公开(公告)号：EP1810385A2

公开(公告)日：2007-07-25

申请号：EP05812562.6

申请日：2005-10-18

Applicant: AgiLight, Inc.

Inventor： GREGORY, John

IPC: H02H1/00

CPC classification number: H05K3/0052 ,  F21S4/20 ,  F21Y2115/10 ,  H01L33/48 ,  H01L2924/0002 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A lightwire (120) segment in the form of an elongated substrate frame (12) composed of a flat flexible thin elongated sheet of plastic dielectric material having a copper film (14) laminated on at least one side; a plurality of cavities (17) longitudinally spaced along th elongated substrate (12), a LED diode (10) having first and second contacts (18) embedded in each of the cavities (17) of the substrat (12); the copper film (14) on one side of the substrate (12) defining two interconnects (34, 35) separated by a dielectric space, one interconnect (34 or 35) having a tab (46) bonded to the first contact (18) of each LED diode (10), and the other interconnect (34 or 35) having a tab (46) bonded to the second contact (18) of each LED diode (10). A lightwire (120) made from a plurality of segment that are bonded together in series or parallel. A micropackage made from a substrate frame (12) composed of a flat flexible thin shee of plastic dielectric material having a copper film (14) laminated on one side defining rows and columns of component sites separated from one another by thin webs to be readily detached from the substrate frame (12). The micropackage has indexing elements to position the substrate frame (12) relative to a machine that can pick the component sites out of the frame. Each component site define a cavity (17) formed in the substrate (12), and the copper film (14) laminated on the substrate defines two separated interconnects (34 35), each having a tab (46) extending into the cavity (17) formed in the substrate (12). An electrical component having contacts (18) i positioned in the cavity (17) and its contacts (18) are bonded to the tabs (46).

公开(公告)号：EP1172901B1

公开(公告)日：2007-01-03

申请号：EP01305721.1

申请日：2001-07-02

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yuasa, Eriko c/o Intellectual Property Dep. Sumito ,  Yamakawa, Shuji c/o Intellectual Property Dept. Su ,  Kato, Shinshu c/o Intellectual Property Dept. Sumi

IPC: H01R25/00

CPC classification number: H05K1/0256 ,  H01R4/70 ,  H01R25/00 ,  H05K1/0284 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/10272

公开(公告)号：EP1186478B1

公开(公告)日：2006-12-20

申请号：EP01307584.1

申请日：2001-09-06

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Kasai, Koji, c/o Sumitomo Wiring Systems, Ltd.

IPC: B60R16/02 ,  H05K7/02 ,  B23K11/20

CPC classification number: H05K3/328 ,  H05K3/244 ,  H05K7/026 ,  H05K2201/0397 ,  H05K2201/10272 ,  Y10S439/949

公开(公告)号：EP1719121A1

公开(公告)日：2006-11-08

申请号：EP05705769.7

申请日：2005-01-13

Applicant: 3M Innovative Properties Company

Inventor： DODSWORTH, Robert S., 3M Center ,  MAO, Guoping, 3M Center ,  RICHMOND, Vicki L., 3M Center ,  YANG, Rui, 3M Center

IPC: G11B5/48 ,  H05K3/00 ,  C08J7/12

CPC classification number: B32B15/08 ,  B32B38/10 ,  B32B2311/00 ,  B32B2379/08 ,  C08J7/12 ,  C09K13/02 ,  G11B5/484 ,  G11B5/486 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/002 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2203/0353 ,  H05K2203/0786 ,  H05K2203/0793 ,  Y10T156/1052 ,  Y10T428/12

Abstract: An etched dielectric film for use in a hard disk drive. The dielectric film has a thickness of about 25µm or greater when it is attached to a supporting metal substrate, and is subsequently etched to a thickness of about 20µm or less.

