公开(公告)号：WO2013009637A2

公开(公告)日：2013-01-17

申请号：PCT/US2012045806

申请日：2012-07-06

申请人： SKYWORKS SOLUTIONS INC ,  AGARWAL ANIL K ,  VU HOANG DINHPHUOC ,  CHEN HOWARD E ,  LOBIANCO ANTHONY JAMES ,  READ MATTHEW SEAN ,  NGUYEN HOANG MONG ,  ZHANG GUOHAO

发明人： AGARWAL ANIL K ,  VU HOANG DINHPHUOC ,  CHEN HOWARD E ,  LOBIANCO ANTHONY JAMES ,  READ MATTHEW SEAN ,  NGUYEN HOANG MONG ,  ZHANG GUOHAO

IPC分类号： H04B1/00 ,  H05K9/00

CPC分类号： H05K9/0064 ,  H01L23/552 ,  H01L2224/48227 ,  H01L2924/1421 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H04B1/3838 ,  H05K3/30 ,  H05K9/0028 ,  Y10T29/4913 ,  H01L2924/00

摘要： Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding- wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.

摘要翻译： 公开了与RF模块的射频（RF）屏蔽相关的设备和方法。 在一些实施例中，调谐屏蔽可以通过利用屏蔽 - 引线键合的不同结构和/或布置来增加需要区域的屏蔽并且在不需要的地方减少屏蔽来实现。 通过测量具有给定设计的模块的不同位置处的RF功率电平可以获得屏蔽要求的这种调整。 这种调谐的RF屏蔽配置可以提高屏蔽的整体有效性，并且还可以实现更具成本效益。

公开(公告)号：WO2009048861A3

公开(公告)日：2009-04-16

申请号：PCT/US2008/079033

申请日：2008-10-07

申请人： SKYWORKS SOLUTIONS, INC. ,  GAN, Qing ,  LOBIANCO, Anthony, L.

发明人： GAN, Qing ,  LOBIANCO, Anthony, L.

IPC分类号： H01L23/12

摘要： A through via is constructed in a two-stage process. A void in a portion of the depth of the substrate is filled from a first surface of the semiconductor substrate creating an enclosed volume within the substrate. Thereafter, the enclosed volume is exposed and the remaining portion of the void is filled.

公开(公告)号：WO2008018959A3

公开(公告)日：2008-04-03

申请号：PCT/US2007015284

申请日：2007-07-09

申请人： SKYWORKS SOLUTIONS INC ,  HOANG DINHPHUOC V ,  NOLL THOMAS E ,  AGARWAL ANIL K ,  WARREN ROBERT W ,  READ MATTHEW S ,  LOBIANCO ANTHONY

发明人： HOANG DINHPHUOC V ,  NOLL THOMAS E ,  AGARWAL ANIL K ,  WARREN ROBERT W ,  READ MATTHEW S ,  LOBIANCO ANTHONY

IPC分类号： H01L23/60 ,  H01L23/31 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package (100, 300) includes a component (102, 302) situated on a substrate (114, 314). The overmolded package further includes an overmold (116, 316) situated over the component and the substrate. The overmolded package further includes a wirebond cage (106, 306) situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds (110a, 110b, 310a, 310b). The wirebond cage forms an EM1 shield around the component. According to this exemplary embodiment, the overmolded package hrther includes a conductive layer (108, 308) situated on a top surface (118, 318) of the overmold and connected to the wirebond cage, where the conductive layer forms an EM 1 shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的封装（100,300）包括位于衬底（114,314）上的部件（102,302）。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型（116,316）。 包覆成型的包装还包括位于衬底上方和包覆模制体中的引线键合框架（106,306），其中引线键合框围绕组件，并且其中引线键合框架包括多个引线键（110a，110b，310a，310b）。 引线键盘在组件周围形成EM1屏蔽。 根据该示例性实施例，包覆成型的封装件还包括位于包覆模制体的顶表面（118,318）上并连接到引线键合框架的导电层（108,308），其中导电层在其上形成EM1屏蔽 零件。

公开(公告)号：WO2008018959A2

公开(公告)日：2008-02-14

申请号：PCT/US2007/015284

申请日：2007-07-09

申请人： SKYWORKS SOLUTIONS, INC. ,  HOANG, Dinhphuoc, V. ,  NOLL, Thomas, E. ,  AGARWAL, Anil, K. ,  WARREN, Robert, W. ,  READ, Matthew, S. ,  LOBIANCO, Anthony

发明人： HOANG, Dinhphuoc, V. ,  NOLL, Thomas, E. ,  AGARWAL, Anil, K. ,  WARREN, Robert, W. ,  READ, Matthew, S. ,  LOBIANCO, Anthony

IPC分类号： H01L23/49

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package (100,300) includes a component (102,302) situated on a substrate (114,314). The overmolded package further includes an overmold ( 116,316) situated over the component and the substrate. The overmolded package further includes a wirebond cage (106,306) situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds (110a,l 10b,310a,310b). The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer (108,308) situated on a top surface (118,318) of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的封装（100,300）包括位于衬底（114,314）上的部件（102,302）。 包覆成型的包装进一步包括位于组件和衬底之上的包覆模制（116,316）。 包覆成型的封装还包括位于衬底上方和覆盖模制体中的引线键合笼（106,306），其中引线键合框围绕组件，并且其中引线键合框架包括多个引线键（110a，10b，310a，310b）。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面（118,318）上并连接到引线键合框架的导电层（108,308），其中导电层在部件上形成EMI屏蔽。

公开(公告)号：WO2009067299A1

公开(公告)日：2009-05-28

申请号：PCT/US2008/079336

申请日：2008-10-09

申请人： SKYWORKS SOLUTIONS, INC. ,  KIM, Patrick ,  KUHLMAN, Mark, A. ,  GUO, Yifan ,  LOBIANCO, Anthony ,  WARREN, Robert, W.

