公开(公告)号：WO2018187212A8

公开(公告)日：2018-10-11

申请号：PCT/US2018/025695

申请日：2018-04-02

Applicant: LISTAT LTD. ,  WILLIAMS, Richard, K.

Inventor： WILLIAMS, Richard, K. ,  VERZUN, Ievgen ,  HOLUB, Oleksandr

IPC: H04L12/70

Abstract: A variety of techniques for concealing the content of a communication between a client device, such as a cell phone or laptop, and a network or cloud of media nodes are disclosed. Among the techniques are routing data packets in the communication to different gateway nodes in the cloud, sending the packets over different physical media, such as an Ethernet cable or WiFi channel, and disguising the packets by giving them different source addressees. Also disclosed are a technique for muting certain participants in a conference call and a highly secure method of storing data files.

公开(公告)号：WO2017070439A1

公开(公告)日：2017-04-27

申请号：PCT/US2016/058064

申请日：2016-10-21

Applicant: APPLIED BIOPHOTONICS, LTD. ,  WILLIAMS, Richard K.

Inventor： WILLIAMS, Richard K. ,  LIN, Feng-Hung

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/148 ,  H05K1/147 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/24 ,  H05K3/32 ,  H05K3/361 ,  H05K3/4038 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: A rigid-flex PCB includes an array of rigid PCB "islands" interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PC B to which it is attached. The rigid-flex PCB is particularly applicable to light, pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

Abstract translation: 刚柔印刷电路板包括刚性印刷电路板“岛”阵列， 通过形成柔性连接器的柔性PCB相互连接。 柔性PCB的导电层和绝缘层延伸到刚性PCB中，从而与刚性PCB的电连接增加了抗断裂性能，因为刚柔性PCB通过弯曲和扭转力反复受到应力。 此外，通过使电源线和信号线驱动刚性PCB成为冗余，从而增强了刚柔性PCB的耐用性，从而线路的断裂不一定会影响其所连接的刚性PC B的操作。 刚柔性PCB特别适用于光疗中使用的光源，其中安装在刚性PCB上的LED通过柔性PCB中的冗余线路供电和控制。

公开(公告)号：WO2016190912A8

公开(公告)日：2016-12-01

申请号：PCT/US2016/014643

申请日：2016-01-23

Applicant: ADVENTIVE IPBANK ,  WILLIAMS, Richard K.

Inventor： WILLIAMS, Richard K. ,  VERZUN, Ievgen ,  OLEKSANDR, Golub

IPC: H04L12/22 ,  H04L9/14

Abstract: In a secure cloud for transmitting packets of digital data, the packets may be repeatedly scrambled (i.e., their data segments reordered) and then unscrambled, split and then mixed, and/or encrypted and then decrypted as they pass through media nodes in the cloud. The methods used to scramble, split, mix and encrypt the packets may be varied in accordance with a state such as time, thereby making the task of a hacker virtually impossible inasmuch as he or she may be viewing only a fragment of a packet and the methods used to disguise the data are constantly changing.

公开(公告)号：WO2016179111A1

公开(公告)日：2016-11-10

申请号：PCT/US2016/030456

申请日：2016-05-02

Applicant: ADVENTIVE TECHNOLOGY, LTD. ,  WILLIAMS, Richard, K.

Inventor： WILLIAMS, Richard, K. ,  LIN, Keng-Hung

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H01L23/49562 ,  H01L21/4828 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49555 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49107 ,  H01L2224/49111 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014 ,  H01L2924/0665

Abstract: A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to die bottom of the die. The result is a package with a minimal footprint that is suitable for the technique known as "wave soldering" that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.

