公开(公告)号：EP1819963A1

公开(公告)日：2007-08-22

申请号：EP05799479.0

申请日：2005-10-24

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： MATSUI, Nobuyuki,c/oMatsushita Elec. Ind. Co. Ltd. ,  NAGUAI, Hideo,c/oMatsushita Elec. Ind. Co. Ltd. ,  NISHIMOTO, Keiji,c/oMatsushita Elec. Ind. Co. Ltd. ,  OGATA, Toshifumi,c/oMatsushita Elec. Ind. Co. Ltd.

IPC分类号： F21V29/00 ,  F21V19/00 ,  H05K1/02 ,  G09F9/33 ,  F21Y101/02

CPC分类号： F21V29/004 ,  F21V19/0055 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00014

摘要： A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.

摘要翻译： 照明装置包括散热器70，插座10和LED模块60. LED模块60具有在由绝缘板和金属板构成的金属基底63的顶侧的中心部分中的发光单元62 。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热片70侧突出。 LED模块60在发光单元62的围绕根据插座10的按压单元14T，14L和14D被按压的状态下安装在散热器70上。将发光单元62的环绕压在 散热器70确保LED模块60的翘曲的中心部分接触散热器70。

公开(公告)号：EP1632887A2

公开(公告)日：2006-03-08

申请号：EP05255373.2

申请日：2005-09-02

申请人： SYCHIP INC.

发明人： Chou, Wai Ping ,  Sun, Kunquan ,  Wang, Jiaxian ,  Yu, Yanbing ,  Zhao, Meng

IPC分类号： G06K19/077

CPC分类号： H05K1/141 ,  G06K19/077 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/117 ,  H05K1/183 ,  H05K2201/09018 ,  H05K2201/09118

摘要： The specification describes PDA (SD/MMC) devices and PDA cards wherein the substrate on which the PDA components are mounted comprises two tiers. Components with a high profile are mounted on the lower tier, and devices with normal or low heights are mounted on the upper tier. The upper tier is contained in the portion of the card conforming to, for example, the 1.4 mm SDA standard thickness, while the lower tier is formed in the portion of the card that allows a larger thickness, for example SDA standard thickness 2.1 mm.

摘要翻译： 该规范描述了PDA（SD / MMC）设备和PDA卡，其中PDA组件安装在其上的基板包括两层。 具有较高配置文件的组件安装在较低层，而具有正常或较低高度的设备安装在较高层。 上层包含在符合例如1.4mm SDA标准厚度的卡的部分中，而下层形成在允许更大厚度的卡的部分中，例如SDA标准厚度2.1mm。

公开(公告)号：EP1531654A1

公开(公告)日：2005-05-18

申请号：EP04445115.1

申请日：2004-11-09

申请人： Polymatech Co., Ltd.

发明人： Shoji, Kazuno

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/00

CPC分类号： H01L21/302 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2203/1105 ,  H05K2203/1327 ,  H05K2203/302

摘要： A three-dimensionally formed circuit sheet (10, 21, 22) is provided. The sheet (10, 21, 22) is characterized by a resin film (1); and a circuit pattern (2) formed of an electrically conductive paste on the resin film (1). The electrically conductive paste contains, as a binder, a resin ink that is three-dimensionally formable. The resin film (1) and the circuit pattern (2) are formed in a three-dimensional shape. A method for manufacturing the three-dimensionally formed circuit sheet (10, 21, 22) is also provided. The method is characterized by forming a circuit pattern (2) on a resin film (1) using an electrically conductive paste by means of printing, wherein the electrically conductive paste contains a resin ink that is three-dimensionally formable; and press molding the resin film (1) including the circuit pattern (2) in a three-dimensional shape.

摘要翻译： 本发明提供一种三维地形成电路片（10，21，22）。 的片材（10，21，22）由树脂薄膜（1）为特征的; 并在树脂薄膜 - 形成的导电膏的电路图案（2）（1）。 导电性膏含有作为粘合剂的树脂的油墨确实是三维成形的。 树脂薄膜 - （1）和电路图案（2）形成为三维形状。 因此，提供一种用于三维地形成电路片（10，21，22）的制造方法。 该方法通过形成电路图案为特征的（2）使用在导电性膏通过印刷，worin导电膏的树脂薄膜 - （1）含有树脂的油墨确实是三维成形的; 和压制成形树脂成膜（1）包括在三维形状的电路图案（2）。

公开(公告)号：EP1189282A1

公开(公告)日：2002-03-20

申请号：EP01912489.0

申请日：2001-03-19

申请人： MITSUBISHI DENKI KABUSHIKI KAISHA

发明人： HAMAGUCHI, Tsuneo, c/o Mitsubishi Denki K.K. ,  KAGATA, Kenji, c/o Mitsubishi Denki K.K.

