公开(公告)号：EP1841296A1

公开(公告)日：2007-10-03

申请号：EP07105361.5

申请日：2007-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shin, Sang-chul

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0281 ,  G11B5/4846 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09781 ,  H05K2201/2009 ,  Y10T29/49025 ,  Y10T29/49124

Abstract: A flexible printed circuit board (150A-150H) has a flexible dynamic region (151), and relatively rigid static regions (152,153) between which the dynamic region (151) extends. Portions of a base layer (161), a conductive layer (165) extending on the base layer (161), and a cover layer (162) covering the conductive layer (165) make up the dynamic region (151). Extensions of the base layer (161), the conductive layer (165), and the cover layer (162), and portions of a metal layer (180) to which the base layer (161) is attached make up each of the static regions (152,153). The metal layer (180) enhances the rigidity of the flexible printed circuit board (150A-H) at the static regions (152,153). The metal layer (180) also has rounded corners (190A-D,192A-D) at sides of each of the boundaries (i,ii) between the dynamic region (151) and each of the static regions (152, 153) to minimize stress concentrations at the boundaries (i,ii). The conductive layer (165) is made up of real traces (166) through which electrical signals are transmitted, and dummy traces (167A). The dummy traces (167A) are disposed outwardly of the real traces (166) to prevent the flexible printed circuit board (150A-H) from cracking at the boundaries (i,ii) between the dynamic region (151) and each of the static regions (152,153). In a hard disk drive (HDD) the flexible printed circuit board (150A-F) electrically connects a head stack assembly (HSA) and a main circuit board.

Abstract translation: 柔性印刷电路板（150A-150H）具有柔性动态区域（151）和相对刚性的静态区域（152,153），动态区域（151）延伸在其间。 基底层（161）的一部分，在基底层（161）上延伸的导电层（165）和覆盖导电层（165）的覆盖层（162）构成动态区域（151）。 基底层（161），导电层（165）和覆盖层（162）的延伸部以及与基底层（161）连接的金属层（180）的部分构成每个静电区域 （152,153）。 金属层（180）增强了静电区域（152,153）处的柔性印刷电路板（150A-H）的刚性。 金属层（180）在动态区域（151）和每个静态区域（152,153）之间的每个边界（i，ii）的侧面处还具有圆角（190A-D，192A-D）至 最小化边界处的应力集中（i，ii）。 导电层（165）由传输电信号的实际迹线（166）和虚拟迹线（167A）组成。 虚拟轨迹（167A）设置在实际迹线（166）的外侧，以防止柔性印刷电路板（150A-H）在动态区域（151）和静态 地区（152,153）。 在硬盘驱动器（HDD）中，柔性印刷电路板（150A-F）电连接磁头堆叠组件（HSA）和主电路板。

公开(公告)号：EP1830336A1

公开(公告)日：2007-09-05

申请号：EP05719375.7

申请日：2005-02-22

Applicant: FUJIFILM Corporation

Inventor： SATOH, Tasuku, c/o Fuji Film Corporation

IPC: G09F9/30

CPC classification number: G02F1/133305 ,  G09F9/30 ,  H01L51/0097 ,  H01L51/52 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09909 ,  H05K2201/2009 ,  Y02E10/549 ,  Y10T428/24355

Abstract: An anti-deformation structure is formed on the surface of a flexible plate-shaped part. The anti-deformation structure includes protrusions and depressions formed on the surface of the plate-shaped part. The protrusions and depressions has a shape in which adjacent protrusions become in contact with each other in the state when the plate-shaped part is deformed within a range of elastic deformation, restricting further greater deformation, and thus, preventing excessive deformation leading to permanent deformation and raising the resistance to the stress. The flexible base material can be applied to flexible image-displaying devices.

