公开(公告)号：EP2416635A1

公开(公告)日：2012-02-08

申请号：EP11187947.4

申请日：2008-02-20

Applicant: Dynamic Details, Inc.

Inventor： Sidhu, Rajwant ,  Walker, Paul

IPC: H05K3/42

CPC classification number: H05K1/115 ,  H05K1/0201 ,  H05K3/423 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Printed circuit boards have circuit layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect of an embodiment of the present invention enhances thermal characteristics of filled through-holes of printed circuit boards to provide extra reliability to the printed circuit boards. In one embodiment, a printed circuit broad has a plurality of through-holes to connect copper patterns on different layers of the printed circuits broad. Here, at least one of the through-holes is copper plated closed at both ends with at least 70% volume of the through-hole plated with copper to, e.g., enhance thermal characteristics of the through-hole, thereby providing extra reliability to the printed circuit board. In one embodiment, the printed circuit board includes a surface conductor (or cap) that is directly plated over the copper filled barrel plated through-hole.

Abstract translation: 印刷电路板具有带有一个或多个铜填充通孔的电路层及其制造方法。 本发明的实施例的一个方面增强了印刷电路板的填充通孔的热特性，从而为印刷电路板提供了额外的可靠性。 在一个实施例中，印刷电路宽带具有多个通孔，以连接印刷电路的不同层上的铜图案。 这里，至少一个通孔在两端被镀铜封闭，其中至少70％体积的镀有铜的通孔例如增强了通孔的热特性，从而为 印刷电路板。 在一个实施例中，印刷电路板包括直接电镀在铜填充的圆柱形电镀通孔上的表面导体（或帽）。

公开(公告)号：EP1667507B1

公开(公告)日：2012-02-01

申请号：EP06003717.3

申请日：1999-09-14

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

公开(公告)号：EP2113038B1

公开(公告)日：2011-12-21

申请号：EP08725858.8

申请日：2008-02-20

Applicant: Dynamic Details, Inc.

Inventor： SIDHU, Rajwant ,  WALKER, Paul

IPC: H05K3/42

CPC classification number: H05K1/115 ,  H05K1/0201 ,  H05K3/423 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Printed circuit boards have circuit layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect of an embodiment of the present invention enhances thermal characteristics of filled through-holes of printed circuit boards to provide extra reliability to the printed circuit boards. In one embodiment, a printed circuit broad has a plurality of through-holes to connect copper patterns on different layers of the printed circuits broad. Here, at least one of the through-holes is copper plated closed at both ends with at least 70% volume of the through-hole plated with copper to, e.g., enhance thermal characteristics of the through-hole, thereby providing extra reliability to the printed circuit board. In one embodiment, the printed circuit board includes a surface conductor (or cap) that is directly plated over the copper filled barrel plated through-hole.

公开(公告)号：EP2390912A1

公开(公告)日：2011-11-30

申请号：EP10007554.8

申请日：2010-07-21

Applicant: Sunonwealth Electric Machine Industry Co., Ltd.

Inventor： Horng, Alex ,  Kuo, Chi-Hung ,  Chung, Chih-Hao ,  Cheng, Chung-Ken ,  Wang, Jui-Feng

IPC: H01L23/367

CPC classification number: H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/09563 ,  H05K2201/10409 ,  H01L2924/00

Abstract: A cooling module assembly method comprises a step of providing a circuit board (1), at least one heat-generating element (4) and a heat dissipating unit (2). The cooling module assembly method is characterized in that: forming at least one through-hole (11) on the circuit board (1); coupling the circuit board (1) to the heat dissipating unit (2) so that a face of the circuit board (1) is coupled to a coupling face (21) of the heat dissipating unit (2); filling the at least one through-hole (11) with metal solders (3); fixing the at least one heat-generating element (4) to another face (13) of the circuit board (1), wherein the at least one heat-generating element (4) aligns with and covers the at least one through-hole (11); and soldering the at least one heat-generating element (4) and the heat dissipating unit (2) together by melting the metal solders (3) in the at least one through-hole (11).