IPC分类号： H01L25/065 ,  H01L23/12

CPC分类号： H05K3/3436 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14609 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K2201/09018 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： It is an object of the present invention to provide a low-cost semiconductor device including a semiconductor chip mounted on both surfaces of a wiring substrate without degrading electric characteristics, a method for manufacturing an electronic equipment, an electronic equipment, and a portable information terminal.
The semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes. Thus, the rigidity and the spacing are assured, whereby an electronic equipment and a portable information terminal are manufactured which cause no damage to the logic LSIs even when subjected to external pressure.

摘要翻译： 它是本发明的一个目的是提供一种低成本的半导体装置，其包括安装在布线基板的两个表面上，而不会降低电特性，用于制造电子设备的方法，对电子设备的半导体芯片，和便携式信息终端 ， 该半导体器件包括投影形成于布线基板的一个表面上的电极，从而具有其厚度比上述半导体的大的规定高度，其厚度比所述凸起电极的高度更小的半导体芯片，以及电子部件 芯片以及安装在所述布线基板的另一个表面上，以便做的布线基板翘曲在一个表面上被凹进。 因此，刚性以及在半导体芯片和安装基板之间的间距被保证。 更完了，具有LSI安装在布线基板的两个表面上的逻辑的半导体器件被安装在安装基板上与投射具有之间夹有规定高度的电极，worin布线基板的壳体翘曲在具有侧为凹陷 突起状电极。 因此，刚度和间距放心，从而对电子设备和便携式信息终端被制造引起的逻辑LSI即使受到外部压力没有损害。

公开(公告)号：EP0872882A3

公开(公告)日：1999-04-21

申请号：EP98105261.6

申请日：1998-03-24

申请人： Curamik Electronics GmbH

发明人： Schulz-Harder, Jürgen, Dr. ,  Exel, Karl, Dr.

IPC分类号： H01L21/48 ,  H01L23/13

CPC分类号： H01L23/13 ,  C04B37/001 ,  C04B37/021 ,  C04B37/023 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2237/124 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/70 ,  C04B2237/76 ,  C04B2237/82 ,  H01L21/4807 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Die Erfindung bezieht sich auf ein neuartiges Verfahren zum Herstellen eines gewölbten Metall-Keramik-Substrates mit einer von einer Keramikplatte gebildeten Keramikschicht, die an wenigstens einer Oberflächenseite mit einer Metallisierung versehen ist, welche auf die vorgewölbte Keramikplatte aufgebracht wird.

公开(公告)号：EP0575850A2

公开(公告)日：1993-12-29

申请号：EP93109462.7

申请日：1993-06-14

申请人： Martin Marietta Corporation

发明人： Akins, Rickey D. ,  Walvoord, John

IPC分类号： H05K3/06 ,  G03F7/20 ,  G03F7/24 ,  G03F7/16 ,  H01Q15/14 ,  B23K26/06 ,  B23K26/08

CPC分类号： B23K26/0853 ,  B23K26/066 ,  B23K26/0823 ,  B23K2201/42 ,  G03F7/24 ,  H01Q1/425 ,  H01Q15/0013 ,  H05K1/0284 ,  H05K3/0082 ,  H05K3/064 ,  H05K2201/09018 ,  H05K2201/09972 ,  H05K2203/056 ,  H05K2203/107

摘要： In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The coherent light source preferably includes an excimer laser. The substrate includes a bottom layer and a metallized layer which is covered by a photoresist coating. The first element of the pattern is formed by directly imaging the element in the photoresist coating. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed in the photoresist coating over the entire surface of the substrate. After the pattern is complete and the photoresist is developed, an etching technique is used to remove portions of the metallized layer from the substrate.

摘要翻译： 在用于在诸如天线罩的双轮廓或半球形基板上制造印刷电路板的方法中，使用相干光源在基板的表面上形成预定图案的多个元件。 相干光源优选地包括准分子激光器。 衬底包括底层和被光致抗蚀剂涂层覆盖的金属化层。 图案的第一元件通过在光致抗蚀剂涂层中直接成像元件而形成。 然后将衬底相对于相干光源移位，直到在基片的整个表面上的光致抗蚀剂涂层中形成预定图案的所有元件。 在图案完成并且光致抗蚀剂显影之后，使用蚀刻技术从基底去除金属化层的部分。

公开(公告)号：EP0567016A2

公开(公告)日：1993-10-27

申请号：EP93106238.4

申请日：1993-04-16

申请人： Sumitomo Electric Industries, Ltd.

发明人： Hattori, Hisao, c/o Itami Works of Sumitomo Elec. ,  Yoshino, Hiroshi, c/o Itami Works of Sumitomo Elec ,  Ihara, Tomohiko, c/o Itami Works of Sumitomo Elec ,  Yamanaka, Shosaku, c/o Itami Works Sumitomo Elec.

