公开(公告)号：EP1843391A4

公开(公告)日：2009-12-30

申请号：EP06811611

申请日：2006-10-11

Applicant: MURATA MANUFACTURING CO

Inventor： KIMURA MASAHIRO ,  SAITO YOSHIFUMI

IPC: H01L23/12 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K1/141 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/284 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10477 ,  H05K2203/308 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP1872400A4

公开(公告)日：2009-06-24

申请号：EP06721756

申请日：2006-04-05

Applicant: TIR TECHNOLOGY LP

Inventor： SPEIER INGO

IPC: H01L23/12 ,  F21V29/00 ,  G02B6/00 ,  G02B6/42 ,  H01L23/34 ,  H01L33/64

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V29/004 ,  F21V29/006 ,  F21V29/52 ,  F21V29/763 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/2919 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/12041 ,  H01L2924/14 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10477 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a mounting assembly for one or more light-emitting elements, wherein the mounting assembly is configured such that the one or more light-emitting elements are inferiorly connected to a carrier. The carrier comprises one or more light transmission regions, wherein each of the one or more light-emitting elements is aligned with a light transmission region enabling light to pass through the carrier. The inferior mounting of the light-emitting elements can provide ease of thermal access to a cooling interface associated with the one or more light-emitting elements by a thermal management system.

Abstract translation: 本发明提供一种用于一个或多个发光元件的安装组件，其中安装组件被构造成使得所述一个或多个发光元件在下方连接到载体。 载体包括一个或多个光透射区域，其中一个或多个发光元件中的每一个与使光能够穿过载体的光透射区域对准。 发光元件的较差安装可以容易地通过热管理系统热接入与一个或多个发光元件相关联的冷却接口。

公开(公告)号：EP1944552A3

公开(公告)日：2009-04-15

申请号：EP07124160.8

申请日：2007-12-28

Applicant: SELTA S.r.l.

Inventor： Biolcati, Gian Pietro

IPC: F24C3/12 ,  F24C7/08 ,  H05K1/18 ,  H05K3/34

CPC classification number: B65G17/36 ,  B65G47/965 ,  B65G2201/0211 ,  B65G2203/044 ,  F24C7/082 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/0058 ,  H05K3/0067 ,  H05K2201/0108 ,  H05K2201/09072 ,  H05K2201/10128 ,  H05K2201/10477

Abstract: A cook top control pad includes: a capacitive keypad (4-1), set in contact with a cook top (1) and electrically connected to a control unit (C), so that the latter detects positioning of at least one finger of a user in selected areas of the upper surface of the same cook top (1); and a through hole (4-2), aimed at being associated to a display (4-3), electrically connected to the control unit (C); and means (4-4) of electric connection of the display (4-3) to tracks made on a control pad (4) near the edges of the through hole (4-2), for the electric connection of the display (4-3) with the control unit (C). Said electric connection means (4-4) can also mechanically fasten the display (4-3) to the control pad (4), and can be provided on the upper side, lateral portion as well as lower side of the display base (4-3-1).

公开(公告)号：EP1872400A1

公开(公告)日：2008-01-02

申请号：EP06721756.2

申请日：2006-04-05

Applicant: Tir Systems Ltd.

Inventor： SPEIER, Ingo

IPC: H01L23/12 ,  H01L23/34 ,  H01L33/00

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V29/52 ,  F21V29/763 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/2919 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/12041 ,  H01L2924/14 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10477 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a mounting assembly for one or more light-emitting elements, wherein the mounting assembly is configured such that the one or more light-emitting elements are inferiorly connected to a carrier. The carrier comprises one or more light transmission regions, wherein each of the one or more light-emitting elements is aligned with a light transmission region enabling light to pass through the carrier. The inferior mounting of the light-emitting elements can provide ease of thermal access to a cooling interface associated with the one or more light-emitting elements by a thermal management system.

Abstract translation: 本发明提供一种用于一个或多个发光元件的安装组件，其中安装组件被构造成使得所述一个或多个发光元件在下方连接到载体。 载体包括一个或多个光透射区域，其中一个或多个发光元件中的每一个与使光能够穿过载体的光透射区域对准。 发光元件的较差安装可以容易地通过热管理系统热接入与一个或多个发光元件相关联的冷却接口。

公开(公告)号：EP1652232B1

公开(公告)日：2007-11-07

申请号：EP04762426.7

申请日：2004-07-20

Applicant: Technische Universität

Inventor： HEYEN, Johann ,  JACOB, Arne, F.

IPC: H01L23/373

CPC classification number: H01L23/552 ,  H01L23/5385 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/183 ,  H05K3/323 ,  H05K2201/10477 ,  H05K2201/10674

Abstract: The invention relates to a multichip circuit module comprising a main board (9), at least one carrier substrate (1) mounted on said main board (9) and electrically contacting said main board and at least one semiconductor chip (5) arranged on the carrier substrate (1) that is electrically contacted with the carrier substrate (1). The carrier substrate (1) has at least one cavity (4) on an assembly surface (3) for receiving at least one semiconductor chip (5), wherein the cavity (4) has connecting contacts (6) for associated bumps (7) of the semiconductor chip (5), the at least one semiconductor chip (5) is mounted with the bumps (7) in the connecting contacts (6) using the flip-chip-technique, the assembly surface (3) of the carrier substrate (1) is placed on a contact surface (10) of the main board (9) and a filling material(11) is provided between the contact surface (10) of the main board (9) and the assembly surface (3) of the carrier substrate (1).

公开(公告)号：EP1850644A1

公开(公告)日：2007-10-31

申请号：EP06702531.2

申请日：2006-01-06

Applicant: Tyco Electronics AMP K.K.

