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公开(公告)号：CN101828255B
公开(公告)日：2011-11-09
申请号：CN200880112031.9
申请日：2008-12-03
申请人： 新日铁高新材料株式会社 , 日铁新材料股份有限公司
CPC分类号： C22C5/02 , B23K35/0222 , B23K35/302 , C22C5/04 , C22C5/06 , C22C9/00 , C22C9/01 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45683 , H01L2224/48011 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48486 , H01L2224/4851 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48839 , H01L2224/48844 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85203 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2924/00011 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01203 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/3025 , H01L2924/01004 , H01L2924/01001 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/00015 , H01L2924/01202 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20652 , H01L2924/20653 , H01L2924/20654 , H01L2924/20655 , H01L2924/20656 , H01L2924/20658 , H01L2224/48227 , H01L2924/00 , H01L2224/48824 , H01L2924/013 , H01L2924/00014 , H01L2924/0104 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： 本发明的目的是提供可以降低颈部的损伤，并且在环路的直线性、环路高度的稳定性、接合线的接合形状的稳定化方面优异的也适应于低环路化、细线化、窄间距化、三维组装等的半导体组装技术的高功能的接合线。本发明的半导体装置用接合线，是具有由导电性金属形成的芯材和在所述芯材上的以与芯材不同的面心立方晶的金属为主成分的表皮层的接合线，其特征在于，在所述表皮层的表面中的纵向的晶体取向之中， 所占的比例为50％以上。
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公开(公告)号：CN101828255A
公开(公告)日：2010-09-08
申请号：CN200880112031.9
申请日：2008-12-03
申请人： 新日铁高新材料株式会社 , 日铁新材料股份有限公司
CPC分类号： C22C5/02 , B23K35/0222 , B23K35/302 , C22C5/04 , C22C5/06 , C22C9/00 , C22C9/01 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45683 , H01L2224/48011 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48486 , H01L2224/4851 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48839 , H01L2224/48844 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85203 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2924/00011 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01203 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/3025 , H01L2924/01004 , H01L2924/01001 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/00015 , H01L2924/01202 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20652 , H01L2924/20653 , H01L2924/20654 , H01L2924/20655 , H01L2924/20656 , H01L2924/20658 , H01L2224/48227 , H01L2924/00 , H01L2224/48824 , H01L2924/013 , H01L2924/00014 , H01L2924/0104 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： 本发明的目的是提供可以降低颈部的损伤，并且在环路的直线性、环路高度的稳定性、接合线的接合形状的稳定化方面优异的也适应于低环路化、细线化、窄间距化、三维组装等的半导体组装技术的高功能的接合线。本发明的半导体装置用接合线，是具有由导电性金属形成的芯材和在所述芯材上的以与芯材不同的面心立方晶的金属为主成分的表皮层的接合线，其特征在于，在所述表皮层的表面中的纵向的晶体取向之中， 所占的比例为50％以上。
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公开(公告)号：CN101527287A
公开(公告)日：2009-09-09
申请号：CN200910133707.9
申请日：2009-04-01
申请人： 杰群电子科技股份有限公司
发明人： 资重兴
IPC分类号： H01L23/482 , H01L23/488 , H01L21/60 , H01L21/56
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L2224/05644 , H01L2224/32225 , H01L2224/32245 , H01L2224/45111 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48475 , H01L2224/48479 , H01L2224/48482 , H01L2224/48486 , H01L2224/48499 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85986 , H01L2224/92247 , H01L2225/06506 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2224/48471 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/01006 , H01L2224/4554
摘要： 本发明涉及一种打线结构，尤其涉及半导体元件的打线结构及其制作方法，主要包括有一芯片，且该芯片透过一导电线与一导电部相连接，其中芯片的主动表面上设置有至少一焊垫，并于焊垫上设置有一凸块，且该凸块的组成材料包括金，此外，凸块上还设置有一焊球，借由焊垫及凸块的设置可将焊球及芯片进行隔离，并避免在打线过程当中所产生的高温对芯片造成损害。
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