公开(公告)号：WO2007058854A3

公开(公告)日：2009-05-07

申请号：PCT/US2006043520

申请日：2006-11-10

Applicant: INT RECTIFIER CORP ,  PAVIER MARK ,  SAWLE ANDREW M ,  STANDING MARTIN

Inventor： PAVIER MARK ,  SAWLE ANDREW M ,  STANDING MARTIN

IPC: H01L23/495 ,  H01L23/053 ,  H01L23/12 ,  H01L23/22 ,  H01L23/24 ,  H01L23/28 ,  H01L23/29

CPC classification number: H01L23/043 ,  H01L21/56 ,  H01L23/142 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/37 ,  H01L24/83 ,  H01L24/97 ,  H01L25/07 ,  H01L2224/0346 ,  H01L2224/0508 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/73153 ,  H01L2224/73267 ,  H01L2224/83815 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/40252 ,  H01L2924/403 ,  H01L2924/40407 ,  H01L2224/82

Abstract: A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.

Abstract translation: 一种半导体封装，其包括半导体管芯，管芯周围的绝缘体，以及耦合到管芯的电极的一致的导电焊盘。

公开(公告)号：WO2005041266A2

公开(公告)日：2005-05-06

申请号：PCT/US2004035308

申请日：2004-10-25

Applicant: INT RECTIFIER CORP ,  STANDING MARTIN

Inventor： STANDING MARTIN

IPC: H01L20060101 ,  H01L21/44 ,  H01L21/60 ,  H01L23/02 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L

CPC classification number: H01L24/13 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/268 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01L21/4867 ,  H01L21/56 ,  H01L23/04 ,  H01L23/13 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/49883 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1181 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/81205 ,  H01L2224/83205 ,  H01L2224/05599

Abstract: A semiconductor package which includes a conductive can, a semiconductor die received in the interior of the can and connected to an interior portion thereof at one of its sides, at least one interconnect structure formed on the other side of the semiconductor die, and a passivation layer disposed on the other side of the semiconductor die around the interconnect structure and extending at least to the can.

Abstract translation: 一种半导体封装，其包括导电罐，半导体管芯容纳在罐的内部并连接到其一侧的内部，形成在半导体管芯的另一侧上的至少一个互连结构以及钝化层 层，设置在半导体管芯的另一侧，并且至少延伸至罐。

公开(公告)号：WO2008106187A1

公开(公告)日：2008-09-04

申请号：PCT/US2008/002627

申请日：2008-02-27

Applicant: INTERNATIONAL RECTIFIER CORPORATION ,  STANDING, Martin

Inventor： STANDING, Martin

IPC: H01L23/48 ,  H01L23/02

CPC classification number: H01L23/49503 ,  H01L23/492 ,  H01L23/49506 ,  H01L23/49517 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/31 ,  H01L24/32 ,  H01L24/37 ,  H01L24/39 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/115 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor package that includes a substrate having a metallic back plate, an insulation body and plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to package using a conductive adhesive.

Abstract translation: 一种半导体封装，其包括具有金属背板，绝缘体和绝缘体上的多个导电焊盘的基板以及耦合到所述导电焊盘的半导体管芯，所述导电焊盘包括被直接连接到封装外部的焊盘的区域 使用导电胶。

公开(公告)号：WO2005119766A3

公开(公告)日：2007-04-19

申请号：PCT/US2005018932

申请日：2005-05-27

Applicant: INT RECTIFIER CORP ,  STANDING MARTIN ,  SAWLE ANDREW ,  JONES DAVID P ,  CARROLL MARTIN ,  ELWIN MATTHEW

Inventor： STANDING MARTIN ,  SAWLE ANDREW ,  JONES DAVID P ,  CARROLL MARTIN ,  ELWIN MATTHEW

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/485 ,  H01L23/492 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/10 ,  H01L23/3171 ,  H01L23/492 ,  H01L24/13 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device which includes a power electrode (12) on a surface thereof, a solderable body (16) on the power electrode and a passivation body (18) spaced from but surrounding the solderable body.

Abstract translation: 一种半导体器件，其包括在其表面上的功率电极（12），在所述电源电极上的可焊接体（16）和与所述可焊接体相隔开但包围的钝化体（18）。

公开(公告)号：WO2006113932A2

公开(公告)日：2006-10-26

申请号：PCT/US2006/015330

申请日：2006-04-20

Applicant: INTERNATIONAL RECTIFIER CORPORATION ,  STANDING, Martin ,  CLARKE, Robert, J.