Abstract translation: 在柔性板状部件的表面上形成抗变形结构。 抗变形结构包括形成在板状部分的表面上的突起和凹陷。 突起和凹陷具有在板状部在弹性变形的范围内变形的状态下相邻的突起彼此接触的形状，限制更大的变形，从而防止过度的变形导致永久变形 并提高对压力的抵抗力。 柔性基材可应用于柔性图像显示装置。

公开(公告)号：EP1468042B1

公开(公告)日：2007-04-18

申请号：EP03731660.1

申请日：2003-01-23

Applicant: JENOPTIK Automatisierungstechnik GmbH

Inventor： FEISTEL, Ulf ,  DIENER, Roland ,  WEINZIERL, Uwe

IPC: C08J9/00 ,  C09J5/08

CPC classification number: G02B6/4405 ,  G02B6/4226 ,  H05K1/0281 ,  H05K1/0289 ,  H05K3/4084 ,  H05K2201/0112 ,  H05K2201/057 ,  H05K2201/2009 ,  H05K2203/107 ,  H05K2203/1189

Abstract: The aim of the invention is to provide positioning and mounting options with improved handling characteristics even at places that are difficult to access or in other difficult conditions. Said aim is achieved by using functional elements comprising at least one area that can be foamed by supplying energy. At least one of said areas is used as a positioning element for positioning an object or for stiffening flexible or easily bendable materials in a shape-stabilizing manner.

公开(公告)号：EP1361034B1

公开(公告)日：2006-09-13

申请号：EP03010114.1

申请日：2003-05-05

Applicant: Sagem Orga GmbH

Inventor： Zander, Jörg

IPC: B29C45/14 ,  G06K19/077

CPC classification number: G06K19/07724 ,  B29C45/14647 ,  B29C2045/14844 ,  B29L2031/3456 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/20 ,  H05K3/281 ,  H05K2201/09118 ,  H05K2201/2009

公开(公告)号：EP1665909A1

公开(公告)日：2006-06-07

申请号：EP04757314.2

申请日：2004-07-27

Applicant: MOTOROLA, INC.

Inventor： GALL, Thomas, P. ,  MOORE, Kevin, D. ,  TRENTO, Timothy, J.

IPC: H05K1/00

CPC classification number: H05K1/0281 ,  H05K1/0366 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: A flexible circuit board assembly comprising a flexible circuit board (304) having a first portion and a second portion separated by a bendable region (320) and a substantially rigid substrate (306) having a first portion and a second portion separated by a bend region (310). The rigid substrate (306) has an inside surface (322) and an outside surface. The first and second portions of the circuit board (304) are affixed to the respective first and second portions of the substrate (306) such that when the substrate is bent the bendable region (320) of the circuit board (304) must also bend. The bend region (320) has a recess (314) extending outwardly from the inside surface (322) of the substrate (306), and the recess is sized to accept the bendable region (320) of the circuit board around a single bend axis when the substrate (306) is bent. The recess provides for a larger bend radius of the circuit board reducing stress.

公开(公告)号：EP1651015A1

公开(公告)日：2006-04-26

申请号：EP05256182.6

申请日：2005-10-04

Applicant: SEIKO EPSON CORPORATION

Inventor： Miyagawa, Sakiko, c/o Seiko Epson Corporation ,  Kobayashi, Shinichi, c/o Seiko Epson Corporation

IPC: H05K1/00 ,  H05K3/36

CPC classification number: H05K3/361 ,  G02F1/13452 ,  G02F2001/13456 ,  H05K1/0281 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/2009

Abstract: An electro-optical device includes: a first substrate (5) having an end edge (5b); a second substrate (3) that has an edge (3a) crossing the end edge and a plurality of first wiring lines (22) crossing the end edge (5b), the second substrate having flexibility and being connected to the first substrate so as to overlap the end edge; and first reinforcing members (26) provided on the second substrate so as to cross the end edge (5b), in a region between the plurality of first wiring lines (22) and a portion where the end edge (5b) and the edge (3a) cross each other.

