公开(公告)号：EP0817267A1

公开(公告)日：1998-01-07

申请号：EP97112006.8

申请日：1995-03-09

Applicant: The Panda Project

Inventor： Crane, Stanford W., Jr. ,  Portuondo, Maria M.

IPC: H01L23/498

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor die package (30) includes a plurality of conductive leads (11) and a multi-layer structure (10) for carrying electrical signals, the multi-layer structure (10) including a plurality of layers of insulative material (12a-12d), each of the layers including a first surface and a second surface on an opposing side of the layer.
Each of the leads (11) extends into a corresponding well (15) extending completely through at least one of the layers and bottoming at one of the surfaces of one of the layers through which the well (15) does not extend and is electrically coupled to an electrically conductive bonding structure (13) formed within its corresponding well (15).

公开(公告)号：EP2791951A4

公开(公告)日：2015-11-11

申请号：EP12858253

申请日：2012-12-10

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  WEBSTER ALAN P ,  JONES LONNIE G ,  RENNER GARRY L ,  BELL JEFFREY

IPC: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/30

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

公开(公告)号：EP2791951A1

公开(公告)日：2014-10-22

申请号：EP12858253.3

申请日：2012-12-10

Applicant: Kemet Electronics Corporation

Inventor： MCCONNELL, John, E. ,  WEBSTER, Alan, P. ,  JONES, Lonnie, G. ,  RENNER, Garry, L. ,  BELL, Jeffrey

IPC: H01G4/232 ,  H01G4/12

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

公开(公告)号：EP1628511B1

公开(公告)日：2009-03-25

申请号：EP05016596.8

申请日：2005-07-29

Applicant: Muck, Siegfried

Inventor： Muck, Siegfried

IPC: H05K3/36 ,  H01R9/03

CPC classification number: H05K3/363 ,  H01R4/024 ,  H01R12/592 ,  H01R12/721 ,  H01R12/777 ,  H05K3/3405 ,  H05K2201/062 ,  H05K2201/091 ,  H05K2201/1034 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10848

公开(公告)号：EP1758208A1

公开(公告)日：2007-02-28

申请号：EP06017087.5

申请日：2006-08-16

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Nakano, Hiroshi

IPC: H01R12/18

CPC classification number: H05K3/341 ,  H01R12/707 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

Abstract: An object of the present invention is to enable a reduction in bonding strength to a circuit board to be restrained while letting bubbles created in solder escape.
A circuit board connector 1 according to the present invention is provided with a connector housing 10, male terminals 20 and fixing members 30. Each fixing member 30 is formed by bending a metal flat plate into an L-shape, and comprised of a mounting portion 31 used to mount the fixing member 30 into the connector housing 10, and a bonding portion 32 to be soldered. The bonding portion 32 is formed with connecting pieces 33 by making substantially "gate"-shaped cuts in the bonding portion 32 to penetrate the bonding portion 32 and then bending parts enclosed by these cuts upward. A clearance S is defined between the bottom edge of the leading end of each connecting piece 33 and the hole wall of a corresponding through hole 34 facing this bottom edge. The clearances S communicate with the through holes 34 formed upon bending the connecting pieces 33. The lower surfaces of the connecting pieces 33 and the inner surfaces of the through holes 34 can be soldered.

Abstract translation: 本发明的一个目的是在焊接产生的气泡逸出的同时，能够抑制与电路板的接合强度的降低。 根据本发明的电路板连接器1设置有连接器壳体10，阳端子20和固定构件30.每个固定构件30通过将金属平板弯曲成L形而形成，并且包括安装部分 31用于将固定构件30安装到连接器壳体10中，以及接合部32被焊接。 接合部32通过在接合部32中形成大致“门”状切口而形成有连接片33，以穿透接合部32，然后将由这些切口包围的部分向上弯曲。 在每个连接件33的前端的底部边缘与面向该底部边缘的对应的通孔34的孔壁之间限定间隙S. 间隙S与弯曲连接片33时形成的通孔34连通。连接件33的下表面和通孔34的内表面可被焊接。

公开(公告)号：EP1044082B1

公开(公告)日：2003-04-23

申请号：EP98956935.5

申请日：1998-11-19

Applicant: Leica Geosystems AG

Inventor： REMY DE GRAFFENRIED, Christian

IPC: B23K1/005

CPC classification number: B23K1/0056 ,  B23K2201/40 ,  G02B6/4238 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0373 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/101 ,  Y02P70/613 ,  Y10T29/4913

公开(公告)号：EP0783775B1

公开(公告)日：2000-05-03

申请号：EP95937430.7

申请日：1995-09-28

Applicant: NORTH AMERICAN SPECIALITIES CORPORATION

Inventor： SEIDLER, Jack ,  POLLOCK, Leonard, J.

IPC: H01R12/04 ,  H01R12/32

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/0256 ,  H05K3/3405 ,  H05K3/3426 ,  H05K3/3478 ,  H05K2201/10386 ,  H05K2201/10772 ,  H05K2201/10984 ,  Y02P70/613

Abstract: A solder-bearing metallic (114), and methods of fabricating and using it, where the lead is formed with a solder-retaining portion (125) having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder (133) surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a susbstrate or other conductive pad.

公开(公告)号：EP1993172A4

公开(公告)日：2011-03-09

申请号：EP07706598

申请日：2007-01-11

Applicant: TYCO ELECTRONICS JAPAN G K

Inventor： KAWAHARA YUZO

IPC: H01R4/02 ,  H01R24/00 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01R12/707 ,  H01R12/727 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10772 ,  Y02P70/613

公开(公告)号：EP1754400A1

公开(公告)日：2007-02-21

申请号：EP05748489.1

申请日：2005-06-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HIDAKA, Akio ,  IKEBE, Shouichi ,  MURANO, Yuuichi ,  KAZITANI, Hirozumi ,  IKEDA, Mika ,  MIZOGUCHI, Yoshitaka

IPC: H05K5/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

公开(公告)号：EP0817267B1

公开(公告)日：2004-09-08

申请号：EP97112006.8

申请日：1995-03-09

Applicant: Silicon Bandwidth, Inc.

Inventor： Crane, Stanford W., Jr. ,  Portuondo, Maria M.

IPC: H01L23/498

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012