Inventor： STANDING, Martin ,  CLARKE, Robert, J.

IPC: H01L21/00

CPC classification number: H01L21/50 ,  H01L23/10 ,  H01L23/492 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.

Abstract translation: 一种制造半导体封装的方法，包括在导电罐内部形成框架，所述框架由液体焊料不可控制。

公开(公告)号：WO2005041266A3

公开(公告)日：2005-05-06

申请号：PCT/US2004/035308

申请日：2004-10-25

Applicant: INTERNATIONAL RECTIFIER CORPORATION ,  STANDING, Martin

Inventor： STANDING, Martin

IPC: H01L23/48

Abstract: A semiconductor package which includes a conductive can (48), a semiconductor die (40) received in the interior of the can and connected to an interior portion thereof at one of its sides, at least one interconnect structure (19') formed on the other side of the semiconductor die, and a passivation layer (50) disposed on the other side of the semiconductor die around the interconnect structure and extending at least to the can.

公开(公告)号：WO2005041265A2

公开(公告)日：2005-05-06

申请号：PCT/US2004/035307

申请日：2004-10-25

Applicant: INTERNATIONAL RECTIFIER CORPORATION ,  STANDING, Martin

Inventor： STANDING, Martin

IPC: H01L

CPC classification number: H01B1/02 ,  H01L2224/73153 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/3484 ,  H05K2201/0215 ,  H01L2924/00

Abstract: A paste for forming an interconnect includes a mixture of binder particles, filler particles and flux material, binder particles having a melting temperature that is lower than that of the filler particles, and the proportion of the binder particles and the filler particles being selected such when heat is applied to melt the binder particles the shape of the paste as deposited is substantially retained thereby allowing for the paste to be used for forming interconnect structures.

Abstract translation: 用于形成互连的糊料包括粘合剂颗粒，填料颗粒和助焊剂材料的混合物，熔融温度低于填料颗粒的熔融温度的粘合剂颗粒，以及粘合剂颗粒和填料颗粒的比例等于 施加热量以熔化粘合剂颗粒，沉积的糊料的形状基本保持，从而允许将糊料用于形成互连结构。

公开(公告)号：WO2007109133B1

公开(公告)日：2008-07-31

申请号：PCT/US2007006633

申请日：2007-03-16

Applicant: INT RECTIFIER CORP ,  STANDING MARTIN

Inventor： STANDING MARTIN

IPC: H01L23/02

CPC classification number: H01L23/13 ,  H01L23/492 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A power semiconductor package that includes a die having one electrode thereof electrically and mechanically attached to a web portion of a conductive clip.

Abstract translation: 一种功率半导体封装，其包括具有一个电极的芯片，其电极和机械地附接到导电夹子的腹板部分。

公开(公告)号：WO2006096639A3

公开(公告)日：2008-05-02

申请号：PCT/US2006007915

申请日：2006-03-06

Applicant: INT RECTIFIER CORP ,  STANDING MARTIN ,  PAVIER MARK ,  CLARKE ROBERT J ,  SAWLE ANDREW ,  MCCARTNEY KENNETH

Inventor： STANDING MARTIN ,  PAVIER MARK ,  CLARKE ROBERT J ,  SAWLE ANDREW ,  MCCARTNEY KENNETH

IPC: H01L21/50 ,  H01L21/20 ,  H01L21/31

CPC classification number: H01L21/4825 ,  H01L21/4867 ,  H01L23/544 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/40 ,  H01L24/743 ,  H01L24/83 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0266 ,  H05K3/1241 ,  H05K3/245 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099

Abstract: A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package (32) or multi-chip module

Abstract translation: 一种半导体封装制造方法，其中使用按需存放材料的按需分散沉积来制备半导体封装（32）或多芯片模块（32）的一个部件或多个部件

公开(公告)号：WO2007109133A3

公开(公告)日：2007-09-27

申请号：PCT/US2007/006633

申请日：2007-03-16

Applicant: INTERNATIONAL RECTIFIER CORPORATION ,  STANDING, Martin

Inventor： STANDING, Martin

IPC: H01L23/02

Abstract: A power semiconductor package that includes a die having one electrode thereof electrically and mechanically attached to a web portion of a conductive clip.