公开(公告)号：EP2677557A1

公开(公告)日：2013-12-25

申请号：EP12172934.7

申请日：2012-06-21

Applicant: Industrial Technology Research Institute

Inventor： Lin, Hsiu-Jen ,  Lin, Jian-Shian ,  Chen, Shau-Yi ,  Tsai, Jen-Hui

IPC: H01L33/62

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/29109 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83207 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/00

Abstract: A method for bonding an LED wafer, a method for manufacturing an LED chip, and a bonding structure are provided. The method for bonding an LED wafer includes the following steps. A first metal film is formed on an LED wafer. A second metal film is formed on a substrate. A bonding material layer whose melting point is lower than or equal to about 110°C is formed on the surface of the first metal film. The LED wafer is placed on the substrate.
The bonding material layer is heated at a pre-solid reaction temperature for a pre-solid time to perform a pre-solid reaction. The bonding material layer is heated at a diffusion reaction temperature for a diffusing time to perform a diffusion reaction, wherein the melting points of the first and the second inter-metallic layers after diffusion reaction are higher than about 110°C.

Abstract translation: 提供一种用于结合LED晶片的方法，制造LED芯片的方法和接合结构。 用于接合LED晶片的方法包括以下步骤。 在LED晶片上形成第一金属膜。 在基板上形成第二金属膜。 在第一金属膜的表面上形成熔点低于或等于约110℃的接合材料层。 将LED晶片放置在基板上。 将粘合材料层在预固体反应温度下加热预固化时间以进行预固体反应。 接合材料层在扩散反应温度下加热扩散时间进行扩散反应，其中扩散反应后第一和第二金属间层的熔点高于约110℃。

公开(公告)号：EP1830399A4

公开(公告)日：2012-07-11

申请号：EP05816822

申请日：2005-12-14

Applicant: PANASONIC CORP

Inventor： KITAE TAKASHI ,  KARASHIMA SEIJI ,  HIRANO KOICHI ,  KOJIMA TOSHIYUKI ,  NAKATANI SEIICHI ,  KOMATSU SHINGO ,  YAMASHITA YOSHIHISA

IPC: H01L21/60 ,  H01L21/48

CPC classification number: H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP1830399A1

公开(公告)日：2007-09-05

申请号：EP05816822.0

申请日：2005-12-14

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： KITAE, Takashi c/o Matsushita Electric Industrial Co., Ltd. ,  KARASHIMA, Seiji c/o Matsushita Electric Industrial Co., Ltd. ,  HIRANO, Koichi c/o Matsushita Electric Industrial Co., Ltd. ,  KOJIMA, Toshiyuki c/o Matsushita Electric Industrial Co., Ltd. ,  NAKATANI, Seiichi c/o Matsushita Electric Industrial Co., Ltd. ,  KOMATSU, Shingo c/o Matsushita Electric Industrial Co., Ltd. ,  YAMASHITA, Yoshihisa c/o Matsushita Electric Industrial Co., Ltd.

IPC: H01L21/60 ,  H01B1/22

CPC classification number: H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

Abstract: There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

Abstract translation: 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括树脂，金属颗粒和在加热树脂13时沸腾的对流添加剂12.在加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和每个电极 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：EP3503227A2

公开(公告)日：2019-06-26

申请号：EP18208056.4

申请日：2018-11-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KITAURA, Hidetoshi ,  FURUSAWA, Akio ,  HINE, Kiyohiro

IPC: H01L33/64 ,  H01L23/373 ,  H01L21/58 ,  B23K35/26

CPC classification number: H01L33/641 ,  B23K35/262 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/005 ,  H01L33/644 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/27849 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83399 ,  H01L2224/83493 ,  H01L2224/83815 ,  H01L2924/12041 ,  H01L2924/15763 ,  H01L2933/0075 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/0104 ,  H01L2924/01023 ,  H01L2924/00014 ,  H01L2224/05155

Abstract: A joining material (101) includes: at least one type of element at 0.1 wt% to 30 wt%, the element being capable of forming a compound with each of tin and carbon; and tin at 70 wt% to 99.9 wt% as a main component. The at least one type of element comprises at least one selected from the group consisting of titanium, zirconium and vanadium. The joining material (101) is used for fabrication of a semiconductor device, wherein the joining material (101) is joined to a carbon base (102) upon heating up to 1200°C with formation of a compound (103) of carbon, tin and the element being capable of forming a compound with each of tin and carbon at the interface between the joining material (101) and the carbon base (102), and then a light emitting element (106) is joined to the jointing material (101) upon heating up to 350°C. The joining material preferably comprises the element capable of forming a compound with each of tin and carbon at 0.1 wt% to 10 wt%, more preferably at 5 wt% to 10 wt%.

