Abstract:
Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
Abstract:
Structures in the nanoscale and mesoscale domain are provided. The structures may have a shell which can be comprised of a porous polymeric material such as parylene. The surfaces of the shell can further comprise pendant functional groups that can provide reactive or passive characteristics. A method of producing nanoscale structures utilizing a porous substrate is further disclosed.
Abstract:
Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
Abstract:
Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.
Abstract:
An alloy suitable for use in a ball grid array, the alloy comprising from 0.15 - 1.5 wt.% copper, from 0.1 - 4 wt.% silver, from 0 - 0.1 wt.% phosphorus, from 0 - 0.1 wt.% germanium, from 0 - 0.1 wt.% gallium, from 0 - 0.3 wt.% of one or more rare earth elements, from 0 - 0.3 wt.% indium, from 0 - 0.3 wt.% magnesium, from 0 - 0.3 wt.% calcium, from 0 - 0.3 wt.% silicon, from 0 - 0.3 wt.% aluminium, from 0 - 0.3 wt.% zinc, from 0 - 1 wt.% antimony, and at least one of the following elements from 0.02 - 0.3 wt% nickel, from 0.008 - 0.2 wt% manganese, from 0.01 - 0.3 wt% cobalt, from 0.005 - 0.3 wt% chromium, from 0.02 - 0.3 wt% iron, and from 0.008 - 0.1 wt% zirconium, and the balance tin, together with unavoidable impurities.
Abstract:
A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.
Abstract:
An improved coating (16) for optical fibers (8) and a method for applying the improved coating (16) are described. The present invention is a dimensionally precise and uniform coating (16) with low-porosity. The improved coating (16) is applied via sputtering within a vacuum chamber (2). Environmental conditions are monitored within a cylindrical magnetron (4) during sputtering. Sputtering is adjusted or temporarily ceased when environmental conditions approach a damage threshold. Sputtered particles (38) within a plasma cloud (46) are dimensionally similar and adhere to an optical fiber (8) in a volume efficient arrangement forming a more precise, denser, and more adherent coating (16). Embodiments of the present invention provide improved pull strength by compressively constraining the optical fiber (8) within the coating (16) and by closing microcracks.
Abstract:
Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300 0C or less to attach the die to the substrate. Devices produced using the methods are also described.
Abstract:
Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.
Abstract:
Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards. The particles, in particular silver particles are produced by a process comprising: mixing a metal or a metal salt with a capping agent in a single phase solution; and adding a reducing agent to the single phase solution to produce capped nanoparticles.