公开(公告)号：WO2008102266A2

公开(公告)日：2008-08-28

申请号：PCT/IB2008/000830

申请日：2008-02-25

Applicant: INFERMATA SYSTEMS LTD. ,  BITON, Kfir ,  DOLLBERG, Yosh

Inventor： BITON, Kfir ,  DOLLBERG, Yosh

IPC: H01L23/34

CPC classification number: H05K3/0023 ,  B33Y80/00 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/036 ,  H05K3/0017 ,  H05K3/007 ,  H05K3/0082 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4664 ,  H05K2201/0195 ,  H05K2201/09827 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/016 ,  H05K2203/0557 ,  H05K2203/0759 ,  H05K2203/0773 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1563 ,  H05K2203/308 ,  H01L2924/00

Abstract: Systems and methods are provided for producing functional printed circuit boards. It is intended that the systems and methods described herein will allow the production of functional PCBs in a more efficient and less labor- and equipment-intensive manner than may be obtained using conventional production methods. The produced functional PCB would have the required mechanical, thermal, electrical, etc., characteristics enabling it to function in a manner corresponding to a design characteristics of a conventional PCB.

Abstract translation: 提供了用于制造功能印刷电路板的系统和方法。 本文所述的系统和方法旨在以比使用常规生产方法可获得的更高效和更少的劳动和设备密集的方式实现功能PCB的生产。 所生产的功能PCB将具有所需的机械，热，电等特性，使其能够以对应于常规PCB的设计特性的方式起作用。

公开(公告)号：WO2006071419A2

公开(公告)日：2006-07-06

申请号：PCT/US2005/042895

申请日：2005-11-23

Applicant: NANOTECHNOLOGIES, INC. ,  SCHRODER, Kurt, A. ,  MCCOOL, Steve ,  HAMILL, Dennis, W. ,  WILSON, Dennis, Eugene ,  FURLAN, Wayne ,  WALTER, Kevin, C. ,  WILLAUER, Darrin, L. ,  MARTIN, Karl, Matthew

Inventor： SCHRODER, Kurt, A. ,  MCCOOL, Steve ,  HAMILL, Dennis, W. ,  WILSON, Dennis, Eugene ,  FURLAN, Wayne ,  WALTER, Kevin, C. ,  WILLAUER, Darrin, L. ,  MARTIN, Karl, Matthew

IPC: C25C1/20

CPC classification number: F01N3/202 ,  B01J35/0013 ,  B01J35/004 ,  B01J37/341 ,  B01J38/02 ,  B01J2208/026 ,  B41J11/002 ,  B82Y30/00 ,  F01N2510/06 ,  F23C13/08 ,  F23C2900/03001 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2203/0517 ,  H05K2203/102 ,  H05K2203/1131 ,  Y02T10/26

Abstract: This invention relates generally to uses of novel nanomaterial composition and the systems in which they are used, and more particularly to nanomaterial compositions generally comprising carbon and a metal, which composition can be exposed to pulsed emissions to react, activate, combine, or sinter the nanomaterial composition. The nanomaterial compositions can alternatively be utilized at ambient temperature or under other means to cause such reaction, activation, combination, or sintering to occur.

Abstract translation: 本发明一般涉及新型纳米材料组合物及其使用的系统的用途，更具体地涉及通常包含碳和金属的纳米材料组合物，该组合物可暴露于脉冲发射反应，激活，组合或烧结 纳米材料组成。 纳米材料组合物可以替代地在环境温度下或在其它方式下使用以引起这种反应，活化，组合或烧结发生。

公开(公告)号：WO2005087979A2

公开(公告)日：2005-09-22

申请号：PCT/DK2005000163

申请日：2005-03-10

Applicant: FRONTCOAT TECHNOLOGIES APS ,  UNIV DANMARKS TEKNISKE ,  BILL THOMAS ,  ERUP LARS ,  MOELLER PER

Inventor： BILL THOMAS ,  ERUP LARS ,  MOELLER PER

IPC: C23C18/14 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/28 ,  H05K3/18

CPC classification number: C23C18/161 ,  B82Y10/00 ,  B82Y30/00 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1658 ,  C23C18/166 ,  C23C18/1664 ,  C23C18/1667 ,  C23C18/1676 ,  C23C18/1692 ,  C23C18/1851 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/1893 ,  C23C18/2006 ,  C23C18/208 ,  C23C18/30 ,  C23C18/36 ,  C23C18/405 ,  H05K3/182 ,  H05K2201/09918 ,  H05K2203/013 ,  H05K2203/095 ,  H05K2203/097 ,  H05K2203/102 ,  H05K2203/1157

