公开(公告)号：EP0804056A3

公开(公告)日：1999-02-03

申请号：EP97106924.0

申请日：1997-04-25

Applicant: NGK Spark Plug Co. Ltd.

Inventor： Yamasaki, Kozo, c/o NGK Spark Plug Co.,Ltd ,  Saiki, Hajime, c/o NGK Spark Plug Co.,Ltd

IPC: H05K3/34

CPC classification number: H01R12/52 ,  H01R43/0235 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49165

Abstract: A connecting board for electrically and mechanically connecting a base plate such as a circuit board having disposed thereon an IC chip to a mounting board such as a motherboard. The connecting board includes a substrate having a plurality of through holes, a plurality of soft metal bodies which are deformable with ease and which are mounted in the through holes, and a plurality of solder layers disposed on upper and lower end portions of the soft metal bodies. The soft metal bodies are mounted in the through holes by disposing soft metal pieces at end portions of the through holes, heating and melting and allowing them to be poured into the through holes. The solder layers are disposed on the upper and lower end portions of the soft metal bodies by using transfer jigs each having a plurality of holes filled with solder paste, placing the jigs on the upper and lower end portions of the soft metal bodies, melting the solder paste and allowing them to he transferred onto the soft metal bodies. An assembly of the base plate, connecting board and mounting board can be obtained by placing them one upon another and heating them.

Abstract translation: 连接板，用于将诸如母板之类的安装板上的IC芯片上的电路板等基板电连接和机械连接。 连接板包括具有多个通孔的基板，容易变形并且安装在通孔中的多个软金属体，以及设置在软金属的上端部和下端部的多个焊料层 身体。 通过在通孔的端部设置软金属片，加热熔融并使其倾入通孔，将软金属体安装在通孔中。 通过使用具有填充有焊膏的多个孔的转移夹具将焊料层设置在软金属体的上端部和下端部，将夹具放置在软金属体的上端部和下端部， 焊膏，并允许他们转移到软金属体上。 基板，连接板和安装板的组装可以通过将它们放置在另一个上并加热来获得。

公开(公告)号：EP0649273A1

公开(公告)日：1995-04-19

申请号：EP94115754.7

申请日：1994-10-06

Applicant: HOECHST AKTIENGESELLSCHAFT

Inventor： Pfeiffer, Bernhard, Dr. ,  Skaletz, Detlef, Dr.

IPC: H05K3/10 ,  H05K9/00

CPC classification number: H05K9/0088 ,  H05K1/095 ,  H05K3/102 ,  H05K3/245 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/035 ,  H05K2203/0783

Abstract: Zur Herstellung eines elektrischen Kontakts an einem elektrisch leitfähigen Formkörper aus thermoplastischem Material, der Metallfasern enthält, wird auf die Oberfläche des Formkörpers eine Suspension aufgetragen, die ein elektrisch leitfähiges Pulver sowie ein Lösungsmittel enthält, das das thermoplastische Material des Formkörpers anlöst oder aufquillt. Dann läßt man die aufgetragene Suspension eintrocknen.

Abstract translation: 为了在由包含金属纤维的热塑性材料构成的导电模塑件上进行电接触，悬浮液沉积在模制品的表面上，悬浮液含有导电粉末以及溶解或溶胀热塑性塑料的溶剂 成型材料。 然后可以将沉积的悬浮液干燥。

公开(公告)号：EP0421179B1

公开(公告)日：1995-02-01

申请号：EP90117835.0

申请日：1990-09-17

Applicant: GEC ALSTHOM SA

Inventor： Chave, Jacques

IPC: H05K3/12 ,  H05K1/09 ,  H01L21/48

CPC classification number: H05K3/248 ,  H01L21/4867 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035

公开(公告)号：EP0529298A2

公开(公告)日：1993-03-03

申请号：EP92112400.4

申请日：1992-07-20

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Siuta, Vincent Paul

IPC: H05K3/34 ,  H05K3/40 ,  H01L21/48

CPC classification number: H05K3/248 ,  H01L21/4867 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/3484 ,  H05K2201/017 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/044 ,  H01L2924/00

Abstract: A method for making a thick film/solder joint comprising the sequential steps of:

(1) applying a layer (3) of first thick film conductor paste to an electrically non-conductive substrate in a pattern which has preselected solder pad areas and firing the layer;
(2) applying over the first thick film layer only within the solder pad area a layer (5) of a second thick film conductor paste having a low frit content and firing the layer; and
(3) forming the solder joint by applying to the fired second thick film layer a layer of soft solder (9).

