公开(公告)号：US12129338B2

公开(公告)日：2024-10-29

申请号：US16957345

申请日：2019-04-09

申请人： LG CHEM, LTD.

发明人： Changbo Shim ,  Seunghyun Song ,  Hwayeon Moon ,  Hyunsung Min ,  Hee Yong Shim

IPC分类号： C08G73/12 ,  B32B5/26 ,  B32B7/027 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G59/56 ,  C08G59/68 ,  C08J5/24 ,  C08K3/36 ,  C08K5/5419 ,  C08K9/06 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  H01L23/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03

CPC分类号： C08G73/12 ,  B32B5/26 ,  B32B7/027 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G59/56 ,  C08G59/686 ,  C08J5/244 ,  C08J5/249 ,  C08K3/36 ,  C08K5/5419 ,  C08K9/06 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  H01L23/145 ,  H01L23/562 ,  H05K1/0271 ,  H05K1/0373 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/14 ,  C08J2363/00 ,  C08J2433/08 ,  C08J2479/08 ,  C08K2201/003 ,  C08K2201/014 ,  C08L2205/025 ,  C08L2205/035 ,  H05K2201/068

摘要： The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

公开(公告)号：US20240327638A1

公开(公告)日：2024-10-03

申请号：US18742294

申请日：2024-06-13

申请人： SOGANG UNIVERSITY RESEARCH & BUSINESS DEVELOPMENT FOUNDATION

发明人： Jong Suk LEE ,  Hyun Jung YU ,  Ju Ho SHIN ,  Heseong AN

IPC分类号： C08L79/08 ,  B01D53/22 ,  B01D67/00 ,  B01D71/64 ,  B01D71/70 ,  C08G73/10 ,  C08G77/26 ,  C08J5/18

CPC分类号： C08L79/08 ,  B01D53/228 ,  B01D67/0006 ,  B01D67/0083 ,  B01D71/64 ,  B01D71/70 ,  C08G73/1032 ,  C08G73/1042 ,  C08G73/1067 ,  C08G77/26 ,  C08J5/18 ,  B01D2323/08 ,  B01D2323/12 ,  B01D2323/30 ,  C08J2379/08 ,  C08J2483/08 ,  C08L2312/00

摘要： A hybrid crosslinked polymeric membrane and a process for fabricating the same are provided. Specifically, the hybrid crosslinked polymer membrane comprises a glassy polymer and a ladder-structured polysilsesquioxane and has a crosslinked structure. The hybrid crosslinked polymer membrane can have an excellent permeability of carbon dioxide by virtue of an increase in the free volume and enhanced plasticization resistance, chemical resistance, and durability.

公开(公告)号：US12096641B2

公开(公告)日：2024-09-17

申请号：US17337707

申请日：2021-06-03

申请人： Purdue Research Foundation

发明人： Jianguo Mei ,  Aristide Gumyusenge

IPC分类号： H01L51/05 ,  C08G73/10 ,  C08L79/08 ,  H10K10/46 ,  H10K85/10

CPC分类号： H10K10/471 ,  C08G73/1039 ,  C08L79/08 ,  H10K10/484 ,  H10K85/113

摘要： A transistor device that includes a substrate comprising metallic gate contacts, a dielectric layer on the substrate comprising a polyimide or derivative thereof, a semiconductor layer on the dielectric layer comprising a semiconducting polymer confined in a host matrix material comprising a polyimide or derivative thereof, and source and drain contacts on the semiconductor layer.

公开(公告)号：US12084545B2

公开(公告)日：2024-09-10

申请号：US17277366

申请日：2019-12-11

申请人： LG CHEM, LTD.

发明人： Kichul Koo ,  Kyunghwan Kim

IPC分类号： C08G73/10 ,  C07D209/48 ,  C07D401/14 ,  C07D403/10 ,  C07D403/14 ,  C08J5/18 ,  C08L79/08 ,  C09D179/08

CPC分类号： C08G73/1032 ,  C07D403/10 ,  C07D403/14 ,  C08J5/18 ,  C08J2379/08

摘要： The present invention discloses a novel diamine that has a structure bearing an intramolecular imide group and additionally an amide-substituted aromatic ring group at opposite sides of the imide group. The use of the novel diamine as a polymerization ingredient in polyimide production can provide a polyimide film which has remarkably improved mechanical and thermal properties while maintaining optical properties.

公开(公告)号：US12072653B2

公开(公告)日：2024-08-27

申请号：US17828301

申请日：2022-05-31

申请人： CANON KABUSHIKI KAISHA

发明人： Akeshi Asaka ,  Yuma Kobayashi ,  Taiki Watanabe

IPC分类号： G03G15/20 ,  B32B27/28 ,  C08L79/08 ,  C09D5/24 ,  C09D7/62 ,  C09D179/08

CPC分类号： G03G15/2057 ,  B32B27/281 ,  C08L79/08 ,  C09D5/24 ,  C09D7/62 ,  C09D179/08 ,  B32B2307/302 ,  B32B2433/00 ,  C08L79/08 ,  C08K3/041 ,  C08L81/06 ,  C08K9/08 ,  C08L79/08

摘要： Provided is an electrophotographic belt having an endless shape including a base layer, wherein the base layer includes a polyimide film containing polyimide serving as a binder resin and a carbon nanotube, wherein the polyimide has an imidization ratio of 80% or more, wherein the carbon nanotube has at least one resin selected from the group consisting of: polyphenylsulfone; polysulfone; and polyethersulfone present on at least part of a surface thereof. The base layer has a tensile strength of 200 MPa or more in each of a peripheral direction thereof and a direction perpendicular to the peripheral direction.