发明人： KIM, Patrick ,  KUHLMAN, Mark, A. ,  GUO, Yifan ,  LOBIANCO, Anthony ,  WARREN, Robert, W.

IPC分类号： H01L21/60

CPC分类号： H01L23/49811 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead- free solder is used.

摘要翻译： 具有几何形状和结构的半导体封装中的衬底焊盘，其有助于提供具有增强的结构完整性和抗机械冲击的焊盘的焊接接头。 焊盘可以包括电镀金属螺柱，其将焊料锚定到焊盘接口，提供更柔顺的焊接接头，即使当使用无铅焊料时。

公开(公告)号：WO2009048861A2

公开(公告)日：2009-04-16

申请号：PCT/US2008079033

申请日：2008-10-07

申请人： SKYWORKS SOLUTIONS INC ,  GAN QING ,  LOBIANCO ANTHONY L

发明人： GAN QING ,  LOBIANCO ANTHONY L

IPC分类号： H01L23/12

CPC分类号： H01L21/486 ,  B81B2207/07 ,  B81B2207/095 ,  B81C1/00095 ,  B81C1/00301 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/00

摘要： A through via is constructed in a two-stage process. A void in a portion of the depth of the substrate is filled from a first surface of the semiconductor substrate creating an enclosed volume within the substrate. Thereafter, the enclosed volume is exposed and the remaining portion of the void is filled.

摘要翻译： A通孔在两级过程中构建。 在半导体衬底的第一表面上填充衬底的深度的一部分中的空隙，从而在衬底内产生封闭的体积。 此后，封闭的体积被暴露，空隙的剩余部分被填充。

公开(公告)号：WO2006101768A3

公开(公告)日：2006-09-28

申请号：PCT/US2006/008539

申请日：2006-03-09

申请人： SKYWORKS SOLUTIONS, INC. ,  GAN, Qing ,  LOBIANCO, Anthony, J. ,  WARREN, Robert, W.

发明人： GAN, Qing ,  LOBIANCO, Anthony, J. ,  WARREN, Robert, W.

IPC分类号： H01L21/44

摘要： According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.

公开(公告)号：WO2006101768A2

公开(公告)日：2006-09-28

申请号：PCT/US2006008539

申请日：2006-03-09

申请人： SKYWORKS SOLUTIONS INC ,  GAN QING ,  LOBIANCO ANTHONY J ,  WARREN ROBERT W

发明人： GAN QING ,  LOBIANCO ANTHONY J ,  WARREN ROBERT W

IPC分类号： H01L21/44

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L23/10 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.

摘要翻译： 根据示例性实施例，制造晶片级封装的方法包括在器件晶片上形成聚合物层，其中器件晶片包括至少一个器件晶片接触焊盘和器件，并且其中至少一个器件晶片接触焊盘 电连接到设备。 该方法还包括将保护晶片接合到器件晶片。 该方法还包括在保护晶片中形成至少一个通孔，其中至少一个通孔延伸穿过保护晶片并且位于至少一个器件晶片接触焊盘上方。 所述方法还包括在所述保护晶片上形成至少一个保护性晶片接触焊盘，其中所述至少一个保护性晶片接触焊盘位于所述至少一个通孔上并电连接至所述至少一个器件晶片接触焊盘。

公开(公告)号：WO2013009637A3

公开(公告)日：2013-01-17

申请号：PCT/US2012/045806

申请日：2012-07-06

申请人： SKYWORKS SOLUTIONS, INC. ,  AGARWAL, Anil, K. ,  VU HOANG, Dinhphuoc ,  CHEN, Howard, E. ,  LOBIANCO, Anthony, James ,  READ, Matthew, Sean ,  NGUYEN, Hoang, Mong ,  ZHANG, Guohao

发明人： AGARWAL, Anil, K. ,  VU HOANG, Dinhphuoc ,  CHEN, Howard, E. ,  LOBIANCO, Anthony, James ,  READ, Matthew, Sean ,  NGUYEN, Hoang, Mong ,  ZHANG, Guohao

IPC分类号： H04B1/00 ,  H05K9/00

摘要： Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding- wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.

公开(公告)号：WO2006107507A3

公开(公告)日：2009-04-16

申请号：PCT/US2006008599

申请日：2006-03-10

申请人： SKYWORKS SOLUTIONS INC ,  GAN QING ,  WARREN ROBERT ,  LOBIANCO ANTHONY ,  LIANG STEVE

发明人： GAN QING ,  WARREN ROBERT ,  LOBIANCO ANTHONY ,  LIANG STEVE

IPC分类号： H01L23/10 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L23/49822 ,  B81C1/00269 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16235 ,  H01L2224/2746 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32235 ,  H01L2224/73103 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2224/83

摘要： According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.

摘要翻译： 根据示例性实施例，晶片级封装包括包括至少一个器件晶片接触焊盘和器件的器件晶片，并且其中所述至少一个器件晶片接触焊盘电连接到所述器件。 晶片级封装包括位于器件晶片上方的第一聚合物层。 晶片级封装包括位于第一聚合物层之上并具有第一端子和第二端子的至少一个无源部件。 所述至少一个无源部件的第一端子电连接到所述至少一个器件晶片接触焊盘。 晶片级封装包括位于至少一个无源部件上的第二聚合物层。 晶片级封装包括位于第二聚合物层之上并电连接至至少一个无源元件的第二端子的至少一个聚合物层接触焊盘。