Abstract: A method and a device for depositing a metal layer on a non-conducting surface of a substrate. (a) A liquid composition containing metal ions is directed to at least a part of the surface and (b) a reductive agent is directed to at least a part of the surface. The metal ions are reduced in situ into the metallic form in those parts onto which both (a) and (b) have been directed. The reduction reaction and the adherence to the non-conducting surface is supported by treatment with physical energy such as treatment with corona discharge, atmospheric plasma, flame treatment, microwave, infrared light and/or UV light. Selective surface treatment is obtained based on electroless plating whereby the surface is printed on with metal and reducer as ink by conventional printing such as inkjet printing and tampon printing electrodes and conducting surfaces with Cu, Ni, Au and Ag.

Abstract translation: 一种在衬底的非导电表面上沉积金属层的方法和装置。 （a）含有金属离子的液体组合物被引导到表面的至少一部分，和（b）还原剂被引导到表面的至少一部分。 金属离子在（a）和（b）都被引导到的那些部分中原位还原成金属形式。 还原反应和对非导电表面的粘附通过用诸如用电晕放电，大气等离子体，火焰处理，微波，红外光和/或UV光处理的物理能量进行处理来支持。 基于化学镀获得选择性表面处理，其中通过常规印刷如喷墨印刷和棉塞印刷电极和具有Cu，Ni，Au和Ag的导电表面用金属和还原剂印刷表面。

公开(公告)号：WO00052975A1

公开(公告)日：2000-09-08

申请号：PCT/GB2000/000776

申请日：2000-03-06

IPC: H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/095 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/1258 ,  H05K3/4623 ,  H05K2201/09036 ,  H05K2203/0126 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/081 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1572

Abstract: A CAD controlled circuit board printer for the in-house production of prototype PCBs. The printer (2) includes pneumatically controlled drilling means (12) for cutting grooves and holes in a substrate (8); a deposition system (10) for filling the grooves and holes with a curable polymeric, conductive ink and an oven for curing the conductive material. A pressing means (16) is also provided for the production of multilayer boards. Substrates are cut and filled with conductive ink which are then cured. For multilayer boards, after lamination by the pressing means, holes are redrilled and refilled to enable the formation of continuous conductive pathways between layers. The printer can be used to provide a single board or multiple boards. Various embodiments of the invention are described.

Abstract translation: 用于内部生产原型PCB的CAD控制电路板打印机。 打印机（2）包括用于切割衬底（8）中的凹槽和孔的气动钻孔装置（12）。 用于用可固化聚合物，导电油墨和用于固化导电材料的烘箱填充凹槽和孔的沉积系统（10）。 还提供了压制装置（16）用于生产多层板。 底物被切割并填充导电油墨，然后固化。 对于多层板，在通过压制装置层压之后，将孔重新钻孔并重新填充，以使得能够在层之间形成连续的导电路径。 打印机可用于提供单板或多板。 对本发明的各种实施方式进行说明。

公开(公告)号：WO1991018491A1

公开(公告)日：1991-11-28

申请号：PCT/SE1991000270

申请日：1991-04-17

Applicant: PERSTORP AB ,  MASIK, Jiri

Inventor： PERSTORP AB

IPC: H05K03/46

CPC classification number: H05K3/4638 ,  H05K2203/0285 ,  H05K2203/065 ,  H05K2203/102

Abstract: Process for the production of a multilayer printed circuit board composed of a plurality of so-called inner layers, each consisting of an insulating base of thin laminate of reinforcement material impregnated with thermosetting resin. The laminate is preferably provided with a layer of metal or metal alloy on both sides, in which layers a wiring pattern has been formed. Prepreg sheets of reinforcement material impregnated with thermosetting resin are placed between the inner layers. The resin is not fully cured. The inner layers are centered in respect of each other and fixed in this position by pressing the different sheets together along the long sides. Energy is then supplied within a limited area along the two long sides. Thereby the resin is heated and cured so that all sheets are bonded together with each other, preferably in a few spots or minor areas. The package obtained is then laminated under heat and pressure together with conventional outer layers and/or foils of metal or metal alloy to a multilayer printed circuit board which is then completed in the usual way.