Abstract translation: 功率封装包括从暴露在封装的下侧的裸片焊盘延伸的散热片，其有助于将热量从裸片移除到PCB或其上安装封装件的其它表面。 热片具有与芯片焊盘的平坦底表面和引线底表面共面的底表面。 引线包括水平脚部段，垂直柱状段和面向管芯焊盘的水平悬臂段。 热片也可以有一个脚。 包含功率器件的管芯安装在管芯焊盘的顶表面上，并且可以使用接合线或夹子电连接到引线。 管芯可以用导电材料安装在管芯焊盘上，并且封装还可以包括从管芯焊盘延伸并且因此电连接到管芯的管芯底部的引线。 结果是具有最小占地面积的封装，适用于在相对低成本的印刷电路板组装工厂中使用的称为“波峰焊”的技术。 公开了制造封装的方法。

公开(公告)号：WO2013086154A1

公开(公告)日：2013-06-13

申请号：PCT/US2012/068194

申请日：2012-12-06

Applicant: ADVANCED ANALOGIC TECHNOLOGIES, INC. ,  WILLIAMS, Richard, K. ,  D'ANGELO, Kevin ,  BROWN, David, A.

Inventor： WILLIAMS, Richard, K. ,  D'ANGELO, Kevin ,  BROWN, David, A.

IPC: H05B37/02 ,  G09G3/12

CPC classification number: H05B33/083 ,  H05B33/0815 ,  H05B33/0827 ,  H05B33/086 ,  H05B37/0254 ,  Y02B20/32

Abstract: A system for controlling multiple strings of LEDs includes a group of LED driver ICs, each of which includes a current sense feedback (CS FB) sample latch for storing a digital representation of the forward-vohage drop across a controlled LED string. Each CSFB latch is coupled to a register within a serial lighting interface (SLI) bus that both originates and terminates at an interface IC. As the data on the SLI bus is shifted into the interface IC, the interface iC selects the CSFB word that represents the highest forward- voltage drop of any of the controlled LED strings, which is then used by the interface IC to generate a CSFB signal for setting the appropriate supply voltage for the controlled LED strings.

Abstract translation: 用于控制多串LED的系统包括一组LED驱动器IC，每个LED驱动器IC包括电流检测反馈（CS FB）采样锁存器，用于存储跨受控LED串的前向游离液滴的数字表示。 每个CSFB锁存器耦合到串行照明接口（SLI）总线中的寄存器，两者均始发并终止于接口IC。 随着SLI总线上的数据被转移到接口IC中，接口iC选择表示任何受控LED串的最高正向压降的CSFB字，然后由接口IC用于产生一个CSFB信号 用于设置受控LED串的适当电源电压。

公开(公告)号：WO2013025573A3

公开(公告)日：2013-05-02

申请号：PCT/US2012050494

申请日：2012-08-12

Applicant: ADVANCED ANALOGIC TECH INC ,  WILLIAMS RICHARD K ,  LIN KENG HUNG

Inventor： WILLIAMS RICHARD K ,  LIN KENG HUNG

IPC: H01L23/488 ,  H01L23/495

CPC classification number: H01L23/49551 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49572 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/11005 ,  H01L2224/1111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11505 ,  H01L2224/13023 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13186 ,  H01L2224/13187 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/14131 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/81191 ,  H01L2224/81211 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/05552

Abstract: A semiconductor die is solder bump-bonded to a leadframe or circuit board using solder balls having cores made of a material with a melting temperature higher than the melting temperature of the solder to ensure that in the finished structure the die is parallel to the leadframe or circuit hoard.

Abstract translation: 使用具有由熔点高于焊料的熔化温度的材料制成的芯的焊球将焊料凸点焊接到引线框架或电路板上，以确保在成品结构中模具平行于引线框或者 电路囤积。

公开(公告)号：WO2013025575A1

公开(公告)日：2013-02-21

申请号：PCT/US2012/050496

申请日：2012-08-12

Applicant: ADVANCED ANALOGIC TECHNOLOGIES, INC. ,  WILLIAMS, Richard, K.

Inventor： WILLIAMS, Richard, K.

IPC: H01L21/00

CPC classification number: H01L23/49811 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49572 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Thermal transfer from a silicon^m-insulator (SOI) die is improved by mounting the die in a bump-on-Iead.frame manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure.

