-
公开(公告)号：US5104023A
公开(公告)日：1992-04-14
申请号：US681670
申请日：1991-04-08
IPC分类号： B28D5/00
CPC分类号： B28D5/0023 , B28D5/0052 , Y10T225/304 , Y10T225/325 , Y10T225/371 , Y10T225/386
摘要： An apparatus for making a semiconductor device comprises a flexible mat, support shafts for supporting the flexible mat in a substantially horizontal position, a pressing plate having a generally convex body and supported for movement up and down, and a drive mechanism for driving one of the pressing plate and the wafer relative to the other of the pressing plate and the wafer so as to move up and down. The wafer having the first and second surfaces opposite to each other with the chips formed on the first surface thereof is placed on the mat with the chips confronting the flexible mat. The convex body of the pressing plate is pressed against the second surface of the wafer to separate the chips on the wafer individually.
-
公开(公告)号：US4844325A
公开(公告)日：1989-07-04
申请号：US168968
申请日：1988-03-16
IPC分类号： H01L21/52 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67144 , H01L24/75 , H01L2224/83075 , H01L2224/83192 , H01L2924/01322 , H01L2924/10253
摘要： A process of die-bonding a semiconductor chip. The semiconductor chip is sucked by a collet and fixed on a preform which is formed on a die pad. A load is applied to the chip and a gas is blown around the semiconductor chip. so as to flatten any of the preform that has gone beyond the interface between the chip and die pad. The entire assembly is heated thereby curing the preform. In a preferred embodiment the semiconductor chip is sucked with the collet via a vacuum pump and an inert gas is blown around the semiconductor chip.
-
3.发明授权
公开(公告)号：US5157479A
公开(公告)日：1992-10-20
申请号：US536079
申请日：1990-06-08
IPC分类号： H01L21/60 , H01L23/14 , H01L23/36 , H01L23/498
CPC分类号： H01L23/147 , H01L23/36 , H01L23/498 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48464 , H01L2224/49171 , H01L2224/49175 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/01019 , H01L2924/10329 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15173 , H01L2924/19041 , H01L2924/3011 , H01L2924/30111
摘要： A silicon substrate having a thin film circuit layer formed on the surface of the substrate is laid on a metallic base and a semiconductor chip made of compound semiconductor such as gallium arsenide is disposed in a hole defined in the central portion of the silicon substrate so that the semiconductor chip can be directly fixed to the metallic base for dissipating the heat of the semiconductor chip. The connecting terminals of the semiconductor chip are connected to thin film circuit layer formed on the surface of the silicon substrate through wires. The heat generated in the semiconductor chip can be transmitted to the metallic base so that the heat is effectively dissipated.
-
公开(公告)号：US5035087A
公开(公告)日：1991-07-30
申请号：US129487
申请日：1987-12-07
摘要： A surface grinding machine comprises a wheel head vertically movably supported; a cup-shaped diamond wheel supported by a rotatable wheel shaft at one end of the wheel head and having an abrasive grain layer of Young's modulus (10-15).times.10.sup.4 kgf/cm.sup.2 at the lower end of the wheel; a wheel shaft driving motor for rotating the cup-shaped diamond wheel supported by the wheel head; a servomotor for vertically moving the wheel head; a suitable number of chuck tables for fixing the surface of a III-V group compound semiconductor wafer on which elements have been fabricated; an index table for rotatably supporting the chuck tables; a chuck table driving motor for turning the chuck tables; a main shaft motor current analysis circuit for detecting the current value of the wheel shaft driving motor; a main shaft rotation number analysis circuit for detecting the number of rotations of the wheel shaft driving motor, and a feed speed control circuit for controlling the serevomotor in such a manner as to decrease the feed speed when the grinding resistance is greater than a predetermined resistance value, and increase the feed speed when the grinding resistance is smaller than the predetermined resistance value.
-
公开(公告)号：US4904012A
公开(公告)日：1990-02-27
申请号：US293614
申请日：1989-01-05
IPC分类号： B25B11/00 , H01L21/677 , H01L21/68 , H01L21/683 , B25J15/06
CPC分类号： H01L21/6838 , Y10T29/53191
摘要： Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.