Abstract translation: 制造多层印刷电路板的方法，该多层印刷电路板由多层所谓的内层构成，各层由浸渍有热固性树脂的增强材料薄层压板的绝缘基体组成。 层叠体优选在两侧设置有金属或金属合金层，其中形成了布线图案。 浸渍有热固性树脂的预浸料片材被放置在内层之间。 树脂未完全固化。 内层彼此相对中心并且通过沿着长边将不同的片材压在一起而固定在该位置上。 然后沿着两个长边在有限的区域内提供能量。 由此，树脂被加热和固化，使得所有的片材彼此粘合在一起，优选在少量的区域或少量区域中。 然后将所获得的包装与传统的金属或金属合金的外层和/或箔片在加热和压力下层叠到多层印刷电路板上，然后以通常的方式完成。

公开(公告)号：WO2013058379A1

公开(公告)日：2013-04-25

申请号：PCT/JP2012/077149

申请日：2012-10-19

Applicant: 昭和電工株式会社 ,  富士電波工機株式会社

Inventor： 内田　博 ,  篠崎　研二 ,  仙田　和章

IPC: H05K3/12 ,  H01L21/28 ,  H01L21/288 ,  H01L21/31 ,  H05B6/74 ,  H05B6/78

CPC classification number: H05K3/1283 ,  H05B6/78 ,  H05K2201/0154 ,  H05K2203/102

Abstract: 【課題】導体もしくは半導体の膜または導体もしくは半導体を分散させた分散物の膜を適切に加熱することができるマイクロ波加熱装置及びマイクロ波加熱方法を提供する。 【解決手段】導波管１６ａに波長範囲１ｍ～１ｍｍのマイクロ波を供給しつつ、この導波管１６ａの中に、導体もしくは半導体の膜または導体もしくは半導体を分散させた分散物の膜を形成した基板２４を、上記膜の形成面がマイクロ波の電気力線方向と略平行に配置し、または移動させる。

Abstract translation: 提供一种微波加热装置和微波加热方法，由此可以适当地加热导体或半导体的膜或其中分散有导体或半导体的分散体的膜。 [解决方案]将波长范围为1μm至1mm的微波提供给波导管（16a），并在其上形成导体或半导体的膜或分散体的膜的基板（24） 其中导体或半导体已被分散，被放置或移动到波导管16a内，使得其上形成有膜的表面基本上平行于微波的电力线的方向。

公开(公告)号：WO2007142975A3

公开(公告)日：2008-03-20

申请号：PCT/US2007012750

申请日：2007-05-30

Applicant: LAMBDA TECHNOLOGIES INC ,  FATHI ZAKARYAE ,  GREATHOUSE STEVE ,  HUBBARD ROBERT ,  AHMAD IFTIKHAR

Inventor： FATHI ZAKARYAE ,  GREATHOUSE STEVE ,  HUBBARD ROBERT ,  AHMAD IFTIKHAR

IPC: B29C65/14 ,  H01L21/58

CPC classification number: B29C65/1403 ,  B29C65/04 ,  B29C65/1406 ,  B29C65/1425 ,  B29C65/366 ,  B29C65/4835 ,  B29C65/4865 ,  B29C66/20 ,  B29C66/54 ,  B29C66/73112 ,  B29C66/73921 ,  B29C66/964 ,  B29K2995/0006 ,  B29L2031/30 ,  B29L2031/3061 ,  B29L2031/3425 ,  B29L2031/3475 ,  B29L2031/50 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83234 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3494 ,  H05K2201/0394 ,  H05K2203/102 ,  B29C65/00 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.

Abstract translation: 导电迹线和相同的图案用于通过电磁辐射将部件粘合在一起。 每个导电迹线被配置为当用诸如微波能量和/或RF能量的电磁辐射照射时谐振和加热，其具有约为导电迹线长度的2.3倍的波长。 导电迹线可以以图案布置，以在用电磁辐射照射时将基板或其他部件的目标区域均匀加热到所选择的温度。

公开(公告)号：WO2007039227A1

公开(公告)日：2007-04-12

申请号：PCT/EP2006/009437

申请日：2006-09-28

Applicant: STICHTING DUTCH POLYMER INSTITUTE ,  PERELAER, Jolke ,  DE GANS, Berend Jan ,  SCHUBERT, Ulrich, S.

Inventor： PERELAER, Jolke ,  DE GANS, Berend Jan ,  SCHUBERT, Ulrich, S.