Abstract translation: 通过在半导体封装中以凹凸对准的方式安装裸片，通过将SOI裸片的有源层连接到金属的焊料或其它金属凸块来改善来自硅 - 绝缘体（SOI）裸片的热传递 引线用于将封装安装在印刷电路板或其他支撑结构上。

公开(公告)号：WO2010014232A2

公开(公告)日：2010-02-04

申请号：PCT/US2009004396

申请日：2009-07-30

Applicant: ADVANCED ANALOGIC TECH INC ,  WILLIAMS RICHARD K

Inventor： WILLIAMS RICHARD K

IPC: H02M3/155 ,  H02M3/07

CPC classification number: H02M3/07 ,  H02M3/1588 ,  H02M2001/007 ,  Y02B70/1466

Abstract: A DC/DC voltage converter includes an inductive switching voltage regulator and a capacitive charge pump connected in series between the input and output terminals of the converter. The charge pump has a second input terminal connected to the input terminal of the converter. This reduces the series resistance in the current path by which charge is transferred from the capacitor in the charge pump to the output capacitor and thereby improves the ability of the converter to respond to rapid changes in current required by the load.

Abstract translation: DC / DC电压转换器包括在转换器的输入和输出端子之间串联连接的感应开关电压调节器和电容电荷泵。 电荷泵具有连接到转换器的输入端的第二输入端。 这降低了电荷路径中的电荷从电荷泵中的电容器转移到输出电容器的电流路径，从而提高了转换器对负载所需电流的快速变化的响应能力。

公开(公告)号：WO2009102499A3

公开(公告)日：2009-08-20

申请号：PCT/US2009/000984

申请日：2009-02-17

Applicant: ADVANCED ANALOGIC TECHNOLOGIES, INC. ,  DISNEY, Donald, R. ,  WILLIAMS, Richard, K.

Inventor： DISNEY, Donald, R. ,  WILLIAMS, Richard, K.

IPC: H01L21/8249

Abstract: Isolated transistors formed in a semiconductor substrate include a submerged floor isolation region and a filled trench extending downward from the surface of the substrate to the floor isolation region. Together the floor isolation region and the filled trench form an isolated pocket of the substrate. In alternative embodiments a doped sidewall region extends downward from the bottom of the trench to the floor isolation region. The substrate does not contain an epitaxial layer, thereby overcoming the many problems associated with fabricating the same.

公开(公告)号：WO2009102499A2

公开(公告)日：2009-08-20

申请号：PCT/US2009000984

申请日：2009-02-17

Applicant: ADVANCED ANALOGIC TECH INC ,  DISNEY DONALD R ,  WILLIAMS RICHARD K

Inventor： DISNEY DONALD R ,  WILLIAMS RICHARD K

IPC: H01L21/8249

CPC classification number: H01L21/761 ,  H01L21/76243 ,  H01L21/76267 ,  H01L21/763 ,  H01L21/8222 ,  H01L21/82285 ,  H01L21/823878 ,  H01L21/823892 ,  H01L27/0825 ,  H01L27/0826 ,  H01L29/41708 ,  H01L29/732

Abstract: Isolated transistors formed in a semiconductor substrate include a submerged floor isolation region and a filled trench extending downward from the surface of the substrate to the floor isolation region. Together the floor isolation region and the filled trench form an isolated pocket of the substrate. In alternative embodiments a doped sidewall region extends downward from the bottom of the trench to the floor isolation region. The substrate does not contain an epitaxial layer, thereby overcoming the many problems associated with fabricating the same.

Abstract translation: 形成在半导体衬底中的隔离晶体管包括浸没的地板隔离区域和从衬底的表面向下延伸到地板隔离区域的填充沟槽。 底部隔离区域和填充的沟槽一起形成衬底的隔离袋。 在替代实施例中，掺杂侧壁区域从沟槽的底部向下延伸到地板隔离区域。 衬底不含有外延层，从而克服了与其制造相关的许多问题。