摘要翻译： 用于处理半导体晶片的抽吸装置包括处理部分，该处理部分具有在与晶片表面相同的平面内开口并且位于比晶片表面小的区域内的多个吸入口;压力降低装置， 抽吸口，当手指被释放时，开口用于释放由减压装置产生的负压，以及一体地联接到处理部的手柄。
-
公开(公告)号：US08952367B2
公开(公告)日：2015-02-10
申请号：US13881586
申请日：2011-10-31
IPC分类号： H01L51/00 , H01L51/40 , H01J1/63 , C08F2/46 , C07D335/16 , C07D409/04 , C07D409/10 , C07D409/14 , C09K11/06 , H05B33/10 , H01L51/50
CPC分类号： H01L51/0074 , C07D335/16 , C07D409/04 , C07D409/10 , C07D409/14 , C09K11/06 , C09K2211/1007 , C09K2211/1011 , C09K2211/1088 , C09K2211/1092 , H01L51/0058 , H01L51/0071 , H01L51/5016 , H01L51/5072 , H01L51/5096 , H05B33/10
摘要： Provided is an organic light emitting element having a high light emission efficiency and a low drive voltage. In the organic light emitting element including a positive electrode, a negative electrode and an organic compound layer disposed between the positive electrode and the negative electrode, the organic compound layer includes a thioxanthone compound represented by the following general formula [1].
摘要翻译： 提供了一种具有高发光效率和低驱动电压的有机发光元件。 在具有正极，负极和设置在正极和负极之间的有机化合物层的有机发光元件中，有机化合物层包括由以下通式[1]表示的噻吨酮化合物。
-
公开(公告)号：US20130001537A1
公开(公告)日：2013-01-03
申请号：US13583731
申请日：2011-03-14
申请人： Hajime Muta , Takeshi Sekiguchi , Ryuji Ishii , Koichi Suzuki
发明人： Hajime Muta , Takeshi Sekiguchi , Ryuji Ishii , Koichi Suzuki
IPC分类号： C07D403/04 , H01L27/32 , H01L51/54
CPC分类号： C07D403/04 , C09K11/06 , C09K2211/1029 , C09K2211/1044 , H01L51/0058 , H01L51/0072 , H01L51/0085 , H05B33/14
摘要： The present invention provides a novel organic compound that is chemically stable and can be used as a host material for phosphorescence emission.The present invention provides a benzimidazolyl carbazole compound shown by Formula [1] described in the description.
摘要翻译： 本发明提供化学稳定且可用作磷光发射的主体材料的新型有机化合物。 本发明提供了描述中描述的式[1]所示的苯并咪唑基咔唑化合物。
-
公开(公告)号：US20120261251A1
公开(公告)日：2012-10-18
申请号：US13531949
申请日：2012-06-25
申请人： Shinsuke FUJITA , Takeshi Sekiguchi
发明人： Shinsuke FUJITA , Takeshi Sekiguchi
IPC分类号： C10B33/08
摘要： A system for transporting red-hot coke including a non-rotary coke receiving car which travels on a first rail for receiving coke from at least one coke oven chamber; at least two rotary coke buckets, the at least two rotary coke buckets being mounted on a turntable, wherein the turntable is operable to orbit the at least two rotary coke buckets around its center, and the turntable travels along a second rail; one or two sets of discharge devices, each containing a discharge chute and a dust collector hood, which is operable to discharge the coke from the non-rotary coke receiving car to the at least two rotary coke buckets; and a hoist for hoisting and transporting the at least two rotary coke buckets to a coke dry quenching unit.
