摘要:
Pressure sensitive adhesive articles and methods, particularly stretch removable adhesive articles that are preferably for use in adhering to skin or like delicate surfaces. Preferably, stretch removability of the article occurs as a result of the selection of a stretch removable pressure sensitive adhesive. In one embodiment of the articles and methods, the adhesive and backing delaminate upon removal. In another embodiment of the articles and methods, the backing includes a predefined tab located in a central location of the backing.
摘要:
A light managing screen may provide a rear projection screen, front projection screen or component thereof. The screen may comprise a polymeric composition including a first polymeric material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically.
摘要:
This invention is directed to a reinforced adhesive fiber that includes a pressure sensitive adhesive component and a reinforcing material within the pressure sensitive adhesive component.
摘要:
A light managing screen may provide a rear projection screen, front projection screen or component thereof. The screen may comprise a polymeric composition including a first polymeric material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically.
摘要:
This invention is directed to a fiber reinforced adhesive composition comprising a pressure sensitive adhesive matrix and a fibrous reinforcing material within the pressure sensitive adhesive matrix. The adhesive composition has a yield strength and a tensile strength. The tensile strength is at least about 150% of the yield strength. Generally, the adhesive composition exhibits these properties at least 50% elongation when measured according to ASTM D 882-97 at a crosshead speed of 12 inches/minute (30 centimeters/minute).
摘要翻译:本发明涉及一种纤维增强粘合剂组合物,其包含压敏粘合剂基质和压敏粘合剂基质内的纤维增强材料。 粘合剂组合物具有屈服强度和拉伸强度。 拉伸强度至少为屈服强度的约150%。 通常,粘合剂组合物根据ASTM D 882-97以12英寸/分钟(30厘米/分钟)的十字头速度测量时,显示出至少50%伸长率的这些性能。
摘要:
A light managing screen may provide a rear projection screen, front projection screen or component thereof. The screen may comprise a polymeric composition including a first polymeric material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically.
摘要:
A polymeric composition includes a first polymeric material, for example, an adhesive material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure has a major axis and the major axes are substantially aligned. The first polymeric material has an index of refraction that differs by at least 0.01 from an index of refraction of the second polymeric material. In some instances, a pressure sensitive adhesive material is selected as the first polymeric material. The orientation of the elongated structures and the difference in indices of refraction results in the polymeric composition scattering light asymmetrically. The polymeric composition is optionally disposed on a substrate and can be used, for example, to extract light from a light guide or to asymmetrically alter the viewing angle of a display.
摘要:
An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent being present in the mixture. The mixture is mixed at a temperature from about 130° C. to about 200° C. and sufficiently to form an iodine/iodide-containing hot melt coatable adhesive. Alternatively, the iodide may be generated in situ. The adhesive so prepared may be packaged for coating on a substrate at a later time, or may be immediately coated to form an adhesive composite. Adhesive composites, particularly surgical incise drapes, are provided incorporating this hot melt coatable adhesive.
摘要:
A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and precoated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
摘要:
Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.