Abstract translation: 一种用于制造厚膜/焊接接头的方法，包括以下顺序步骤：（1）将第一厚膜导体浆料层（3）以具有预选焊盘区域的图案施加到不导电衬底上， 层; （2）仅在所述焊盘区内在所述第一厚膜层上施加具有低玻璃料含量的第二厚膜导体膏层（5）并焙烧所述层; 和（3）通过向烧制的第二厚膜层施加一层软焊料（9）来形成焊点。

公开(公告)号：EP0359413A3

公开(公告)日：1990-09-05

申请号：EP89308418.6

申请日：1989-08-18

Applicant: STC PLC

Inventor： McDougall, Andrew Murry ,  Winster, Anthony Eric

IPC: H01L23/538 ,  H01L25/16

CPC classification number: H05K3/4061 ,  H01L23/49866 ,  H01L23/5384 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/035 ,  H05K2201/0769 ,  H01L2924/00

Abstract: A co-fired hybrid circuit includes silver internal connections, such as vias (1,4) and patterns (3), and gold-based external connections (6). A diffusion barrier (9′), for example of palladium-silver, covers a via (4) which extends towards an external surface of an outermost layer (5) of a stack of ceramic sheets (2, 5). The diffusion barrier (9′) can be screen printed onto layer (5) following formation of the via (4) and prior to lamination, burn out and firing of the stack. The gold external connections are applied subsequently to firing.

Abstract translation: 共烧混合电路包括银内部连接，例如通孔（1,4）和图案（3）以及金基外部连接（6）。 扩散阻挡层（9分钟），例如钯 - 银覆盖了朝向陶瓷片（2,5）的最外层（5）的外表面延伸的通孔（4）。 在形成通孔（4）之后并且在层压之前，扩散阻挡层（9分钟）可以丝网印刷到层（5）上，烧结和烧制堆叠。 黄金外部连接随后应用于点火。

公开(公告)号：EP0364095A2

公开(公告)日：1990-04-18

申请号：EP89308931.8

申请日：1989-09-04

Applicant: DELCO ELECTRONICS CORPORATION (a Delaware corp.)

Inventor： Palanisamy, Ponnusamy

IPC: H01C17/28 ,  H01C1/142 ,  H05K1/16 ,  H01C7/00

CPC classification number: H05K1/167 ,  H01C1/142 ,  H01C7/003 ,  H01C17/281 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2203/1453 ,  H05K2203/1461

Abstract: A printed circuit board (10) includes both high and low resistive value thick film resistors interconnected by a copper film (18). To lower the contact resistance to the thick film resistors (12) of high value, each is provided at its ends with a termination (16A,16B) of a composition similar to that used for the low value resistors (16). This provides a relatively low-resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The compositions of high and low resistivities are adapted to permit firing of both compositions in a single firing step.

Abstract translation: 印刷电路板（10）包括通过铜膜（18）互连的高电阻值和低电阻值厚膜电阻器。 为了降低对高值的厚膜电阻器（12）的接触电阻，它们的端部设置有与用于低值电阻器（16）的组成类似的组合的终端（16A，16B）。 这提供了一种相对低电阻的接触区域，其克服了铜厚膜导体与通常用于制造高价值厚膜电阻器的组合物的电连接的困难。 高电阻率和低电阻率的组合物适于允许在单个烧制步骤中对两种组合物进行烧制。

公开(公告)号：EP0308576A2

公开(公告)日：1989-03-29

申请号：EP88105342.5

申请日：1988-04-02

Applicant: Nippon CMK Corp.

Inventor： Kawakami, Shin ,  Haruyama, Satoshi ,  Okonogi, Hirotaka ,  Nikaido, Katsutomo ,  Mukai, Norito

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H05K3/245 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/035 ,  H05K2201/0989

Abstract: The invention relates to a printed wiring board (13) which forms circuit conductors (11) on one or both surfaces of a base plate (10). A heat radia­ting film (12) formed of paste of heat radiating material covers the circuit conductors (11). Thus, heat produced in the circuit conductors (11) is effectively dissipated.

Abstract translation: 本发明涉及一种在基板（10）的一个或两个表面上形成电路导体（11）的印刷线路板（13）。 由散热材料膏形成的散热膜（12）覆盖电路导体（11）。 因此，电路导体（11）中产生的热量被有效地消散。

公开(公告)号：EP0245770A2

公开(公告)日：1987-11-19

申请号：EP87106589.2

申请日：1987-05-07

Applicant: SUMITOMO METAL CERAMICS INC.