Inventor： TSUJI, Junya c/o Tyco Electronics AMP K.K.,

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K3/3415 ,  H05K2201/10189 ,  H05K2201/10477 ,  H05K2201/1084 ,  H05K2203/1572 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A surface mounted electric part not requiring any additional facility investment on soldering and free from coming off a substrate even when the substrate is turned over and subjected to reflow. In a state that an electrical part is placed under a circuit board (100), the sum B of the periphery length of a second soldering portion (P2) is so set that the relationship between a downward rotation moment (M1) around a first soldering portion (P1) produced by the gravity and an upward rotation movement (M2) acting on a second soldering portion (P2) produced by the surface tension of solder melted during soldering using the overall heating method is M1 ≤ M2, and the sum A of the periphery length of the first soldering portion (P1) is so set that the relationship between a downward rotation movement (M3) around the second soldering portion (P2) produced by the gravity and an upward rotation movement (M4) acting on the first soldering portion (P1) produced by the surface tension is M3 ≤ M4.

Abstract translation: 一种表面安装的电气部件，即使当基板翻转并经受回流时，也不需要额外的焊接投资并且不会脱离基板。 在将电气部件配置在电路基板（100）的状态下，第二焊接部（P2）的周长的总和B被设定为使得第一焊接周围的向下旋转力矩（M1） 通过重力产生的部分（P1）和通过使用整体加热方法在焊接期间熔化的焊料的表面张力产生的作用在第二焊接部分（P2）上的向上旋转运动（M2）为M1‰M2，并且总和A为 第一焊接部（P1）的周边长度被设定为使得由重力产生的第二焊接部（P2）周围的向下旋转运动（M3）与作用在第一焊接上的向上旋转运动（M4）之间的关系 由表面张力产生的部分（P1）为M3‰M4。

公开(公告)号：EP1590500A2

公开(公告)日：2005-11-02

申请号：EP04705844.1

申请日：2004-01-28

Applicant: Conductive Inkjet Technology Limited

Inventor： HUDD, Alan ,  BENTLEY, Philip ,  FOX, James ,  ROBINSON, Martyn

IPC: C23C18/16

CPC classification number: C23C18/1678 ,  B42D25/373 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/1658 ,  C23C18/1676 ,  H01M10/04 ,  H05K1/095 ,  H05K3/125 ,  H05K3/182 ,  H05K3/305 ,  H05K2201/10477 ,  H05K2203/013 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/1163 ,  H05K2203/1469

Abstract: There is disclosed a method of forming a conductive metal region on a substrate, comprising depositing on the substrate a solution of a metal ion, and depositing on the substrate a solution of a reducing agent, such that the metal ion and the reducing agent react together in a reaction solution to form a conductive metal region on the substrate.

公开(公告)号：EP1062634A1

公开(公告)日：2000-12-27

申请号：EP00900614.9

申请日：2000-01-19

Applicant: BULL CP8

Inventor： CARPIER, Roland ,  LAUVERNIER, Christine ,  LE LOC'H, Alain

IPC: G06K19/077

CPC classification number: G06K19/07769 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/48227 ,  H01L2924/01057 ,  H01L2924/01078 ,  H05K1/112 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10477 ,  H05K2203/0465 ,  Y02P70/613

Abstract: The invention concerns a chip card comprising a base body consisting of electrically insulating layers, the card bearing on one of its layers an open-loop antenna (6) having two ends, said body being provided with a cavity housing a micromodule (1) designed to be connected to said open-loop antenna by two terminals (31, 32), said micromodule comprising an electrically insulating support (2) bearing, on one first surface, a semiconductor component (3) and, on a second surface, several electric contact pads. The invention is characterised in that two contact pads (22, 23) are arranged in a strip passing through a central region of the support, said terminals being connected to said two contact pads respectively through said support, the two contact pads being connected to the antenna two ends respectively.

公开(公告)号：EP0933816A3

公开(公告)日：2000-04-05

申请号：EP99101533.0

申请日：1999-01-29

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Suzuki, Kazutaka ,  Narita, Naoto ,  Watanabe, Tohru ,  Kamiyama, Yoshiaki ,  Yagi, Kazuki

IPC: H01L25/07 ,  H01L23/34 ,  H01L25/16 ,  H01L23/13

CPC classification number: H05K1/141 ,  H01L23/36 ,  H01L23/49805 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/183 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2201/10674

Abstract: In a hybrid module (10) which is mounted on a mother circuit board with a first surface (18) of a substrate (11) opposed to said mother circuit board, a cavity (19) is formed on said first surface (18), and a heat-generating circuit component (13) is facedown-bonded in said cavity (19). Heat generated in the circuit component (13) is radiated to the mother circuit board through a heat radiation plate (14).

公开(公告)号：EP0822595A3

公开(公告)日：1999-03-03

申请号：EP97112139.7

申请日：1997-07-16

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Suzuki, Kazutaka

IPC: H01L25/16

CPC classification number: H05K1/141 ,  H01L23/13 ,  H01L23/36 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/183 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10386 ,  H05K2201/10477 ,  H05K2201/10674

Abstract: A hybrid module comprising a circuit board (11), a heat generate circuit component (14) mounted on the circuit board (11) and a mother board (19) on which the circuit board (11) is mounted, wherein the circuit component (14) is mounted on the circuit board (11) opposing the mother board (19), and the surface of the circuit component (14) is fixed to a thermal conductive member (21) having a shape like a film and formed on the mother (19). With such an arrangement, heat generated in the circuit component (14) is transmitted to the mother board (19) via the thermal conductive member (21).