公开(公告)号：EP1272550A1

公开(公告)日：2003-01-08

申请号：EP01918815.0

申请日：2001-03-16

Applicant: PPG Industries Ohio, Inc.

Inventor： LAWTON, Ernest, L. ,  VELPARI, Vedagiri ,  RICE, William, B. ,  ROBERTSON, Walter, J. ,  NOVICH, Bruce, E. ,  WU, Xiang ,  LAMMON-HILINSKI, Kami

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/26 ,  C03C25/00 ,  C03C25/10 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2964 ,  Y10T442/20 ,  Y10T442/3049

Abstract: The present invention provides a fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. The present invetion also provides a reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.

公开(公告)号：EP1255797A1

公开(公告)日：2002-11-13

申请号：EP00992510.8

申请日：2000-11-16

Applicant: ELECTROCHEMICALS INC.

Inventor： BERNARDS, Roger ,  GONZALEZ, Hector ,  KUCERA, Al ,  SCHANHAAR, Mike

IPC: C09K13/00 ,  B32B31/00

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. The adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier (Fig.1), and a uniformity enhancer (Fig.2). A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate.

公开(公告)号：EP1124769A1

公开(公告)日：2001-08-22

申请号：EP99952920.9

申请日：1999-10-08

Applicant: PPG Industries Ohio, Inc. ,  Lawton, Ernest L. ,  Wu, Xiang ,  Rice, William B. ,  Novich, Bruce E.

Inventor： LAWTON, Ernest, L. ,  WU, Xiang ,  RICE, William, B. ,  NOVICH, Bruce, E.

IPC: C03C25/00

CPC classification number: H05K1/0366 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides a coated fiber strand comprising at least one fiber having a layer of a dried residue of a resin compatible coating composition on at least a portion of a surface of the at least one fiber, the resin compatible coating composition comprising: a) a plurality of discrete, dimensionally stable particles formed from materials selected from the group consisting of organic materials, polymeric materials, composite materials and mixtures thereof that provide an interstitial space between the at least one fiber and at least one adjacent fiber, the particles having an average particle size of about 0.1 to 5 micrometers; b) at least one lubricious material; c) at least one polymeric film former; and d) at least one coupling agent, and a fabric incorporating at least one of the fiber strands.

公开(公告)号：EP0849795A3

公开(公告)日：1998-12-02

申请号：EP97119324.8

申请日：1997-11-05

Applicant: LSI LOGIC CORPORATION

Inventor： Eslamy, Mohammad ,  Raab, Kurt R. ,  McCormick, John

IPC: H01L23/498 ,  H01L23/538

CPC classification number: H01L23/4985 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/14 ,  H05K3/0061 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/10681 ,  H05K2203/0278 ,  H01L2924/00

Abstract: A method and apparatus for connecting a Tape Automated Bonding (TAB) film to a baseplate. The baseplate may be a heat spreader having a cavity for receiving a semiconductor chip disposed within the TAB film. A pressure-sensitive adhesive coupon may be positioned between the TAB film and the baseplate, thereby connecting the TAB film to the baseplate. An adhesion promoter containing an organofunctional group and a silicon-functional group may be disposed between the adhesive coupon and each of its mating surfaces (i.e., the TAB film and the baseplate) to increase adhesion between the adhesive coupon and the mating surfaces. The adhesion promoter preferably forms covalent bonds with the adhesive coupon and with each of the mating surfaces.