摘要翻译： 一种用于运输红热焦炭的系统，包括在第一轨道上运行的非旋转焦炭接收轿厢，用于从至少一个焦炉室接收焦炭; 至少两个旋转焦炭桶，所述至少两个旋转焦炭桶安装在转台上，其中所述转盘可操作以使所述至少两个旋转焦炭桶围绕其中心轨道，并且所述转盘沿着第二轨道行进; 一组或两组排放装置，每个排放装置包括排放槽和集尘罩，其可操作以将焦炭从非旋转焦炭接收轿厢排放到至少两个旋转焦炭桶中; 以及用于将至少两个旋转焦炭桶提升并运送到焦炭干燥淬火单元的提升机。
-
9.发明申请公开(公告)号：US20110168352A1
公开(公告)日：2011-07-14
申请号：US12996898
申请日：2009-06-09
IPC分类号： F28F9/00
CPC分类号： C22B1/26 , F27B21/02 , F27D15/02 , Y10T137/8593
摘要： An air supply apparatus includes a plurality of movable carriages arranged along a circular carriage path; a movable circular duct arranged along the carriage path and connected to each of the carriages through a connection air duct; a water sealing device including a circular water seal chamber arranged along the carriage path and a water sealing plate having a lower end part thereof sunk in sealing water in the circular water seal chamber; a stationary circular duct arranged along the carriage path and fitted into the movable circular duct through the water sealing device to be freely movable, wherein the movable circular duct and the stationary circular duct form a circular air path; and an atmospheric zone that stops leakage of air in the carriage being provided in a predetermined position of the carriage path, wherein an upper space of the circular water seal chamber on a circular air path side communicates with the circular air path on a movable circular duct side, the circular air path on the movable circular duct side communicates in a circumferential direction, and a connection air duct closing mechanism that closes the connection air duct is provided in the atmospheric zone.
摘要翻译： 空气供给装置包括沿圆形滑架路径布置的多个可移动滑架; 可移动的圆形管道，沿着所述滑架路径布置并通过连接空气管道连接到每个所述托架; 一个水封装置，包括一个沿着滑架路径布置的圆形水封室，一个水封板，其下端部分沉入环形水封室内的水中; 一个固定的圆形管道，沿着滑架路径布置，并通过水封装置装配到可移动的圆形管道中，以便可自由移动，其中可移动的圆形管道和固定的圆形管道形成一个圆形的空气通道; 以及大气区域，其阻止滑架中的空气泄漏设置在所述滑架路径的预定位置，所述圆形空气通道侧上的所述圆形水封室的上部空间与所述圆形空气路径在可移动的圆形管道 在可动圆形管道侧的圆形空气路径沿圆周方向连通，并且在大气区域中设置有关闭连接风道的连接风道关闭机构。
-
公开(公告)号：US5742480A
公开(公告)日：1998-04-21
申请号：US552351
申请日：1995-11-02
申请人： Sosaku Sawada , Ryoji Sakamoto , Hiromi Kurashima , Daisuke Takagi , Satoshi Ohe , Takeshi Sekiguchi , Nobuo Shiga
发明人： Sosaku Sawada , Ryoji Sakamoto , Hiromi Kurashima , Daisuke Takagi , Satoshi Ohe , Takeshi Sekiguchi , Nobuo Shiga
CPC分类号： H05K1/189 , G02B6/4274 , G02B6/4281 , G02B6/4283 , G02B6/4245 , G02B6/4269 , H05K1/0393 , H05K1/118 , H05K2201/10151 , H05K2201/1034 , H05K2201/10446 , H05K2201/10636 , H05K2201/10651 , H05K2201/10689 , H05K2201/2009 , H05K3/0058 , H05K3/306 , H05K3/3447 , Y02P70/611
摘要： It is an object of the present invention to provide a highly reliable optical module circuit board having a sufficient mechanical strength with respect to an external stress. An optical module circuit board according to the present invention includes a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers, wherein the flexible printed circuit includes a main body portion having the multilayered structure, a first surface mounted with an electronic component, and a second surface opposite to the first surface, a neck portion having the multilayered structure and extending from one end of the main body portion, and a head portion positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a bypass capacitor, Particularly, the neck portion defines the positional relationship between the main body portion and the head portion so as to give the circuit board a sufficient mechanical strength.
摘要翻译： 本发明的目的是提供一种具有足够的机械强度相对于外部应力的高度可靠的光学模块电路板。 根据本发明的光学模块电路板包括具有至少多层结构的柔性印刷电路，其中包含导电金属互连的层被夹在绝缘层之间，其中柔性印刷电路包括具有多层结构的主体部分 ，安装有电子部件的第一表面和与第一表面相对的第二表面，具有多层结构并从主体部分的一端延伸的颈部和位于颈部的远端的头部 具有多层结构的主体部分的一端延伸并安装有光操作元件和旁路电容器的部分，特别地，颈部限定主体部分和头部之间的位置关系，从而 给电路板提供足够的机械强度。
-
-
-
-
-
-
-
-
-
搜索结果
62 条记录 (耗时 0.024 秒)