公开(公告)号：EP1429589A3

公开(公告)日：2006-09-27

申请号：EP03028364.2

申请日：2003-12-10

Applicant: Marquardt GmbH

Inventor： Neitzel, Roland ,  Stegerwald, Gerhard

IPC: H05K3/32 ,  H05K1/11 ,  H01R12/38

CPC classification number: H01R12/585 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: Die Erfindung betrifft einen Schaltungsträger (3) für eine elektrische Schaltung, insbesondere in der Art einer wenigstens teilweise flexiblen Leiterplatte. Der Schaltungsträger (3) weist elektrische, elektronische o. dgl. Bauteile (2), wie einen Elektromotor (2a), Schalter (2b), Widerstand, Kondensator, Spule, IC, Steckanschluß o. dgl. auf. Weiter besitzt der Schaltungsträger (3) Leiterbahnen zur elektrischen Verbindung der Bauteile (2) sowie Kontaktflächen (5) zur elektrischen Kontaktierung der Bauteile (2). Die Kontaktfläche (5) ist wenigstens teilweise in der Ebene des Schaltungsträgers (3) freigeschnitten, derart daß die Kontaktfläche (5) eine Flexibilität in eine außerhalb der Ebene (6) des Schaltungsträgers (3) verlaufende Richtung aufweist, insbesondere in der Art einer Kontaktzunge. Ein Kontaktelement (8) zur elektrischen Kontaktierung des Bauteils (2) liegt mit einem Anpreßdruck derart an der Kontaktfläche (5) an, daß die Kontaktfläche (5) aus der Ebene (6) des Schaltungsträgers (3) ausgelenkt ist.

公开(公告)号：EP1659837A1

公开(公告)日：2006-05-24

申请号：EP05023091.1

申请日：2005-10-22

Applicant: Hirschmann Automotive GmbH

Inventor： Kreuter, Markus ,  Schmid, Martin

IPC: H05K1/00 ,  H05K3/32 ,  H01R9/22 ,  H01R9/24

CPC classification number: H01R9/2458 ,  H01R9/226 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0397

Abstract: Die Erfindung betrifft ein Stanzgitter (1) mit Leitungsbereichen (2) und Kontaktflächen (3, 4) zur elektrischen Kontaktierung eines Bauteiles (6, 7, 8), wobei erfindungsgemäss vorgesehen ist, dass das Stanzgitter (1) in einem Montagebereich (5) zur elektrischen Kontaktierung und mechanischen Festlegung des Bauteiles (8) an dem Stanzgitter (1) ausgebildet ist.

Abstract translation: 引线框架具有用于电连接部件（6,7,8）的导体区域（2）和接触焊盘。 引线框架具有用于将部件（8）电接触和机械固定到引线框架的安装区域（5）。 安装区域优选为篮状，并且对插入的部件施加力。

公开(公告)号：EP1442503B1

公开(公告)日：2006-05-03

申请号：EP02779521.0

申请日：2002-10-31

Applicant: Leopold Kostal GmbH & Co. KG ,  SOLARWORLD AKTIENGESELLSCHAFT

Inventor： BERGMANN, Eduard ,  RILLING, Herwig ,  WESTERMAYR, Peter ,  HOFBAUER, Clemens ,  KLEBENSBERGER, Boris ,  WAMBACH, Karsten

IPC: H01R9/24

CPC classification number: H05K3/202 ,  H01L31/02013 ,  H01R13/24 ,  H01R13/665 ,  H01R43/24 ,  H02S40/34 ,  H02S40/345 ,  H05K1/187 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10651 ,  Y02E10/50 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/53174 ,  Y10T29/53209 ,  Y10T29/53265

Abstract: The invention relates to an assembly comprised of a panel-like constructed electrical/electronic module (7) comprising a flat surface with exposed, contactable connection sections AS serving as a part of an essentially flat conductor track structure for electrically connecting the module (7). The assembly also comprises a connection unit (1) provided with electrical/electronic elements D, which are located on a conductor track structure (2) situated in a plane parallel to the conductor track structure of the module (7). In addition, the assembly is fitted with means for contacting connection sections of the module whereby enabling the module to be electrically connected via the connection unit. The means for contacting the connection sections AS of the module (7) are bent out from the plane of the conductor track structure (2), and are connection sections AA that represent a portion of the conductor track structure. The connection sections AS of the module (7) are rigid and are electrical conductor sections AS that can be bent out from the plane of the conductor track structure of the module (7). Connection sections AA of the connection unit (1) are arranged according to the arrangement of connection sections AS of the module (7) so that when the connection unit (1) is connected to the module (7), one connection segment AS of the module (7) and one of the connection unit (1) are electrically connected to one another, abut against one section, and, in the area in which they abut, are situated in a spatial position different from that of the planes of the conductor track structures (2).