IPC: H05K3/10 ,  H05K3/12 ,  H05K3/22 ,  H01L21/288 ,  H01L21/768

CPC classification number: H05K3/1283 ,  H01L21/288 ,  H01L21/76838 ,  H05K3/125 ,  H05K3/22 ,  H05K2203/013 ,  H05K2203/102 ,  H05K2203/1105

Abstract: Method for generation of metal surface structures and apparatus therefor Disclosed is a method for generating conductive surface patterns on a substrate by coating the substrate with metal particles and heating the coated substrate by means of microwave radiation. The process is easy to implement and can be used to generate metal pattern lit low cost.

Abstract translation: 用于生成金属表面结构的方法及其设备公开了一种通过用金属颗粒涂覆基板并通过微波辐射加热涂覆的基板来在基板上产生导电表面图案的方法。 该工艺易于实施，可用于生成低成本的金属图案。

公开(公告)号：WO2006071419A9

公开(公告)日：2006-10-19

申请号：PCT/US2005042895

申请日：2005-11-23

Applicant: NANOTECHNOLOGIES INC ,  SCHRODER KURT A ,  MCCOOL STEVE ,  HAMILL DENNIS W ,  WILSON DENNIS EUGENE ,  FURLAN WAYNE ,  WALTER KEVIN C ,  WILLAUER DARRIN L ,  MARTIN KARL MATTHEW

Inventor： SCHRODER KURT A ,  MCCOOL STEVE ,  HAMILL DENNIS W ,  WILSON DENNIS EUGENE ,  FURLAN WAYNE ,  WALTER KEVIN C ,  WILLAUER DARRIN L ,  MARTIN KARL MATTHEW

IPC: C25C1/20

CPC classification number: F01N3/202 ,  B01J35/0013 ,  B01J35/004 ,  B01J37/341 ,  B01J38/02 ,  B01J2208/026 ,  B41J11/002 ,  B82Y30/00 ,  F01N2510/06 ,  F23C13/08 ,  F23C2900/03001 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2203/0517 ,  H05K2203/102 ,  H05K2203/1131 ,  Y02T10/26

Abstract: This invention relates generally to uses of novel nanomaterial composition and the systems in which they are used, and more particularly to nanomaterial compositions generally comprising carbon and a metal, which composition can be exposed to pulsed emissions to react, activate, combine, or sinter the nanomaterial composition. The nanomaterial compositions can alternatively be utilized at ambient temperature or under other means to cause such reaction, activation, combination, or sintering to occur.

Abstract translation: 本发明一般涉及新型纳米材料组合物和使用它们的系统的用途，并且更具体地涉及通常包含碳和金属的纳米材料组合物，该组合物可暴露于脉冲发射以反应，活化，结合或烧结 纳米材料组成。 或者，可以在环境温度或其他方式下使用纳米材料组合物以引起发生这种反应，活化，组合或烧结。

公开(公告)号：WO1997002726A1

公开(公告)日：1997-01-23

申请号：PCT/US1996011043

申请日：1996-06-27

Applicant: LAMBDA TECHNOLOGIES, INC. ,  FATHI, Zakaryae ,  GARARD, Richard, S. ,  WEI, Jianghua

Inventor： LAMBDA TECHNOLOGIES, INC.

IPC: H05K03/30

CPC classification number: H05K3/3494 ,  H05B6/80 ,  H05K2203/102

Abstract: A system and apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. The system (10) comprises a microwave furnace (11), means (20) for securing a microelectronic substrate (23) within the chamber (12), and means (30, 30') for electrically interconnecting the microelectronic substrate (23) with a ground (14) connected to an interior wall of the microwave furnace. The apparatus comprises a holder (20) for securing a microelectronic substrate (23) during the application of microwave energy and for providing the necessary electrical connections (30) for grounding components and circuitry thereon. The holder (20) may comprise a heat sink (52) for protection against heat build-up and for maintaining a microelectronic substrate (23) in a substantially flat orientation during microwave processing.

Abstract translation: 提供了一种用于通过向其上具有电子部件的微电子基板施加微波能量来减少电弧和局部加热的系统和装置。 系统（10）包括微波炉（11），用于将微电子衬底（23）固定在腔室（12）内的装置（20）和用于将微电子衬底（23）与 连接到微波炉的内壁的接地（14）。 该装置包括用于在施加微波能量期间固定微电子衬底（23）并用于提供必要的电连接（30）的保持器（20），用于在其上接地组件和电路。 保持器（20）可以包括散热器（52），用于防止热积聚并且在微波处理期间将微电子衬底（23）保持在基本平坦的取向。