公开(公告)号：US07042072B1

公开(公告)日：2006-05-09

申请号：US10212496

申请日：2002-08-02

申请人： Young Ho Kim ,  Seok Hyun Choi ,  Choon Heung Lee ,  Sung Su Park ,  Sung Soon Park

发明人： Young Ho Kim ,  Seok Hyun Choi ,  Choon Heung Lee ,  Sung Su Park ,  Sung Soon Park

IPC分类号： H01L23/02 ,  H01L21/44

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and method of producing the same has a semiconductor die having a first face and a second face. A coating material is coupled to the second face of the semiconductor die. A substrate having a cavity is provided wherein the semiconductor die is placed within the cavity. An encapsulant is used to encapsulate the second face of the semiconductor die placed in the cavity. Connection members are provided to couple the semiconductor die and the substrate in order to transfer signals between the semiconductor die and the substrate. Terminal members are couple to the substrate to connect the semiconductor package to an external device. In the semiconductor package, a thermal expansion coefficient of the coating material C and a thermal expansion coefficient of the encapsulant E should be approximately equal in value in order to limit the problems associated with warpage.

摘要翻译： 半导体封装及其制造方法具有具有第一面和第二面的半导体管芯。 涂层材料耦合到半导体管芯的第二面。 提供具有空腔的衬底，其中半导体管芯被放置在空腔内。 密封剂用于封装放置在空腔中的半导体管芯的第二面。 提供连接构件以耦合半导体管芯和衬底，以便在半导体管芯和衬底之间传输信号。 端子构件耦合到衬底以将半导体封装连接到外部设备。 在半导体封装中，为了限制与翘曲相关的问题，涂层材料C的热膨胀系数和密封剂E的热膨胀系数的值应近似相等。

公开(公告)号：US06936922B1

公开(公告)日：2005-08-30

申请号：US10672886

申请日：2003-09-26

申请人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

发明人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

IPC分类号： H01L23/16 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K3/3436 ,  H01L23/16 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09736 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electrical substrate useful for semiconductor packages is disclosed. The electrical substrate includes a core insulative layer. A first surface of the insulative layer has circuit patterns thereon. Some of the circuit patterns are stepped in their heights from the first surface, in that a first subportion of the circuit pattern, including a ball land, extends further from the first surface than a second subportion of the same circuit pattern, and also extends further from the first surface than a ball land of other circuit patterns. Accordingly, solder balls fused to the ball lands of the stepped circuit patterns extend further from the first surface than same-size solder balls fused to the ball lands of the non-stepped circuit patterns, thereby circumventing electrical connectivity problems that may arise from warpage of the electrical substrate.

摘要翻译： 公开了一种可用于半导体封装的电气基板。 电气基板包括芯绝缘层。 绝缘层的第一表面具有电路图案。 电路图案中的一些从第一表面上升到它们的高度，因为电路图形的第一子部分（包括球形区域）比第一表面的第一子部分比相同电路图案的第二子部分进一步延伸，并且还进一步延伸 从第一个表面比其他电路图案的球场。 因此，熔融到阶梯式电路图案的球台的焊球比与非阶梯式电路图案的球面熔合的相同尺寸的焊球相比，从第一表面延伸出来，从而避免了由于翘曲引起的电连接问题 电气基板。

公开(公告)号：US06833619B1

公开(公告)日：2004-12-21

申请号：US10425134

申请日：2003-04-28

申请人： Sang Jae Jang ,  Sun Goo Lee ,  Sung Su Park ,  Sung Soon Park

发明人： Sang Jae Jang ,  Sun Goo Lee ,  Sung Su Park ,  Sung Soon Park

IPC分类号： H01L2334

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has a substrate comprising a resin layer of an approximate planar plate, a cavity passing through the resin layer vertically at a center area thereof, a plurality of electrically conductive patterns formed at a bottom surface of the resin layer, and a conductive plan. An adhesive layer of a predetermined thickness is formed at an upper part of an inside of the cavity. A semiconductor die is positioned inside the cavity of the substrate and has a plurality of bond pads formed at a bottom surface thereof, a bottom surface of the adhesive layer being bonded to a top surface thereof. A plurality of conductive wires for electrically connecting the bond pads of the semiconductor die to the electrically conductive patterns are formed at a bottom surface of the substrate. An encapsulant is used for covering the semiconductor die formed at the lower part of the adhesive layer, the conductive wires and the cavity. A plurality of solder balls are fused to the electrically conductive patterns, which is formed at the bottom surface of the substrate.

摘要翻译： 半导体封装具有包括近似平板的树脂层，在其中心区域垂直穿过树脂层的空腔，形成在树脂层的底面的多个导电图案的基板，以及导电图 。 在空腔的内部的上部形成预定厚度的粘合剂层。 半导体管芯位于衬底的腔内部，并且在其底表面上形成有多个接合焊盘，粘合剂层的底表面粘合到其顶表面。 在基板的底面形成有用于将半导体管芯的接合焊盘电连接到导电图案的多个导线。 密封剂用于覆盖形成在粘合剂层的下部，导电线和空腔的半导体管芯。 多个焊球与形成在基板的底面的导电图案熔合。

公开(公告)号：US07091571B1

公开(公告)日：2006-08-15

申请号：US10735184

申请日：2003-12-11

申请人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

发明人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

IPC分类号： H01L31/0232 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H05K1/189 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed is an image sensor package and a method for manufacturing the same. The image sensor package comprises an image sensor die, a substrate, a support wall having screw threads on the outer peripheral surface thereof and a mount into which a barrel including a plurality of lenses and an infrared blocking glass is mounted. The screw threads formed on the outer peripheral surface of the support wall are engaged with those formed on the inner peripheral surface of the mount. At least one passive element is provided on the substrate at the outer peripheral side of the support wall, thereby increasing the packaging density of the image sensor package.

摘要翻译： 公开了一种图像传感器封装及其制造方法。 图像传感器封装包括图像传感器芯片，基板，在其外周表面上具有螺纹的支撑壁和安装有安装有多个透镜和红外阻挡玻璃的镜筒的安装件。 形成在支撑壁的外周面上的螺纹与安装件的内周面上形成的螺纹接合。 在支撑壁的外周侧的基板上设置至少一个无源元件，从而增加图像传感器封装的封装密度。