公开(公告)号：EP1255338B1

公开(公告)日：2005-12-28

申请号：EP02252662.8

申请日：2002-04-15

Applicant: Eldre Corporation

Inventor： Bader, Craig C. ,  Norman, Robert A., Jr.

IPC: H02G5/00

CPC classification number: H05K1/0256 ,  H02G5/005 ,  H05K2201/0397 ,  H05K2201/10272 ,  Y10S439/951

公开(公告)号：EP1545172A1

公开(公告)日：2005-06-22

申请号：EP04257972.2

申请日：2004-12-20

Applicant: BROTHER KOGYO KABUSHIKI KAISHA

Inventor： Ito, Koji c/o T. P. & IP Dept, Brother Kogyo K. K.

IPC: H05K3/24 ,  H05K1/02 ,  H01L23/498

CPC classification number: H01L23/4985 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K1/0393 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2203/0191 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A tape substrate (110) includes IC lands (113) electrically connected to pins of a driver IC (integrated circuit) (80), circuit board terminal lands (112) electrically connected to an external circuit board, test lands (115) for testing the driver IC (80) mounted on the tape substrate (110), and a plating terminal (116) used for plating the land (112,114). The test lands (115) are arranged in matrix. The plating terminal (116) is disposed so as to surround the IC lands (113), the circuit board terminal lands (112), and the test lands (115).

Abstract translation: 一种带衬底（110）包括集成电路焊盘（113）电连接到用于测试的驱动器IC（集成电路）（80），电路板端子焊盘（112）电连接到外部电路板，测试焊盘（115）的销 驱动器IC（80）安装在带衬底（110），以及用于电镀的国家（112114）的电镀终端（116）。 测试焊盘（115）被布置在矩阵中。 电镀终端（116）被布置成围绕所述IC焊盘（113），所述电路板端子焊盘（112），并且测试焊盘（115）。

公开(公告)号：EP1524691A2

公开(公告)日：2005-04-20

申请号：EP04023965.9

申请日：2004-10-07

Applicant: Tyco Electronics Raychem GmbH

Inventor： Frisch, Michael

IPC: H01L23/367

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/10166 ,  H01L2924/00

Abstract: The present invention relates to a power unit comprising at least one power electronics module (106), a circuit carrier (102), which is connected to said power electronics module, and at least one heat sink (114), which is connected to said power electronics module, in order to dissipate heat. The invention also relates to an associated heat sink and a corresponding assembly method. In order to provide a power unit (100) and an associated assembly method which allows improved dissipation of air heat, as well as adequate electrical insulation of the power modules and simplified implementation, the circuit carrier (102) comprises at least one through hole (108). At least one contact extension (118), which is at least partially received by the through hole (108), is moulded onto the heat sink (114), and the contact extension (118) of the heat sink (114) is thermally contacted with the power electronics module (106) by means of a heat-conductive material.

Abstract translation: 技术领域本发明涉及一种功率单元，其包括至少一个功率电子模块（106），连接到所述功率电子模块的电路载体（102）和至少一个散热器（114），其连接到所述 电力电子模块，以散热。 本发明还涉及相关联的散热器和相应的组装方法。 为了提供功率单元（100）和相关联的组装方法，其允许改善空气热量的耗散，以及功率模块的充分电绝缘和简化的实现，电路载体（102）包括至少一个通孔（ 108）。 至少部分地由通孔（108）容纳的接触延伸部（118）被模制到散热器（114）上，并且散热器（114）的接触延伸部（118）被热接触 与电力电子模块（106）通过导热材料。