公开(公告)号：EP0849795A2

公开(公告)日：1998-06-24

申请号：EP97119324.8

申请日：1997-11-05

Applicant: LSI LOGIC CORPORATION

Inventor： Eslamy, Mohammad ,  Raab, Kurt R. ,  McCormick, John

IPC: H01L23/498 ,  H01L23/538

CPC classification number: H01L23/4985 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/14 ,  H05K3/0061 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/10681 ,  H05K2203/0278 ,  H01L2924/00

Abstract: A method and apparatus for connecting a Tape Automated Bonding (TAB) film to a baseplate. The baseplate may be a heat spreader having a cavity for receiving a semiconductor chip disposed within the TAB film. A pressure-sensitive adhesive coupon may be positioned between the TAB film and the baseplate, thereby connecting the TAB film to the baseplate. An adhesion promoter containing an organofunctional group and a silicon-functional group may be disposed between the adhesive coupon and each of its mating surfaces (i.e., the TAB film and the baseplate) to increase adhesion between the adhesive coupon and the mating surfaces. The adhesion promoter preferably forms covalent bonds with the adhesive coupon and with each of the mating surfaces.

Abstract translation: 用于将带式自动接合（TAB）膜连接到基板的方法和装置。 基板可以是散热器，其具有用于接收设置在TAB膜内的半导体芯片的空腔。 压敏粘合剂试片可以定位在TAB膜和基板之间，从而将TAB膜连接到基板。 含有有机官能团和硅官能团的粘合促进剂可以设置在粘合剂试片和其每个配合表面（即TAB薄膜和底片）之间，以增加粘合剂试片和配合表面之间的粘合性。 粘合促进剂优选与粘合剂试片和每个配合表面形成共价键。

公开(公告)号：EP0768313A3

公开(公告)日：1998-04-29

申请号：EP96306623.8

申请日：1996-09-12

Applicant: Dow Corning Toray Silicone Company Limited

Inventor： Hayashi, Masayuki, Dow Corning Toray Silicone Co. ,  Iwai, Makoto, Dow Corning Toray Silicone Co. Ltd.

IPC: C07F7/18 ,  C03C25/00

CPC classification number: C07F7/1836 ,  C03C25/40 ,  H05K1/0366 ,  H05K2201/0239 ,  Y10T428/2962

Abstract: This invention relates to treating agents, glass fiber substrates treated with such agents, and the subsequent use of these substrates in molded, glass fiber reinforced resins that are suited to copper clad laminates, composite base materials, printed wiring boards such as mass lamination boards, and, in particular, multilayer printed wiring boards.

Abstract translation: 本发明涉及处理剂，用这些试剂处理的玻璃纤维基材，以及随后在适用于覆铜层压板的模制玻璃纤维增​​强树脂中使用这些基材，复合基材，印刷线路板如大块层压板， 特别是多层印刷电路板。

公开(公告)号：EP0807703A1

公开(公告)日：1997-11-19

申请号：EP97107832.4

申请日：1997-05-14

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

Inventor： Sakai, Masayuki ,  Hatanaka, Hideo ,  Tsukamoto, Masahide ,  Nakatani, Seiichi ,  Okano, Masayuki ,  Kojima, Tamao

IPC: D04H1/00 ,  D04H1/58 ,  H05K1/03 ,  D21H13/18

CPC classification number: H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250°C)/E' (30°C)) and a 0.05 or less loss tangent (Tanδ ) peak value at 30-250°C, and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Abstract translation: 一种包含芳族聚酰胺纤维并具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切（Tanδ）的印刷线路板的无纺布基底 ）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

公开(公告)号：EP0736568A1

公开(公告)日：1996-10-09

申请号：EP96104407.0

申请日：1996-03-19

Applicant: COSMO RESEARCH INSTITUTE ,  COSMO OIL COMPANY, LTD

Inventor： Mizoguchi, Takashi ,  Iwafune, Masatoshi

IPC: C08K3/36 ,  C08K3/38 ,  C08L71/12 ,  C08L79/08

CPC classification number: H05K1/0373 ,  C08J7/045 ,  C08J2379/08 ,  C08K3/36 ,  C08K3/38 ,  C08K2201/016 ,  C08L71/123 ,  C08L79/08 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0773 ,  H05K2203/0793 ,  Y10T428/249958 ,  Y10T428/249978 ,  Y10T428/31605 ,  C08L71/12 ,  C08L2666/20 ,  C08L2666/14 ,  C08L71/00

Abstract: A resin composition for plating comprising a thermoplastic resin and aluminum borate or amorphous silica, or both as an inorganic filler. The resin composition exhibits excellent plating characteristics and excellent electrical characteristics.