公开(公告)号：EP2739428B1

公开(公告)日：2015-10-14

申请号：EP12780077.9

申请日：2012-07-26

Applicant: Hesse GmbH

Inventor： HESSE, Hans-Jürgen ,  BRÖKELMANN, Michael

IPC: B23K20/10 ,  B06B1/06

CPC classification number: B23K20/10 ,  B06B1/0607 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83206 ,  H01L2224/83207 ,  H01L2224/83208 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2560468A1

公开(公告)日：2013-02-20

申请号：EP11178151.4

申请日：2011-08-19

Applicant: ABB Research Ltd.

Inventor： Liu, Chunlei ,  Schulz, Nicola ,  Kicin, Slavo

IPC: H05K3/32

CPC classification number: H05K3/321 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/82201 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83906 ,  H01L2224/97 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K2201/10674 ,  H05K2203/1131 ,  H05K2203/1484 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/83

Abstract: A method of connecting elements (102-106) of a plurality of elements (102-106) to one another is described. The method comprises applying solder material (110) on a first element (102) of the plurality of elements (102-106). The solder material (110) comprises a liquidus temperature. The method comprises applying sinter material (108) on a second element (103) of the plurality of elements (102-104). The sinter material (108) comprises a sintering temperature. The method comprises assembling the first element (102) and a third element (104, 504) of the plurality of elements (102-106), assembling the second element (103) and a fourth element (106) of the plurality of elements (102-106), soldering the first element (102) and the third element (104) to one another, and sintering the second element (103) and the fourth element (106) to one another. In order to accomplish short process duration, reduced costs and an increased throughput, the sintering and the soldering are simultaneously executed.

Abstract translation: 被描述的元件（102-106），以彼此的多个连接元件（102-106）的方法。 该方法包括的元素的多元性（102-106）的第一元件（102）上施加的焊料材料（110）。 焊接材料（110）包括的液相线温度。 该方法包括的元素的多元性（102-104）的第二元件（103）上施加烧结材料（108）。 的烧结材料（108）包括烧结温度。 该方法包括组装元件的多元性（102-106）的所述第一元件（102）和第三元件（104，504），在组装所述第二元件（103）和元素的多个第四元件（106）（ 102-106），焊接所述第一元件（102）和所述第三元件（104）彼此连接，和烧结所述第二构件（103）和所述第四元件（106）彼此连接。 为了实现短的持续时间的过程，降低了成本，在增加产量，烧结和焊接被同时执行。

公开(公告)号：EP1865550A4

公开(公告)日：2012-07-11

申请号：EP06729267

申请日：2006-03-16

Applicant: PANASONIC CORP

Inventor： KARASHIMA SEIJI ,  KITAE TAKASHI ,  NAKATANI SEIICHI

IPC: H01L21/60 ,  H05K3/36

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP1865549A4

公开(公告)日：2012-07-11

申请号：EP06729266

申请日：2006-03-16

Applicant: PANASONIC CORP

Inventor： KARASHIMA SEIJI ,  KITAE TAKASHI ,  NAKATANI SEIICHI

IPC: H01L21/60 ,  H01L21/48 ,  H01R12/50

CPC classification number: H05K3/3484 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP0982385A4

公开(公告)日：2001-09-12

申请号：EP98919557

申请日：1998-05-11

Applicant: FUJITSU LTD

Inventor： DATE HIROAKI ,  MOTOYAMA YUKO ,  TOKUHIRA HIDESI ,  USUI MAKOTO ,  IMAIZUMI NOBUHIRO

IPC: C09J4/06 ,  C09J4/02 ,  C09J5/06 ,  C09J9/02 ,  C09J163/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/03 ,  H05K3/30 ,  H05K3/38 ,  C09J5/04 ,  H01B1/20 ,  H01L21/52

CPC classification number: H01L24/28 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29373 ,  H01L2224/29386 ,  H01L2224/2949 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/386 ,  Y10T156/1011 ,  Y10T156/1018 ,  Y10T156/1026 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.