Semiconductor device package with isolated semiconductor die and electric field curtailment

    公开(公告)号:US11621215B1

    公开(公告)日:2023-04-04

    申请号:US17538841

    申请日:2021-11-30

    发明人: Enis Tuncer

    摘要: In a described example, an apparatus includes: a lead frame having a first portion and having a second portion electrically isolated from the first portion, the first portion having a side surface normal to a planar opposite surface, and having a recessed edge that is notched or chamfered and extending between the side surface and a planar device side surface; a spacer dielectric mounted to the planar device side surface and partially covered by the first portion, and extending beyond the first portion; a semiconductor die mounted to the spacer dielectric, the semiconductor die partially covered by the spacer dielectric and extending beyond the spacer dielectric; the second portion of the lead frame comprising leads coupled to the semiconductor die by electrical connections; and mold compound covering the semiconductor die, the electrical connections, the spacer dielectric, and partially covering the first portion and the second portion.

    MAGNETIC SENSOR
    6.
    发明申请

    公开(公告)号:US20230094395A1

    公开(公告)日:2023-03-30

    申请号:US17952362

    申请日:2022-09-26

    IPC分类号: G01R33/07 H01L43/04 H01L43/06

    摘要: A die pad, a signal processing IC, an adhesive layer, and at least one magnetoelectric conversion element included in a magnetic sensor are encapsulated by a molding resin. At least a part of the first end surface of the signal processing IC is positioned on a side closer to the at least one magnetoelectric conversion element than a first end surface of the die pad on a side of the at least one magnetoelectric conversion element in a plan view. An isolation portion into which the molding resin enters is provided between the first surface of the die pad on a side of the first end surface, and the first surface of the signal processing IC on a side of the first end surface, and a thickness of the isolation portion is smaller than a thickness of the die pad.

    ARTIFICIAL ANTIFERROMAGNETIC STRUCTURE AND STORAGE ELEMENT

    公开(公告)号:US20230010525A1

    公开(公告)日:2023-01-12

    申请号:US17488664

    申请日:2021-09-29

    IPC分类号: H01L43/04 H01L27/22 H01L43/06

    摘要: Disclosed are an artificial antiferromagnetic structure and a storage element. The artificial antiferromagnetic structure includes a first metal layer, an artificially synthesized antiferromagnetic layer and a second metal layer that are stacked in sequence, wherein there is an interfacial DM (Dzyaloshinskii-Moriya) interaction at an interface between the metal layer and the artificially synthesized antiferromagnetic layer, such that there is a first interfacial DM interaction between the first metal layer and the artificially synthesized antiferromagnetic layer, there is a second interfacial DM interaction between the second metal layer and the artificially synthesized antiferromagnetic layer, and the first interfacial DM interaction is different from the second interfacial DM interaction. The artificially synthesized antiferromagnetic layer forms a stable chiral Néel magnetic domain wall due to a strong interfacial DM interaction.