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公开(公告)号：CN106457383B
公开(公告)日：2019-06-28
申请号：CN201580026546.7
申请日：2015-04-10
申请人： 阿尔法装配解决方案公司
CPC分类号： H01L24/29 , B22F1/0003 , B22F1/0014 , B22F1/0074 , B22F1/025 , B22F7/04 , B22F2007/047 , B22F2301/255 , B22F2302/45 , B23K1/0016 , B23K35/025 , B23K35/3006 , B23K35/3601 , B23K35/3613 , B23K35/3618 , B23K35/365 , B23K2101/40 , B23K2103/56 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/50 , H01L51/5246 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/131 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/13387 , H01L2224/1339 , H01L2224/13439 , H01L2224/1349 , H01L2224/13499 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27332 , H01L2224/27436 , H01L2224/27505 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29439 , H01L2224/2949 , H01L2224/29499 , H01L2224/32145 , H01L2224/32146 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/81075 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/8184 , H01L2224/81948 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/0665 , H01L2924/12041 , H01L2924/12044 , H01L2924/1461 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/206 , H01L2924/2064 , H05K3/321 , H01L2924/00012 , H01L2224/83 , H01L2924/0105 , H01L2924/01046 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/0103 , H01L2924/0493 , H01L2924/01004 , H01L2224/27 , H01L2924/01074 , H01L2224/81 , H01L2224/11436 , H01L2224/11 , H01L2224/45099 , H01L2924/00
摘要： 一种烧结粉末，其包含：具有从100nm至50μm的平均最长尺寸的第一类型的金属颗粒。
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公开(公告)号：CN106663494A
公开(公告)日：2017-05-10
申请号：CN201580039699.5
申请日：2015-07-14
申请人： 阿尔法装配解决方案公司
CPC分类号： H01B1/22 , B22F1/0014 , B22F1/0055 , B22F1/0074 , B22F1/025 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B23K35/025 , B23K35/3006 , B23K35/3613 , B23K35/362 , H05K1/095 , H05K1/189 , H05K3/1216 , H05K3/1241 , H05K2201/0133 , H05K2201/0203 , H05K2201/0245 , H05K2201/10106
摘要： 一种导电糊料，它包含在有机介质内分散的导电颗粒，该有机介质包含：溶剂；和含聚酯的粘合剂。
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公开(公告)号：CN106663494B
公开(公告)日：2018-11-30
申请号：CN201580039699.5
申请日：2015-07-14
申请人： 阿尔法装配解决方案公司
CPC分类号： H01B1/22 , B22F1/0014 , B22F1/0055 , B22F1/0074 , B22F1/025 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B23K35/025 , B23K35/3006 , B23K35/3613 , B23K35/362 , H05K1/095 , H05K1/189 , H05K3/1216 , H05K3/1241 , H05K2201/0133 , H05K2201/0203 , H05K2201/0245 , H05K2201/10106
摘要： 一种导电糊料，它包含在有机介质内分散的导电颗粒，该有机介质包含：溶剂；和含聚酯的粘合剂。
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