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    CONNECTOR
    34.
    发明公开
    CONNECTOR 有权
    Verbinder mitVerstärkungsplattezumLöten一个einemTrägermaterial

    公开(公告)号：EP2317607A1

    公开(公告)日：2011-05-04

    申请号：EP08809209.3

    申请日：2008-08-22

    Applicant: Iriso Electronics Co., Ltd.

    Inventor： IMAZU, Toshiyuki ,  SUZUKI, Hitoshi

    IPC: H01R12/16 ,  H01R13/73 ,  H01R12/04

    CPC classification number: H01R12/51 ,  H01R12/707 ,  H01R12/714 ,  H01R12/716 ,  H01R12/724 ,  H01R13/50 ,  H01R13/504 ,  H01R2107/00 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10189 ,  H05K2201/10969

    Abstract: Problem to be Solved
    To provide a connector in which soldering strength of a reinforcing plate can be improved.
    Solution
    A reinforcing plate (30) fixed to a connector main body (10) is arranged on a bottom surface of the connector main body (10) to come into surface contact with a surface of a substrate (40) while a plurality of holes (31) is provided on a surface, which contacts the substrate (40), of the reinforcing plate (30). When the reinforcing plate (30) is soldered to the substrate (40), therefore, a solder wraps around not only a peripheral edge of the reinforcing plate (30) but also an edge of each of the holes (31) so that a soldering portion between the reinforcing plate (30) and the substrate (40) can be sufficiently ensured. Thus, soldering strength of the reinforcing plate (30) can be improved, and mounting strength on the substrate (40) can be enhanced for insertion and removal of a counterpart connector. By providing each of the holes (31), the reinforcing plate (30) can be made lightweight, and heat transfer at the time of soldering can also be improved.

    Abstract translation: 要解决的问题提供一种能够提高加强板的焊接强度的连接器。 解决方案固定到连接器主体（10）的加强板（30）布置在连接器主体（10）的底表面上，以与基板（40）的表面进行表面接触，同时多个孔 31）设置在加强板（30）的与基板（40）接触的表面上。 因此，当加强板（30）焊接到基板（40）时，焊料不仅包围加强板（30）的周边边缘，而且还包围每个孔（31）的边缘，使得焊接 可以充分确保加强板（30）与基板（40）之间的部分。 因此，可以提高加强板（30）的焊接强度，并且可以增强对基板（40）的安装强度，以便插入和移除对方连接器。 通过设置每个孔（31），可以使加强板（30）重量轻，并且也可以提高焊接时的热传递。

    Schaltungsträgeraufbau mit verbesserter Wärmeableitung
    36.
    发明公开
    Schaltungsträgeraufbau mit verbesserter Wärmeableitung 审中-公开
    电路支撑结构具有改善的热耗散

    公开(公告)号：EP2023706A3

    公开(公告)日：2010-05-26

    申请号：EP08104842.3

    申请日：2008-07-23

    Applicant: Continental Automotive GmbH

    Inventor： Decker, Michael

    IPC: H05K7/20

    CPC classification number: H05K7/205 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/429 ,  H05K2201/0373 ,  H05K2201/10416 ,  H01L2924/00

    Abstract: Die Erfindung betrifft einen Schaltungsträgeraufbau (1) mit mindestens einen elektronischen Bauelement (3) in SMD-Bauweise, wobei unterhalb des mindestens einen elektronischen Bauelements (3) eine durchgehende Ausnehmung (5) im Schaltungsträger (2) angeordnet ist, ein Stempel (6) aus wärmeleitendem Material mit einem Ende eines Fügebereichs (6a) in die Ausnehmung (5) eingeführt und mit einer Wärmeleitkleberschicht (7) befestigt wird und mit dem Bauelement (3) wärmeleitend verbunden wird und weiterhin der Stempel (6) an seiner anderen Seite einen Anbindungsbereich (6b) aufweist, dessen Querschnittsfläche mindestens teilweise größer dimensioniert ist als die Ausnehmung (5) im Schaltungsträger (2) und dessen Ende mit einem Kühlkörper (8) wärmeleitend verbunden wird.

    IC-BAUELEMENT MIT KÜHLANORDNUNG
    37.
    发明公开
    IC-BAUELEMENT MIT KÜHLANORDNUNG 审中-公开
    带有冷却装置的IC部件

    公开(公告)号：EP1938373A2

    公开(公告)日：2008-07-02

    申请号：EP06793022.2

    申请日：2006-08-25

    Applicant: VDO Automotive AG

    Inventor： JANISCH, Christian ,  SMIRRA, Karl

    IPC: H01L23/367

    CPC classification number: H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/0373 ,  H05K2201/09054 ,  H05K2201/10689 ,  H01L2924/00

    Abstract: The invention relates to an IC component (2) comprising a cooling arrangement (1) which is embodied as an electronic housing provided with a cooling body (7). According to the invention, the IC component (2) is directly arranged on the cooling body (7) in the electronic housing. The invention advantageously provides a cooling arrangement (1) for IC components (2) that enables the IC component (2) to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automobile industry.

    Test contact system
    39.
    发明公开
    Test contact system 审中-公开
    测试联络系统

    公开(公告)号：EP1808701A1

    公开(公告)日：2007-07-18

    申请号：EP07000902.2

    申请日：2007-01-17

    Applicant: Sherry, Jeffrey C.

    Inventor： Sherry, Jeffrey C.

    IPC: G01R1/073 ,  H01L23/485 ,  H05K3/32

    CPC classification number: H05K3/326 ,  G01R1/06738 ,  G01R1/0735 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/0373 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10734 ,  H01L2924/00

    Abstract: A test contact element (56,57,58) for making temporary electrical contact with a microcircuit terminal comprises at least one resilient finger (56a,56b,57a,57b) projecting from an insulating contact membrane (50) as a cantilevered beam. The finger has on a contact side thereof, a conducting contact pad for contacting the microcircuit terminal. Preferably the test contact element has a plurality of fingers, where each finger is defined at least in part by two radially oriented slots (62) in the membrane that mechanically separate each finger from every other finger of the plurality of fingers forming the test contact element. A plurality of the test contact elements can form a test contact element array (40) comprising with the test contact elements arranged in a predetermined pattern. A plurality of connection vias preferably in an interface membrane are arranged in substantially the predetermined pattern of the test contact elements, with each of said connection vias aligned with one of the test contact elements. The connection vias may have a cup shape with an open end, with the open end of the cup-shaped via contacting the aligned test contact element. The contact and interface membranes may be used as part of a test receptacle including a load board on which individual microcircuits are mounted for testing.

    Abstract translation: 用于与微电路端子进行临时电接触的测试接触元件（56,57,58）包括作为悬臂梁从绝缘接触膜（50）突出的至少一个弹性指（56a，56b，57a，57b）。 手指在其接触侧具有用于接触微电路端子的导电接触垫。 优选地，测试接触元件具有多个指状物，其中每个指状物至少部分地由隔膜中的两个径向取向的狭槽（62）限定，其将每个指状物与形成测试接触元件的多个指状物中的每个其他指状物 。 多个测试接触元件可形成测试接触元件阵列（40），测试接触元件阵列（40）包括以预定图案布置的测试接触元件。 优选地在界面膜中的多个连接通孔以基本上预定的测试接触元件图案布置，每个所述连接通孔与测试接触元件中的一个对齐。 连接通孔可以具有开口端的杯形，并且杯形通孔的开口端接触对准的测试接触元件。 接触膜和界面膜可以用作测试插座的一部分，包括载有单个微电路的负载板用于测试。

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