公开(公告)号：EP1404165A4

公开(公告)日：2007-04-18

申请号：EP02738844

申请日：2002-06-28

Applicant: NITTO DENKO CORP

Inventor： KAWASHIMA TOSHIYUKI ,  TAHARA NOBUHARU ,  IKEDA KENICHI

IPC: H05K3/42 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0116 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/1147 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A method for manufacturing a multilayer wiring board comprises a step of alternately stacking prepreg sheets (1) of a resin porous film impregnated with thermosetting resin and double-sided wiring boards (10) having an insulating layer (11) on both sides of which wiring patterns (12) are formed, and heating and compressing the stack into one piece. The multilayer wiring board is advantageous in mass production because the gap for forming the insulating layer is easily controlled. The whole of the wiring board can be thin, and the planarization of the surface of the wiring board is easy.

公开(公告)号：EP1704758A1

公开(公告)日：2006-09-27

申请号：EP04803475.5

申请日：2004-12-03

Applicant: Würth Elektronik Rot am See GmbH & Co. KG ,  Lüberg Elektronik GmbH & Co. Rothfischer KG ,  Reifenhäuser GmbH & Co. Maschinenfabrik ,  Lehmann & Voss & Co. KG

Inventor： LANGENFELDER, Dieter ,  AHLSTAEDT, Volker

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K3/022 ,  B29C44/322 ,  B29C47/0014 ,  B29C47/0019 ,  B29C47/065 ,  B29C47/10 ,  B29C47/145 ,  B29C47/366 ,  B29C47/8845 ,  B29C47/90 ,  B29C2793/009 ,  B29K2071/00 ,  B29K2105/04 ,  B29K2105/06 ,  B29K2105/256 ,  B29K2105/26 ,  H05K1/036 ,  H05K2201/0116 ,  H05K2201/0129

Abstract: Thermoplastic raw material with high temperature resistance is fused in a cascade of two extruders, then treated with gas and/or chemical propellants, homogenised and cooled. Outer layers are optionally applied to the foamed core layer, before the melt exits the nozzle gap. The melt strip foams up and is cooled in a burnishing unit. Copper films can simultaneously be introduced by means of the rollers of the burnishing unit, to give a composite of melt strip and copper film which are then drawn together.

公开(公告)号：EP1245621B1

公开(公告)日：2006-08-30

申请号：EP02007263.3

申请日：2002-03-28

Applicant: Sumitomo Chemical Company, Limited

Inventor： Shinohara, Yasuo ,  Takahashi, Tsutomu

IPC: C08J5/18 ,  C08L77/10 ,  C08J5/04 ,  C08J5/24 ,  C08J9/28 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08J9/0061 ,  C08J9/28 ,  C08J2201/0544 ,  C08J2377/08 ,  C08J2477/00 ,  C08L67/03 ,  C08L77/08 ,  C08L77/10 ,  C08L79/06 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2201/068 ,  C08L77/00

公开(公告)号：EP1413924A4

公开(公告)日：2006-08-02

申请号：EP02755662

申请日：2002-07-25

Applicant: JSR CORP

Inventor： NISHIMURA ISAO ,  BESSHO NOBUO ,  KUMANO ATSUSHI ,  YAMADA KENJI

IPC: G03F7/00 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075 ,  G03F7/26 ,  G03F7/38 ,  H01L21/027 ,  H01L21/312 ,  H01L23/12 ,  H05K1/00 ,  H05K1/16 ,  C08L101/00 ,  G03F7/36

CPC classification number: H05K1/162 ,  G03F7/001 ,  G03F7/0045 ,  G03F7/0047 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/0757 ,  G03F7/26 ,  G03F7/38 ,  H01L21/02126 ,  H01L21/02186 ,  H01L21/02282 ,  H01L21/02343 ,  H01L21/02348 ,  H01L21/312 ,  H05K1/0286 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2203/107 ,  H05K2203/1163 ,  Y10S430/106

Abstract: A radiation sensitive dielectric constant changing composition comprising (A) a decomposable compound, (B) a nondecomposable compound, (C) a radiation sensitive decomposer and (D) a stabilizer.

公开(公告)号：EP1504466A2

公开(公告)日：2005-02-09

申请号：EP03729885.8

申请日：2003-05-12

Applicant: Infineon Technologies AG

Inventor： RIEDL, Edmund ,  SCHOBER, Wolfgang

IPC: H01L21/306

CPC classification number: H01L21/4871 ,  C23C8/80 ,  H01L21/31683 ,  H01L21/76801 ,  H01L21/76838 ,  H01L21/76888 ,  H01L23/142 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/498 ,  H01L23/528 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/385 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T428/12472 ,  Y10T428/12479 ,  Y10T428/12993 ,  Y10T428/249953 ,  H01L2924/00

Abstract: The invention relates to a metal object (2) to be at least partially coated with a substance. The substance (1) can comprise a metal solder, a plastic, a glass or a ceramic material. The metal object (2) itself can comprise, in particular, connecting, supporting or conducting components for an electronic device. The metal object (2) comprises macroscopically smooth surface sections (3), however, a multitude of curvy nanopores (5) are provided in the area of at least one surface section (3).