IPC分类号： H05K3/46

CPC分类号： H01L23/5386 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0306 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09018 ,  H05K2201/09681 ,  H05K2201/09736 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2924/00

摘要： A multilayered wiring board having a multilayered wiring structure. A first meshed wiring layer (1) having a plurality of holes formed therein and a second wiring layer (2) having a plurality of wirings are provided. The wirings of the second wiring layer wind up and down so as to partially sink in the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding into spaces between the adjacent ones of the wirings of the second wiring layer. The crosstalks between the wirings are reduced.

公开(公告)号：EP0397747A4

公开(公告)日：1992-02-26

申请号：EP89901918

申请日：1989-01-17

申请人： TROVE TECHNOLOGY INCORPORATED

发明人： BERHOLD, G. MARK

IPC分类号： H01R12/24 ,  H01L23/52 ,  H01L25/00 ,  H01R12/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K7/02 ,  H05K1/00 ,  H05K1/11

CPC分类号： H05K1/189 ,  H05K3/3447 ,  H05K7/023 ,  H05K2201/046 ,  H05K2201/09018 ,  H05K2201/09418 ,  H05K2201/10515

摘要： A plurality of circuit component carrier packages (71) having the same size and shape are stacked adjacent one to another with the faces (72, 74) thereof in contact to form a carrier package assembly (40) in the form of a prismatic or cylindrical solid. Each carrier package houses one or more electrical circuit components (110) and is provided at portions of the faces thereof with electrical contacts (84, 86) which cooperate with similarly located contacts on the faces of adjacent carrier packages to electrically interconnect the circuit components. The carrier package assembly is usable with a flexible, printed circuit board (50) having on one side thereof an array of contact sites (52) selectively interconnected by printed routing traces (54). Electrical contacts on the peripheral surfaces of the carrier packages are coupled with the circuit components housed therein and engage the contact sites on the circuit board when it is wrapped around the carrier package assembly.

公开(公告)号：EP0389619A4

公开(公告)日：1991-12-11

申请号：EP89912732

申请日：1989-09-26

申请人： ROGERS CORPORATION

发明人： LANDI, VINCENT, R.

IPC分类号： H05K1/02 ,  B29C39/10 ,  B29C45/14 ,  B29L31/34 ,  H01P3/08 ,  H01Q1/38 ,  H01Q15/14 ,  H01Q21/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H01Q1/14

CPC分类号： H05K3/20 ,  B29C45/14827 ,  B29K2995/0005 ,  B29L2031/3456 ,  H01Q15/141 ,  H01Q21/0087 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/002 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2203/0156 ,  H05K2203/0264 ,  H05K2203/0793 ,  Y10T29/49155 ,  Y10T29/49158

摘要： A highly accurate circuit pattern (14) in intimate contiguous relationship with a curved plastic body (12) and a method of manufacture thereof. In accordance with the present invention, circuit pattern (14) is detachably fixed to a flexible substrate (16) and is placed into a mold (20). A molding compound (22) is then forced into the mold pressing the circuit against the mold wall and filling all of the mold voids. The molded product is thereafter removed from the mold. The flexible substrate (16), on which the metallic circuit is printed, is removed from the molded product leaving the metallic circuit pattern (14) imbedded into the molded product.

公开(公告)号：EP0428695A1

公开(公告)日：1991-05-29

申请号：EP90909290.0

申请日：1990-05-18

申请人： TROVE TECHNOLOGY INCORPORATED

发明人： BERHOLD, G., Mark

IPC分类号： H05K1 ,  H01L25 ,  H01R12 ,  H05K7 ,  H05K3

CPC分类号： H05K1/189 ,  H05K1/144 ,  H05K3/3447 ,  H05K7/023 ,  H05K2201/046 ,  H05K2201/09018 ,  H05K2201/09418 ,  H05K2201/10515

摘要： Plusieurs boîtiers porteurs (71) de composants de circuit en forme de plaque sont empilés adjacents entre eux avec leurs faces plates (72, 74) en contact pour former un ensemble de boîtiers porteurs (40). Chaque boîtier porteur loge un ou plusieurs composants de circuit électrique (110) couplés à des contacts électriques (84, 86) sur les faces plates et à des contacts électriques (98) ou des broches droites (424, 436) prévues sur les côtés. Ces broches coopèrent avec celles des boîtiers porteurs adjacents pour effectuer une connexion électrique avec les composants des circuits. Une plaquette à circuit imprimé flexible (50) ayant un réseau de sites de contact (52) interconnectés sélectivement par des traces imprimées de routage (54) entoure l'assemblage de boîtier porteur. Les extrémités de l'assemblage de boîtier porteur sont pourvues de blocs connecteurs de support et d'interconnexion électrique (22, 16). Plusieurs assemblages de boîtier porteur peuvent être interconnectés directement, par emboîtement, ou par l'intermédiaire de structures intermédiaires de connexion.