 3 μm.

摘要翻译： 公开了一种用于垂直磁记录介质的基板和使用这种基板的垂直磁记录介质。 该基材表现出足够的生产率并且作为基于该基材的垂直磁记录介质的软磁背衬层起着保证表面硬度的作用。 基板包括由铝合金构成的非磁性基板，形成在非磁性基板上的由至少含有镍的材料构成的粘合层，以及通过无电镀法形成在粘合层上的软磁性底层。 软磁性底层的磷含量（Co /（Co + Ni））不包括钴和镍的原子数的比例为3原子％至20原子％，至少25原子％的磷。 粘合层的厚度为0.1μm以上。 软磁性底层的厚度为0.2μm以上，粘着层的厚度与软磁性底层的厚度之和为3μm以上。

公开(公告)号：US08754429B2

公开(公告)日：2014-06-17

申请号：US13154999

申请日：2011-06-07

申请人： Hiroshi Koizumi ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa ,  Yoshiaki Sugizaki ,  Akihiro Kojima

发明人： Hiroshi Koizumi ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa ,  Yoshiaki Sugizaki ,  Akihiro Kojima

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0058

摘要： According to one embodiment, an optical semiconductor device includes a light emitting layer, a transparent layer, a first metal post, a second metal post and a sealing layer. The light emitting layer includes a first and a second major surface, a first and a second electrode. The second major surface is a surface opposite to the first major surface, and the first electrode and second electrodes are formed on the second major surface. The transparent layer is provided on the first major surface. The first metal post is provided on the first electrode. The second metal post is provided on the second electrode. The sealing layer is provided on the second major surface. The sealing layer covers a side surface of the light emitting layer and seals the first and second metal posts while leaving end portions of the first and second metal posts exposed.

摘要翻译： 根据一个实施例，光学半导体器件包括发光层，透明层，第一金属柱，第二金属柱和密封层。 发光层包括第一和第二主表面，第一和第二电极。 第二主表面是与第一主表面相对的表面，并且第一电极和第二电极形成在第二主表面上。 透明层设置在第一主表面上。 第一金属柱设置在第一电极上。 第二金属柱设置在第二电极上。 密封层设置在第二主表面上。 密封层覆盖发光层的侧表面，并且密封第一和第二金属柱，同时使第一和第二金属柱的端部露出。

公开(公告)号：US20110312110A1

公开(公告)日：2011-12-22

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/52

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US20110297983A1

公开(公告)日：2011-12-08

申请号：US13152654

申请日：2011-06-03

申请人： Hideo NISHIUCHI ,  Kazuhito Higuchi ,  Susumu Obata ,  Toshiya Nakayama

发明人： Hideo NISHIUCHI ,  Kazuhito Higuchi ,  Susumu Obata ,  Toshiya Nakayama

IPC分类号： H01L33/50

CPC分类号： H01L33/647 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting unit, first and second conductive members, an insulating layer, a sealing member, and an optical layer. The light emitting unit includes a semiconductor stacked body and first and second electrodes. The semiconductor stacked body includes first and second semiconductor layers and a light emitting layer, and has a major surface on a second semiconductor layer side. The first and second electrodes are connected to the first and second semiconductor layers on the major surface side, respectively. The first conductive member is connected to the first electrode and includes a first columnar portion covering a portion of the second semiconductor. The insulating layer is provided between the first columnar portion and the portion of the second semiconductor. The sealing member covers side surfaces of the conductive members. The optical layer is provided on the other major surface.

摘要翻译： 根据一个实施例，半导体发光器件包括发光单元，第一和第二导电构件，绝缘层，密封构件和光学层。 发光单元包括半导体层叠体和第一和第二电极。 半导体层叠体包括第一和第二半导体层和发光层，并且在第二半导体层侧具有主表面。 第一和第二电极分别连接到主表面侧的第一和第二半导体层。 第一导电构件连接到第一电极并且包括覆盖第二半导体的一部分的第一柱状部分。 绝缘层设置在第一柱状部分和第二半导体的部分之间。 密封构件覆盖导电构件的侧表面。 光学层设置在另一个主表面上。

公开(公告)号：US08987762B2

公开(公告)日：2015-03-24

申请号：US13607480

申请日：2012-09-07

申请人： Toshiya Nakayama ,  Kazuhito Higuchi ,  Hiroshi Koizumi ,  Hideo Nishiuchi ,  Susumu Obata ,  Akiya Kimura ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

发明人： Toshiya Nakayama ,  Kazuhito Higuchi ,  Hiroshi Koizumi ,  Hideo Nishiuchi ,  Susumu Obata ,  Akiya Kimura ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

IPC分类号： H01L33/50 ,  H01L33/56 ,  H01L33/54

CPC分类号： H01L33/56 ,  H01L27/15 ,  H01L33/502 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L2933/0041

摘要： According to one embodiment, a light-emitting unit which emits light, a wavelength conversion unit which includes a phosphor and which is provided on a main surface of the light-emitting unit, and a transparent resin which is provided on top of the wavelength conversion unit, are prepared. The transparent resin has a greater modulus of elasticity and/or a higher Shore hardness than the wavelength conversion unit.

摘要翻译： 根据一个实施例，发射光的发光单元，包括荧光体并设置在发光单元的主表面上的波长转换单元和设置在波长转换器顶部的透明树脂 单位，准备。 透明树脂具有比波长转换单元更大的弹性模量和/或更高的肖氏硬度。