公开(公告)号：EP1261244A3

公开(公告)日：2004-09-08

申请号：EP02010950.0

申请日：2002-05-16

Applicant: Nitto Denko Corporation

Inventor： Ikeda, Kenichi, c/o Nitto Denko Corporation ,  Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Tahara, Nobuharu, c/o Nitto Denko Corporation

IPC: H05K3/46

CPC classification number: H05K3/4614 ,  H05K3/423 ,  H05K3/4626 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1147 ,  Y10T428/24917

Abstract: The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer (5) onto a metal foil (1) by a wet coagulating method, wherein a metal foil (1) including a conductive bump (2a) having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil (1) including a conductive bump (2a) having an almost equal height and a resin porous layer (5) laminated integrally, the conductive bump (2a) being exposed. The present invention provides another metal foil laminated plate comprising a metal foil (1) including a conductive bump (2a) having an almost equal height, a resin porous layer (5) laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer (5), in which the conductive bump (2a) is exposed from the resin porous layer (5).

公开(公告)号：EP1410906A1

公开(公告)日：2004-04-21

申请号：EP03022833.2

申请日：2003-10-08

Applicant: Arlon

Inventor： Guiles, Chester Light ,  Najjar, Ousama ,  Allen, Scott Timon ,  Bieschke, William J.

IPC: B32B31/08 ,  B32B5/18 ,  B32B15/08 ,  H05K1/03 ,  H05K3/06 ,  H05K3/46 ,  H01Q21/06

CPC classification number: B32B17/10844 ,  B32B5/18 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B37/144 ,  B32B37/20 ,  B32B2250/40 ,  B32B2305/022 ,  B32B2307/202 ,  B32B2311/12 ,  H01Q1/38 ,  H01Q21/065 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0116 ,  H05K2201/0278 ,  H05K2201/0355 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: In accordance with the present invention, there are provided novel assemblies which are useful for a variety of applications. Invention assemblies have low dielectric constant, making them suitable for use in a variety of electronic applications. In addition, invention assemblies are resistant to attack by acidic aqueous media, basic aqueous media and/or organic media, making it possible to subject such assemblies to a variety of processing conditions, such as, for example, chemical etching to introduce circuitry thereto.

Abstract translation: 根据本发明，提供了可用于各种应用的新型组件。 本发明组件具有低介电常数，使其适用于各种电子应用。 此外，本发明组件耐受酸性水性介质，碱性水性介质和/或有机介质的侵蚀，使得可以使这种组件进行各种加工条件，例如化学蚀刻以将电路引入其中。

公开(公告)号：EP1194020A3

公开(公告)日：2004-03-31

申请号：EP01122966.3

申请日：2001-09-25

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Suzuki, Takeshi ,  Tomekawa, Satoru ,  Kawakita, Yoshihiro ,  Nakagiri, Yasushi ,  Echigo, Fumio

IPC: H05K3/38 ,  H05K3/40 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K1/024 ,  H05K1/036 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

Abstract: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

Abstract translation: 压缩函数层60设置的至少一个基板面上。 压缩函数层60增加了由在板的厚度与树脂板10，其包括thisLayer的方向接收压力被压缩的功能。 从而足够的压力被施加到导体14

公开(公告)号：EP1272022A2

公开(公告)日：2003-01-02

申请号：EP02013457.3

申请日：2002-06-13

Applicant: NITTO DENKO CORPORATION

Inventor： Ikeda, Kenich ,  Kawashima, Toshiyuki ,  Tahara, Nobuharu ,  Oouchi, Kazuo

IPC: H05K3/46

CPC classification number: H05K3/4617 ,  H05K1/185 ,  H05K3/4611 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition (R) of a thermosetting resin in a porous laminated product (30) including two or more porous layers (11) and a wiring layer (20) provided between the porous layers (11) and formed on any of the porous layers (11) and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers (11) and a wiring layer (20) provided between the porous layers (11) and formed on any of the porous layers (11) are integrated through an impregnated and cured thermosetting resin.

公开(公告)号：EP1272021A2

公开(公告)日：2003-01-02

申请号：EP02013456.5

申请日：2002-06-13

Applicant: NITTO DENKO CORPORATION

Inventor： Kawashima, Toshiyuki ,  Tahara, Nobuharu ,  Ikeda, Kenichi

IPC: H05K3/46 ,  H05K3/00 ,  B32B31/00

CPC classification number: B32B15/08 ,  B32B5/18 ,  B32B7/12 ,  B32B27/281 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/00 ,  B32B2038/0076 ,  B32B2305/026 ,  B32B2311/00 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2367/00 ,  B32B2377/00 ,  B32B2379/08 ,  B32B2398/10 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1147 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer (12) containing a thermosetting resin on a lower wiring layer (3), a metal layer (1) or an insulating layer, provisionally bonding a porous layer (13) having a releasing film (11) attached thereto onto a surface of the bonding layer (12), peeling the releasing film (11) from the porous layer (13), laminating a metal foil (20) on the porous layer (13) obtained after the peeling, and heating and pressurizing the laminated product to transfer the bonding layer (12) to the metal foil (20) and thereby integrating them. Furthermore, the present invention provides a method of manufacturing a wiring board comprising the steps of manufacturing a metal foil laminated product by the above manufacturing methods, and providing a pattern on the metal foil of the metal foil laminated product, thereby forming a wiring layer.