Abstract translation: 一种用于电镀的树脂组合物，包括热塑性树脂和硼酸铝或无定形二氧化硅，或两者都是无机填料。 树脂组合物表现出优异的电镀特性和优异的电特性。

公开(公告)号：EP0531764A1

公开(公告)日：1993-03-17

申请号：EP92114138.8

申请日：1992-08-19

Applicant: International Business Machines Corporation

Inventor： Afzali-Ardakani, Ali ,  Braren, Bodil E. ,  Daijavad, Shahrokh ,  Hodgson, Rodney T. ,  Molis, Steven E. ,  Viehbeck, Alfred

IPC: C08L79/08 ,  C08K9/02 ,  C08K3/04

CPC classification number: H05K1/0373 ,  C08K3/04 ,  C08K9/02 ,  H05K1/0346 ,  H05K3/105 ,  H05K2201/0154 ,  H05K2201/0239 ,  H05K2201/0323 ,  H05K2201/068 ,  C08L79/08

Abstract: A composition of matter is disclosed comprising a composite of fluorinated particulate carbon dispersed in a polyimide polymer, the fluorinated carbon being present in an amount sufficient to substantially reduce the TCE of the polyimide and in an amount also sufficient to increase or decrease the dielectric constant of the composition when the composite is heated slowly or quickly to temperatures of about 400°C.
The composite can be made conductive by irradiating it with an UV excimer laser.

Abstract translation: 公开了一种物质组合物，其包含分散在聚酰亚胺聚合物中的氟化颗粒碳的复合物，氟化碳的存在量足以基本上降低聚酰亚胺的TCE，并且其量足以增加或降低介电常数 当复合材料被缓慢或快速地加热到约400℃的温度时的组成。通过用UV准分子激光器照射复合材料可以使其复合。

公开(公告)号：EP0468476A2

公开(公告)日：1992-01-29

申请号：EP91112420.4

申请日：1991-07-24

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Ishii, Kenji, c/o Mitsubishi Gas Chemical Co. Inc. ,  Nakai, Takamasa, c/o Mitsubishi Gas Chemical ,  Matsumoto, Hiroyuki, c/o Mitsubishi Gas Chemical

IPC: B32B15/14 ,  B32B27/04 ,  C08J5/24

CPC classification number: B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/30 ,  B32B2457/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  Y10S428/901 ,  Y10T442/3415 ,  Y10T442/3439 ,  Y10T442/656

Abstract: A metal foil-clad laminate obtained by lamination molding a resin-impregnated substrate and a metal foil, wherein the resin-impregnated substrate contains from 5 to 30% by weight of at least one inorganic filler selected from the group consisting of calcined kaolin, spherical fused silica, non-swellable synthetic mica, and a glass fine powder, the filler having an average particle diameter of from 0.1 to 5 µm and at least 90 wt% of the filler having a particle diameter of from 0.02 to 5 µm, and the resin-impregnated substrate is used as at least a surface layer of the laminate or as a resin-impregnated substrate which adheres the metal foil, thereby providing a surface smooth metal foil-clad laminate having a diminished surface undulation attributable to the substrate.

Abstract translation: 通过层压模制树脂浸渍基材和金属箔而获得的覆盖金属的层压板，其中所述浸渍树脂的基材含有5至30重量％的至少一种选自煅烧高岭土，球形 熔融二氧化硅，非溶胀性合成云母和玻璃细粉末，所述填料的平均粒径为0.1〜5μm，所述填料的粒径为0.02〜5μm的至少90重量％ 并且将树脂浸渍基材用作至少层压体的表层或作为粘附金属箔的树脂浸渍基材，从而提供由于基材导致的表面起伏减小的表面光滑的金属箔覆层压板。