公开(公告)号：US12065543B2

公开(公告)日：2024-08-20

申请号：US15733816

申请日：2020-01-28

申请人： LG CHEM, LTD.

发明人： Kyunghwan Kim ,  Chan Hyo Park

IPC分类号： C08G73/10 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/1333

CPC分类号： C08G73/1067 ,  C08G73/1007 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1078 ,  C08G73/1082 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/133305 ,  C08J2379/08 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/20 ,  C09K2323/00 ,  C09K2323/027 ,  G02F2202/022

摘要： The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound having a specific structure and a diamine compound, thereby capable of ensuring excellent optical properties even under high temperature heat treatment conditions, and stably maintaining optical properties even during further heat treatment, a substrate for display device, and an optical device using the same.

公开(公告)号：US20240084137A1

公开(公告)日：2024-03-14

申请号：US18266040

申请日：2021-03-19

申请人： SHENGYI TECHNOLOGY CO., LTD.

发明人： Dongliang LIU ,  Qing WANG ,  Junqi TANG ,  Jinchao DONG

IPC分类号： C08L81/06 ,  C08K9/06 ,  C08L79/08

CPC分类号： C08L81/06 ,  C08K9/06 ,  C08L79/08 ,  C08K5/29

摘要： Resin composition, resin adhesive film, and application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or fracture, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.

公开(公告)号：US20240076452A1

公开(公告)日：2024-03-07

申请号：US18233482

申请日：2023-08-14

申请人： SK Innovation Co., Ltd.

发明人： Hye Jin Park ,  Cheol Min Yun

IPC分类号： C08G73/10 ,  C08L79/08 ,  E06B9/24 ,  G02F1/1333 ,  G02F1/153

CPC分类号： C08G73/1082 ,  C08L79/08 ,  E06B9/24 ,  G02F1/133305 ,  G02F1/153 ,  E06B2009/2464 ,  G02F2202/022

摘要： A polyimide composition includes a polyimide precursor or a polyimide that includes structural units derived from a first monomer including a diamine-based compound and structural units derived from a second monomer including a cardo group-containing dianhydride-based compound. The cardo group-containing dianhydride-based compound is included in a range from 12 mol % to 20 mol % based on a total number of moles of the second monomer.

公开(公告)号：US11866555B1

公开(公告)日：2024-01-09

申请号：US16543928

申请日：2019-08-19

申请人： Energy, United States Department of

发明人： David Hopkinson ,  Victor Armanda Kusuma ,  Surendar R. Venna ,  Joshua S. McNally ,  Christopher J. Orme ,  Frederick F. Stewart

IPC分类号： B01D53/22 ,  C08G79/025 ,  C08L85/02 ,  C08K5/37 ,  C08K5/548 ,  C09B47/04 ,  C08L81/06 ,  C08L71/08 ,  B01D53/14 ,  B01D71/58 ,  C08L79/08

CPC分类号： C08G79/025 ,  B01D53/1475 ,  B01D71/58 ,  C08K5/37 ,  C08K5/548 ,  C08L71/08 ,  C08L79/08 ,  C08L81/06 ,  C08L85/02 ,  C09B47/04 ,  B01D2256/24 ,  B01D2257/504 ,  C08L2312/00

摘要： The disclosed invention relates to a composition comprising a crosslinked blend of polyphosphazene polymers. The composition comprises a first polyphosphazene and a second polyphosphazene, where the first polyphosphazene and the second polyphosphazene being bound by a thiol bearing crosslinking agent. Such compositions are useful as a membrane material for the separation of gasses in a gaseous mixture.

公开(公告)号：US20230416466A1

公开(公告)日：2023-12-28

申请号：US18209737

申请日：2023-06-14

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Yoshihiro TSUTSUMI ,  Yuki KUDO ,  Tadaharu IKEDA ,  Hiroyuki IGUCHI ,  Atsushi TSUURA

IPC分类号： C08G73/10 ,  C08J5/24 ,  H05K1/03 ,  C08L79/08 ,  C09J179/08 ,  C09J7/35 ,  H01L23/29

CPC分类号： C08G73/1067 ,  C08G73/1021 ,  C08J5/244 ,  H05K1/0366 ,  C08L79/08 ,  C09J179/08 ,  C09J7/35 ,  H01L23/293

摘要： Provided is a resin composition capable of being turned into a cured product exhibiting excellent dielectric properties even at high frequencies and small changes in dielectric properties even after being left under a high temperature for a long period. The resin composition is a curable resin composition containing:



(A) a maleimide compound represented by the following general formula (1)










wherein D independently represents a dimer acid- and trimer acid-derived hydrocarbon group; B independently represents a cyclic structure-containing divalent hydrocarbon group other than a dimer acid- and trimer acid-derived hydrocarbon group; A independently represents a tetravalent organic group having a cyclic structure; m is 0 to 100, n is 0 to 100; and
(B) a catalyst,
wherein D in the formula (1) is a group in which dimer acid-derived hydrocarbon group occupies 95% by mass or more of the dimer acid- and trimer acid-derived hydrocarbon group, and is a hydrogenated group.