利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.008 秒)

    METHOD FOR LAYING A WIRE CONDUCTOR ONTO A SUBSTRATE AND FOR CONNECTING IT TO A CHIP
    3.
    发明申请
    METHOD FOR LAYING A WIRE CONDUCTOR ONTO A SUBSTRATE AND FOR CONNECTING IT TO A CHIP 审中-公开
    将导线导入基板并将其连接到芯片的方法

    公开(公告)号：WO2014032970A1

    公开(公告)日：2014-03-06

    申请号：PCT/EP2013/066963

    申请日：2013-08-14

    申请人： FINLAY, Garreth ,  HYNES, Fergus

    发明人： FINLAY, Garreth ,  HYNES, Fergus

    IPC分类号： H01L21/607 ,  G06K19/077 ,  B23K20/00

    CPC分类号： G06K19/07781 ,  G06K19/07754 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45611 ,  H01L2224/4813 ,  H01L2224/78 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/85399

    摘要： Method for laying a wire conductor (3) on a substrate (2) by means of a wire laying pin (10), which embeds the wire conductor (3) under the influence of ultrasound into the surface of the substrate (2), and for the electrically conductive connection of the wire conductor (3) to a contact surface (7,8) of a chip (4), which is attached to the substrate, by means of a welding die (11), wherein the wire laying pin (10), subsequent to an attachment of the wire conductor (3) to the substrate (2), is lifted off the substrate (2) and then moved into a position starting from which the wire conductor (3) forms a straight wire line (15) extending in the air space above the substrate (2) and extending from the mouth of the wire laying pin (10) to an attachment point (F) at which the wire conductor (3) is attached to the substrate (2) or embedded into the substrate(2), whereupon the welding die (11) grips the wire in the area between the wire laying pin (10) and the end point (14) of the wire laying cycle, brings it up to the contact surface (7,8) of the chip (4) associated therewith, and welds it to the contact surface or whereupon a wire gripper (12) grips the wire conductor (3) in the area between the wire laying pin (10) and the attachment point (F), the wire gripper (12) and preferably also the wire laying pin (10) are then moved in such a way that the wire conductor (3) spanned in between them from now on traverses the contact surface (7,8) of the chip (4) associated therewith, finally the welding die (11) presses the wire conductor (3) spanned in between the wire gripper (12) and the wire laying pin (10) onto the contact surface (7,8) and welds it to the contact surface.

    摘要翻译： 用于通过敷线销（10）将线导体（3）放置在基板（2）上的方法，其将超导线下的导线（3）嵌入基板（2）的表面;以及 用于通过焊接模具（11）将线导体（3）导电连接到附接到基板的芯片（4）的接触表面（7,8）上，其中布线销 （10）在将导线（3）连接到基板（2）之后，被提升离开基板（2），然后移动到从导线（3）形成直线导线 （15），其在所述基板（2）上方的空气空间中延伸并且从所述电线敷设销（10）的口延伸到所述电线导体（3）附接到所述基板（2）的附接点（F） 或嵌入到基板（2）中，于是焊接模具（11）在电线敷设销（10）和电线铺设的终点（14）之间的区域中握住电线 g循环，将其带到与其相关联的芯片（4）的接触表面（7,8）上，并将其焊接到接触表面上，或者由此将线夹（12）夹在线导体（3）之间的区域中 电线敷设销（10）和安装点（F），电线夹持器（12）以及优选的电线敷设销（10）然后移动，使得导线（3）跨过它们之间 现在横穿与其相关联的芯片（4）的接触表面（7,8），最后焊接模具（11）挤压跨在导线夹持器（12）和导线敷设销（10）之间的导线（3） ）到接触表面（7,8）上并将其焊接到接触表面。

    FLEXIBLE SUBSTRATE MOUNTED SOLID-STATE LIGHT SOURCES FOR EXTERIOR VEHICULAR LIGHTING
    7.
    发明申请
    FLEXIBLE SUBSTRATE MOUNTED SOLID-STATE LIGHT SOURCES FOR EXTERIOR VEHICULAR LIGHTING 审中-公开
    柔性基板安装固体光源用于外部车辆照明

    公开(公告)号：WO01098708A1

    公开(公告)日：2001-12-27

    申请号：PCT/US2001/018235

    申请日：2001-06-04

    IPC分类号： B60Q1/26 ,  F21S8/10 ,  F21V7/00 ,  F21V21/00

    CPC分类号： G09F9/301 ,  B60Q1/2696 ,  F21S41/143 ,  F21S43/14 ,  F21S43/315 ,  F21V7/0091 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/85801 ,  H01L2224/8585 ,  Y10S362/80 ,  H01L2924/00014

    摘要： Exterior lighting assemblies for use on vehicles include a flexible substrate on which are mounted a plurality of solid-state light emitting devices (34) that are preferably light emitting diodes (LEDs), although other types of devices can alternatively be employed. The light emitting devices are connected to flexible conductive traces on the flexible substrate, and leads connect the traces to a power supply on the vehicle so that electrical current can be selectively supplied to energize the light emitting devices. The flexible substrate is adapted to be mounted on the exterior surface of a vehicle, for example, as a tail lamp assembly (30), or as a headlamp, and to conform around a curved exterior surface (22). Devices that emit differently colored light can be used for indicating braking, turn direction, or to illuminate a surface over which the vehicle is travelling. A flexible optically transparent cover protects the light emitting devices.

    摘要翻译： 用于车辆的外部照明组件包括柔性基板，其上安装有多个固态发光器件（34），其优选地是发光二极管（LED），尽管可以替代地采用其他类型的器件。 发光器件连接到柔性基板上的柔性导电迹线，并且引线将迹线连接到车辆上的电源，使得可以选择性地提供电流以激励发光器件。 柔性基板适于安装在车辆的外表面上，例如，作为尾灯组件（30）或头灯，并且围绕弯曲的外表面（22）配合。 发出不同颜色的光的装置可以用于指示制动，转向或照亮车辆行驶的表面。 柔性光学透明盖保护发光器件。