Abstract:
A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.
Abstract:
A trench gated MOSFET especially for operation in high radiation environments has a deep auxiliary trench located between the gate trenches. A boron implant is formed in the walls of the deep trench (in an N channel device); a thick oxide is formed in the bottom of the trench, and boron doped polysilicon which is connected to the source electrode fills the trench. The structure has reduced capacitance and improved resistance to single event rupture and single event breakdown and improved resistance to parasitic bipolar action.
Abstract:
A circuit for detecting faults in at least one converter in a converter system, the at least one converter including a switching stage having high- and low-side switches connected at a switching node and fault circuitry for managing a plurality of fault conditions. The circuit including a gate driver circuit connected to gate terminals of the high- and low-side switches for providing PWM signals to control the switching stage; a comparator circuit for comparing a voltage at the switching node to the input voltage and providing an output signal, the comparator circuit having output, positive and negative terminals; a fourth capacitor connected to the output terminal of the comparator circuit to generate an AC component of the comparator circuit output signal; and a rectifier circuit connected to the fourth capacitor for rectifying the AC component of the comparator circuit and providing a fault-indicating signal to the gate driver. The fault-indicating signal is used to drive the fault circuitry to correct a fault condition selected from the plurality of fault conditions in the converter system.
Abstract:
A merged gate transistor in accordance with an embodiment of the present invention includes a semiconductor element, a supply electrode electrically connected to a top surface of the semiconductor element, drain electrode electrically connected to the top surface of the semiconductor element and spaced laterally away from the supply electrode, a first gate positioned between the supply electrode and the drain electrode and capacitively coupled to the semiconductor element to form a first portion of the transistor and a second gate positioned adjacent to the first gate, and between the supply electrode and the drain electrode to form a second portion of the transistor, wherein the second gate is also capacitively coupled to the semiconductor element. The first gate is connected to an input voltage signal such that conduction of the first portion is based on a value of the input voltage signal and the second gate is connected to a predetermined constant voltage such that the second portion of the transistor conducts until a voltage difference between the predetermined constant voltage and a voltage at the source electrode reaches a predetermined level.
Abstract:
An apparatus and method for estimating rotor angle information for the control of permanent magnet AC motors having sinusoidal current excitation. The disclosed motor drive can provide full load operation at very low speeds including zero speed without the use of a shaft position sensing device. The rotor angle is estimated through injection of high frequency current, and rotor angle is extracted by a signal-conditioning algorithm, which utilizes current amplitude differential to discriminate the rotor angle. Rotor angle magnetic axis orientation (North or South pole) at startup is detected by comparing time average current ripple (at signal injection frequency) content between two different levels of d-axis current injection.
Abstract:
A circuit for using a high voltage gate driver IC (HVIC) for regulation of external floating voltage sources without use of regulation circuits. The circuit including high and low switches; at least one external voltage source coupled to the high and low switches; an HVIC having at least one internal charge pumping voltage source circuit, the HVIC being coupled to gate terminals of the high and low switches; and at least one charge pumping capacitor coupled to the at least one internal charge pumping voltage source circuit for regulating the external voltage of at least one external voltage source.
Abstract:
A power semiconductor package that includes at least two semiconductor devices electrically coupled to one another through a common metallic web.
Abstract:
A fabrication process for a trench Schottky diode with differential oxide thickness within the trenches includes forming a first nitride layer on a substrate surface and subsequently forming a plurality of trenches in the substrate including, possibly, a termination trench. Following a sacrificial oxide layer formation and removal, sidewall and bottom surfaces of the trenches are oxidized. A second nitride layer is then applied to the substrate and etched such that the second nitride layer covers the oxide layer on the trench sidewalls but exposes the oxide layer on the trench bottom surfaces. The trench bottom surfaces are then re-oxidized and the remaining second nitride layer then removed from the sidewalls, resulting in an oxide layer of varying thickness being formed on the sidewall and bottom surfaces of each trench. The trenches are then filled with a P type polysilicon, the first nitride layer removed, and a Schottky barrier metal applied to the substrate surface.
Abstract:
A III-nitride heterojunction semiconductor device that includes a power electrode that is electrically connected to a conductive substrate through a trench in the heterojunction thereof.
Abstract:
A PDP sustain driver circuit including at least one high voltage gate driver IC (HVIC) having internal logic functions. The PDP sustain driver circuit including a plurality of switches, the HVIC providing a unique control signal to at least one first and at least one second switch. The internal logic functions including a sensing circuit for sensing information about the at least one second switch; and a reporting circuit for reporting or displaying a signal indicating at least one of a plurality of failure modes of the at least one second switch.