公开(公告)号：EP1085792B1

公开(公告)日：2008-12-31

申请号：EP00118351.6

申请日：2000-08-24

Applicant: Curamik Electronics GmbH

Inventor： Schulz-Harder, Jürgen Dr.Ing ,  Meyer, Andreas

IPC: H05K3/40

CPC classification number: H05K3/4046 ,  H05K1/0306 ,  H05K3/4084 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2203/0195 ,  H05K2203/063

公开(公告)号：EP1993334A2

公开(公告)日：2008-11-19

申请号：EP08251736.8

申请日：2008-05-16

Applicant: NEC Lighting, Ltd.

Inventor： Okimura, Katsuyuki c/o NEC Lighting Ltd.

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  F21V19/003 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L2224/48091 ,  H05K1/05 ,  H05K1/056 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00014

Abstract: A lighting device of the present invention includes light emitting unit 20 having a light emitting element installed on a board, and body 11 having light emitting unit 20 mounted thereon. Body 11 has graphite having anisotropic heat conductivity, and the graphite has inner wall 11c in thermal contact with light emitting unit 20. The anisotropy of the graphite has direction Z having a first heat conductivity and direction X 1 having a second heat conductivity that is higher than the first heat conductivity. Inner wall 11 c of the graphite to which heat generated from light emitting unit 20 is transferred is formed to intersect with direction X 1 .

Abstract translation: 本发明的照明装置包括具有安装在板上的发光元件的发光单元20和安装有发光单元20的主体11。 主体11具有各向异性导热性的石墨，并且石墨具有与发光单元20热接触的内壁11c。石墨的各向异性具有具有第一导热性的方向Z和具有更高的第二导热性的方向X 1 比第一导热系数。 形成从发光单元20产生的热量的石墨的内壁11c与方向X 1相交。

公开(公告)号：EP1962566A2

公开(公告)日：2008-08-27

申请号：EP08250573.6

申请日：2008-02-19

Applicant: SIIX Corporation

Inventor： Matsushima, Yoshihiko

IPC: H05K1/02

CPC classification number: H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

Abstract: A surface mount circuit board includes: an insulating substrate (1) having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members (12) each filing a different one of the though holes; lands (13) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members (14) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.

公开(公告)号：EP1195746A3

公开(公告)日：2008-06-04

申请号：EP01302534.1

申请日：2001-03-20

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: G11B5/48

CPC classification number: H01L23/3135 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/4334 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) andthe second supporting member (24).

公开(公告)号：EP1901406A1

公开(公告)日：2008-03-19

申请号：EP06746850.4

申请日：2006-05-25

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： ISODA, Masaaki ,  TAKAMURA, Kazuhiro ,  YAMAUCHI, Tokushi ,  KIYOZUMI, Katsuyuki ,  NISHIHAMA, Nobumichi

IPC: H01R33/06

CPC classification number: F21V29/56 ,  F21K9/00 ,  F21S2/005 ,  F21V19/0025 ,  F21V23/06 ,  F21Y2115/10 ,  H01R13/22 ,  H01R13/514 ,  H05K1/0204 ,  H05K1/142 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/209 ,  Y10S439/928

Abstract: The present invention relates to a socket for electronic component which contains an electronic component. The socket (1) for electronic component comprises a platy base (2), containers (3) formed to be concaved on a front face (2a) of the base (2) and to contain LED packages (10) therein, connectors (4) and (5) provided on side faces (2b) and (2c) and connected to other members, supports (6) each of which supports and fixes the LED package (10) contained in the container (3) and electrically connected to the LED package (10), heat conductors (7) each of which is provided continuously from a bottom face side of the container (3) to a rear face of the base (2) and contacts the LED package (10) contained in the container (3) so as to conduct heat generated by the LED package (10), and terminals (8a) electrically connected to the other members coupled with the connectors (4) and (5) and the supports (6). The heat generated by the LED package (10) is conducted to the rear face of the base (2) through the heat conductors (7), and effectively radiated to an installation member (P) on which the socket (1) for electronic component is mounted.

公开(公告)号：EP1018146A4

公开(公告)日：2007-10-17

申请号：EP99925964

申请日：1999-05-27

Applicant: DET INT HOLDING LTD

Inventor： JITARU IONEL

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20 ,  H01L21/00

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A transformer group in which a multitude of transformers (110A and 110B) are used to supply energy to a single load. The transformers (110A and 110B) are connected in series; in order to assist in providing a "flux equalizing" effect, the invention includes a flux equalizer circuit (112A and 112B). The flux equalizer circuit (112A and 112B) provides a series of flux windings. Each flux winding is associated with a single transformer. The windings are arranged in parallel. In this manner, a balancing of the output of the transformers is obtained; the power output from each transformer is "sensed" by its associated flux winding which is "shared" with the other transformers via their own associated flux winding. Power is processed then through the secondary windings, rectifiers, and output filters to a common load.