Inventor： Nishigaki, Susumu ,  Fukuda, Junzo Arimatsu Green Heights 14-11 ,  Kawabe, Hiroshi Corpo Tokai 101 ,  Yano,Shinsuke

IPC: H05K1/03 ,  H05K3/46 ,  H05K1/05

CPC classification number: H05K3/4061 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/167 ,  H05K3/181 ,  H05K3/246 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  Y10S428/901 ,  Y10T428/12507 ,  Y10T428/12514 ,  Y10T428/12896 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A multilayer ceramic substrate with multilayered circuit patterns, the improvement in which internal conductors for wiring are formed by a Ag base conductive materials capable of being co-fired with multilayered green ceramic substrate sheets in an oxidizing atmosphere and external conductors electrically connected with the internal conductors are formed by a Cu base conductive material, the external Cu conductors being formed in such a manner so that a liquid phase of Cu-Ag is not formed at the interface of the Cu conductor and the Ag conductor. Further high reliable resistors of RuO₂ or Bi₂Ru₂O₇ type may be integrally formed onto and/or inside the substrate. In such an arrangement, problems or difficulties caused due to Ag migration, incomplete binder removal, solder leaching, etc., are eliminated and thereby there can be a multilayer substrate wit a high reliability and a high pattern precision.

Abstract translation: 用多层电路图案的多层陶瓷基板，其改进，其中用于布线内部导体是由Ag基FORMED能够被共烧，在多层未经烧结的陶瓷基片板在氧化气氛和外部导体与所述内部导体电连接的导电材料 由Cu基导电材料形成，则外部铜导体形成在寻求一种方式象铜 - 银的液相在铜导体和Ag导体的界面处不形成。 的RuO 2或Bi2Ru2O7类型的进一步高可靠的电阻器可以被整体形成到和/或基底的内部。 在搜索的由于银迁移，不完全除去粘合剂，焊料浸析等引起的布置中，问题或困难，被消除，从而可以有一个多层基板机智高可靠性和高的图案精度。

公开(公告)号：EP0240654A1

公开(公告)日：1987-10-14

申请号：EP87100930.4

申请日：1987-01-23

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Siuta, Vincent Paul

IPC: H01B1/16 ,  H01L49/02 ,  H05K1/09

CPC classification number: H05K3/248 ,  H01B1/026 ,  H01L23/49866 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H01L2924/00

Abstract: A fritiess copper conductor composition suitable tor overprinting on copper consisting essentially of (a) 10-50% wt. finely divided copper particles, (b) 90-50% wt. coarse copper particles, (c) 0.2-2% wt. reducible heavy metal oxide, (d) 0-1.0% refractory metal and (e) 0-5.0% of a high surface area noble metal, all the particles being dispersed in an organic medium.

Abstract translation: 一种适用于在铜上套印的无油铜导体组合物，其基本上由（a）10-50重量％ 细分铜颗粒，（b）90-50％wt。 粗铜颗粒，（c）0.2-2％ （d）0-1.0％的难熔金属和（e）0-5.0％的高表面积贵金属，所有的颗粒都分散在有机介质中。

公开(公告)号：EP0207012A2

公开(公告)日：1986-12-30

申请号：EP86830164

申请日：1986-06-11

Applicant: MAS IND S P A

Inventor： DETOMA BIGLIA RENZO

IPC: H01L23/34 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K7/20

CPC classification number: H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0268 ,  H05K1/05 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/0154 ,  H05K2201/035 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2203/0207 ,  H05K2203/0228 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The method ensures the cooling of electronic components (CE) fixed on a multilayer (1), with at least a metal layer (3) interposed between insulating layers (11), through successive steps for the obtaining of seats or cavities (13) or through-holes (31) with metallized surface, the seats or cavities (13) having the bottom formed by said metal layer (3) and the through-holes (31) being formed in the vicinity of the same seats; the cooling of the component (CE) is achieved by heat conduction along said metal layer (3), or by dissipator means (21, 23) located outside the multilayer and in thermal conductivity connection with said metal layer (3).

Abstract translation: 该方法确保与至少一个金属层固定在多层（1）的电子元件（CE）的冷却（3）绝缘层（11），通过对于座或腔体（13）的获取或连续步骤之间 通孔（31）与金属化的表面，具有由所述金属层形成的底部的座或腔体（13）（3）和通孔（31）形成在相同的座位附近; 组分（CE）的冷却是通过沿所述金属层（3），或通过位于多层外耗散装置（21，23）和与所述金属层的热导率连接的热传导取得（3）。