Abstract translation: 冷却模块组装方法包括提供电路板（1），至少一个发热元件（4）和散热单元（2）的步骤。 冷却模块组装方法的特征在于：在电路板（1）上形成至少一个通孔（11）; 将电路板（1）耦合到散热单元（2），使得电路板（1）的表面耦合到散热单元（2）的耦合面（21）; 用金属焊料（3）填充所述至少一个通孔（11）; 将所述至少一个发热元件（4）固定到所述电路板（1）的另一个面（13），其中所述至少一个发热元件（4）与所述至少一个通孔（ 11）; 以及通过熔化所述至少一个通孔（11）中的所述金属焊料（3）将所述至少一个发热元件（4）和所述散热单元（2）焊接在一起。

公开(公告)号：EP2375879A1

公开(公告)日：2011-10-12

申请号：EP09834446.8

申请日：2009-12-22

Applicant: Sumitomo Bakelite Company Limited

Inventor： KATSURAYAMA, Satoru ,  MAEJIMA, Kenzou ,  FUJII, Tomoe

IPC: H05K3/34 ,  B32B27/00

CPC classification number: H05K3/305 ,  B32B5/142 ,  B32B27/08 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2307/306 ,  B32B2307/546 ,  B32B2307/548 ,  B32B2307/714 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2457/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/0154 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0195 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T156/1052 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/31504 ,  Y10T428/31721 ,  Y10T428/31725 ,  H01L2924/00

Abstract: A flexible substrate 10 of the present invention is the flexible substrate comprising a first resin film 1 having flux activity and a second resin film 2 different from the first resin film 1 laminated to said first resin film. The flexible substrate 10 is characterized in that the flexible substrate 10 is used by having a plurality of electronic components mounted on the surface of the first resin film 1, and thereafter having the respective electronic components and the flexible substrate 10 bonded at one time. The gel time of the first resin film 1 at 230°C is 100 seconds or more and 600 seconds or less.

Abstract translation: 本发明的柔性基板10是包含具有助焊剂活性的第一树脂膜1和与第一树脂膜1不同的第二树脂膜2的柔性基板10。 柔性基板10的特征在于，通过具有安装在第一树脂膜1的表面上的多个电子部件，然后一次接合各个电子部件和柔性基板10，来使用柔性基板10。 第一树脂膜1在230℃下的凝胶时间为100秒以上且600秒以下。

公开(公告)号：EP1699279B8

公开(公告)日：2011-09-21

申请号：EP06115382.1

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/46

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

公开(公告)号：EP1962566B1

公开(公告)日：2011-06-15

申请号：EP08250573.6

申请日：2008-02-19

Applicant: SIIX Corporation

Inventor： Matsushima, Yoshihiko

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

公开(公告)号：EP2327282A1

公开(公告)日：2011-06-01

申请号：EP09807322.4

申请日：2009-08-13

Applicant: Dynamic Details, Inc.

Inventor： KUMAR, Raj ,  DREYER, Monte ,  TAYLOR, Michael, J. ,  ZEPEDA, Ruben

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K3/4614 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed there through; and a counter paste filled within the via.

公开(公告)号：EP2278865A1

公开(公告)日：2011-01-26

申请号：EP10011152.5

申请日：2000-10-11

Applicant: Tessera Interconnect Materials, Inc.

Inventor： Tomo, Ijima ,  Masayuji, Ohsawa

IPC: H05K3/40 ,  H05K3/46 ,  H05K3/06

CPC classification number: H05K3/4647 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/062 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The invention relates to a wiring circuit substrate, comprising: a single layer base member in which are formed:
a first metal layer (51) in which conductor circuit traces are formed, and etched metal protrusions (53) that are electrically connected to said first metal layer; and a second metal layer (54) that is formed on top surfaces of said protrusions, wherein said second metal layer is formed of a solder-plated layer or a solder layer.

Abstract translation: 本发明涉及一种布线电路基板，包括：形成有单层基底构件;形成有导体电路迹线的第一金属层（51）和蚀刻金属突起（53），其电连接到所述第一 金属层; 以及形成在所述突起的顶表面上的第二金属层（54），其中所述第二金属层由焊料镀层或焊料层形成。

公开(公告)号：EP1830614A4

公开(公告)日：2010-12-08

申请号：EP05806324

申请日：2005-11-14

Applicant: DAINIPPON PRINTING CO LTD

Inventor： CHUJO SHIGEKI ,  NAKAYAMA KOICHI

IPC: H05K3/40 ,  H01L23/12 ,  H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H05K1/0306 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204