公开(公告)号：EP1825728A1

公开(公告)日：2007-08-29

申请号：EP04800414.7

申请日：2004-11-30

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ)

Inventor： SANDWALL, Johan

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10416 ,  Y10T29/49124

Abstract: The invention discloses a PBA, (100, 300), comprising a first supporting layer (130, 330) of a non-conducting material, a first layer (120, 320) of a conducting material, a first electronics component (110, 310) and a first cooling component (140, 340) for transporting heat from the first electronics component. The first electronics component (110, 310) is surface mounted on the PBA, at least partially over the first cooling component (140, 340), and the first cooling component (140, 340) is arranged integrally in the PBA (100, 300). The first cooling component (140, 340) is arranged in the PBA (100, 300) to transport heat from the first electronics component (110, 310) in a first direction (x) essentially perpendicular to a first main surface (101, 301) of the PBA, and in a second main direction (y) essentially parallel to said first main surface of the PBA.

公开(公告)号：EP1624739A1

公开(公告)日：2006-02-08

申请号：EP04018409.5

申请日：2004-08-03

Applicant: Catem GmbH & Co. KG

Inventor： Clade, Michael ,  Kachelhoffer, Patrick ,  Bohlender, Franz

IPC: H05K7/20 ,  B60H1/22

CPC classification number: H05K1/0204 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/1059

Abstract: Die vorliegende Erfindung betrifft eine elektrische Heizvorrichtung als Zusatzheizung für Kraftfahrzeuge, bei der das Heizregister und die Steuervorrichtung zu einer baulichen Einheit integriert sind. Zur Ansteuerung der Heizelemente des Heizregisters sind direkt auf der Leiterplatte (110) montierte Leistungstransistoren (119) vorgesehen. Zur effizienten Abführung der Verlustwärme von den Leistungstransistoren werden diese direkt über Öffnungen (140) in der Leiterplatte an ihrer Unterseite von einem Kühlelement (150) kontaktiert. Um die Herstellung zu vereinfachen, ist das Kühlelement als stiftförmiger Vollkörper ausgebildet. Zur Anbindung an den Leistungstransistor ist das Kühlelement in die jeweilige Öffnung eingesetzt und ragt aus der Unterseite der Leiterplatte senkrecht heraus.

Abstract translation: 电动车辆加热装置具有块中的多个加热元件，并入块中的加热元件控制装置，布置在导电板上的晶体管，以及通过导电板中的孔连接到晶体管的冷却元件。 冷却元件是插入孔（140）中的钉状固体，固定在晶体管（119）上，并从导电板的下侧垂直突出。

公开(公告)号：EP1610596A1

公开(公告)日：2005-12-28

申请号：EP05253641.4

申请日：2005-06-13

Applicant: Radstone Technology PLC

Inventor： Ireland, Robert Mowat ,  Kirk, Graham Charles ,  Boocock, John Albert ,  Isles, Michael Arthur

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K7/205 ,  H05K2201/066 ,  H05K2201/10416

Abstract: A circuit card assembly comprises a PCB (1) having first and second opposing major faces with a first pair of elongated edges (4, 5) extending therebetween. Heat management layers are disposed within the CCA and/or PCB (1), which extend to said edges (4,5), and a thermally conductive bar (8) is engaged in a slot (6) provided in each of the elongated edges (4, 5). Each conductive bar (8) extends over at least the thickness of the PCB (1), one face preferably being flush with one of the major faces of the PCB (1) and is thermally connected to the heat management layer(s) by thermal connecting means so as to conduct heat from the or each heat management layer to said bar (8).

Abstract translation: 电路卡组件包括具有第一和第二相对主面的PCB（1），其间延伸有第一对细长边缘（4,5）。 热管理层设置在CCA和/或PCB（1）内，其延伸到所述边缘（4,5），并且导热棒（8）接合在设置在每个细长边缘中的狭槽（6）中 （4,5）。 每个导电棒（8）至少延伸PCB（1）的厚度，一个面优选地与PCB（1）的主面之一齐平，并通过热量热连接到热管理层 连接装置，以便将热量从每个热管理层传导到所述条（8）。

公开(公告)号：EP1415369B1

公开(公告)日：2005-10-19

申请号：EP02759265.8

申请日：2002-08-06

Applicant: 3M Innovative Properties Company

Inventor： KAWATE, Kohichiro

IPC: H01R4/04

CPC classification number: H05K3/4614 ,  H01R4/04 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K2203/1189

Abstract: A batch electrically connecting sheet makes it possible to form an electric connection with mechanical, thermal, and electrical stability at plural points of contact. A batch electrically connecting sheet comprises a heat-resistant sheet having plural perforations, conductive blocks, inserted in the perforations, having ridges including indentations and projections; the projections are outstanding from the perforations, and the conductive blocks are thicker than the heat-resistant sheet, and the heat-resistant sheet has an adhesive layer composed of a heat curable adhesive agent applied on at least one surface thereof, covering the projections of the conductive blocks.