Abstract translation: 电光装置包括：具有端边缘（5b）的第一基板（5）; 具有与所述端缘交叉的边缘（3a）和与所述端部边缘（5b）交叉的多个第一布线（22）的第二基板（3），所述第二基板具有柔性并与所述第一基板连接，以便 重叠端边; 以及设置在所述第二基板上以与所述端边缘（5b）交叉的第一加强构件（26），所述第一加强构件（26）在所述多个第一布线（22）与所述端边缘（5b）和所述边缘 3a）交叉。

公开(公告)号：EP1458018B1

公开(公告)日：2006-04-19

申请号：EP04001572.9

申请日：2004-01-26

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Maeda, Takenobu, Murata Manufacturing Co., Ltd.

IPC: H01L21/607 ,  H01L21/60

CPC classification number: H05K1/0271 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

公开(公告)号：EP1550889A3

公开(公告)日：2005-12-14

申请号：EP04105490.9

申请日：2004-11-03

Applicant: IBM Corporation

Inventor： Oggioni, Stefano ,  Offrein, Bert

IPC: G02B6/43

CPC classification number: H05K1/147 ,  G02B6/43 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/301 ,  H05K2201/048 ,  H05K2201/09127 ,  H05K2201/10606 ,  H05K2201/2009 ,  H05K2203/302

Abstract: An electro-optical module (130) comprising flexible connection cable and aligning capabilities is disclosed. According to the invention, electro-optical devices are soldered on a transparent substrate (210) such as glass or a substrate comprising an optical waveguide (230) wherein electrically conductive traces (300) are designed, forming an electro-optical module (130). When such electro-optical module (130) is inserted and aligned into a printed circuit board (115), the external part of the substrate (210), comprising electrically conductive traces and pads referred to as flex-cable, is bent down toward the mounting plane of the PCB (115) allowing to establish electrical connections between these pads and the PCB. The substrate gets broken along a pre-formed groove and the external part of the substrate can be removed leaving the flex-cable section in place.

公开(公告)号：EP1601053A1

公开(公告)日：2005-11-30

申请号：EP05010152.6

申请日：2005-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Ooyabu, Yasunari

IPC: H01R12/04

CPC classification number: H05K1/142 ,  H01R12/61 ,  H05K3/0058 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: In order to provide a wired circuit board in which electrical continuity inspection can be omitted and a connection structure of the wired circuit board, in connection between a first wired circuit board 1 and a second wired circuit board 2, a first connection terminal 13 and a second connection terminal 14 are abutted against each other in the direction in which they are opposed along the respective longitudinal direction of the wired circuit boards, and are arranged in line with each other, and a solder bump 15 is provided so as to continuously extend over surfaces of the first connection terminal 13 and the second connection terminal 14. Consequently, the solder bump 15 is not interposed between opposed surfaces of the first connection terminal 13 and the second connection terminal 14, thereby allowing electrical connection by the solder bump 15 between the first connection terminal 13 and the second connection terminal 14 to be confirmed from the appearance by visual observation.

Abstract translation: 为了提供可以省略电连续性检查的布线电路板以及布线电路板在第一布线电路板1和第二布线电路板2之间的连接结构中的第一连接端子13和 第二连接端子14沿着与布线电路板的纵向方向相对的方向彼此抵接，并且彼此排成一列，并且设置焊料凸块15，以连续地延伸越过 第一连接端子13和第二连接端子14的表面。因此，焊料凸块15不插入在第一连接端子13和第二连接端子14的相对表面之间，从而允许焊料凸块15在 第一连接端子13和第二连接端子14通过目视观察从外观确认。

公开(公告)号：EP1392495A4

公开(公告)日：2005-10-12

申请号：EP02734652

申请日：2002-06-04

Applicant: POLYMER GROUP INC

Inventor： ZUCKER JERRY ,  CARTER NICK MARK

IPC: C08J5/04 ,  B29B15/12 ,  B29C70/12 ,  B29C70/16 ,  B29C70/36 ,  B29C70/50 ,  B32B5/24 ,  D04H1/46 ,  D04H1/48 ,  D04H3/10 ,  D04H5/02 ,  D04H13/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  B32B3/24

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (printed Circuit Board) and similar application. The nonwoven substrate is formed from a precursor web (P) which undergoes entangling treatment by entangling manifolds (16, 20, 24'). By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.