公开(公告)号：EP1058306A3

公开(公告)日：2005-03-30

申请号：EP00111065.9

申请日：2000-06-02

Applicant: JAPAN RADIO CO., LTD

Inventor： Yatsuda, Hiromi

IPC: H01L23/10 ,  H01L23/04

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/10666 ,  H05K2203/1147 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: Substrate 10 has bumps 28, 30, 32, 34 and a substrate 20 has openings 36, 38, 40, 42 at positions in which bumps 28, 30, 32, 34 confront respectively. The substrates 10 and 22 are put together by fusing a sealing wall 26 formed on the substrate 22, to hermetically seal an electronic device lying on the substrate 10 therein. Gas that may be generated upon fusing of the sealing wall 26 can be effectively removed through the openings 36, 38, 40, 42 in the substrate 22.

公开(公告)号：EP1425767A1

公开(公告)日：2004-06-09

申请号：EP02724857.4

申请日：2002-04-22

Applicant: MIC AB ,  Nokia Corporation

Inventor： RYHÄNEN, Tapani ,  SCHECK, Hans, Otto ,  ÖHMAN, OveAsplunda ,  LARSSON, Olle ,  READ, Mike ,  LINDSTRÖM, Tomas

IPC: H01F41/04 ,  H01G4/002 ,  H01C17/06

CPC classification number: H01S4/00 ,  H01C17/06 ,  H01F17/0033 ,  H01F27/2804 ,  H01F27/2895 ,  H01F41/04 ,  H01F41/041 ,  H01F41/08 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/205 ,  H05K3/4614 ,  H05K2201/0379 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0594 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49146 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/4922

Abstract: Manufacturing of miniaturised three-dimentional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro replication of at least one master structure, e.g. via a mould structure, in at least one polymer layer onto which layer at least one conductive path is provided.

Abstract translation: 提出了小型化三维电气部件的制造以及通过这些方法制造的部件。 制造方法包括至少一个主结构的微复制，例如。 通过模具结构，在至少一个聚合物层中，至少一个导电路径被设置在该层上。

公开(公告)号：EP1350287A1

公开(公告)日：2003-10-08

申请号：EP02712812.3

申请日：2002-01-11

Applicant: SCHUNK Ultraschalltechnik GmbH

Inventor： STEINER, Ernst ,  STROH, Dieter ,  DIETERLE, Horst

IPC: H01R43/02

CPC classification number: B29C65/082 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/38 ,  B29C66/1122 ,  B29C66/43 ,  H01R4/021 ,  H01R12/59 ,  H01R43/0207 ,  H01R43/0228 ,  H01R43/0263 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2203/0195 ,  H05K2203/0285 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/49208 ,  Y10T29/53217 ,  Y10T29/53243

Abstract: The invention relates to a method and device for connecting the electrical conductors which are surrounded by outer insulation and associated with overlapping flat conductors (47, 49) by means of a sonotrode (52) producing ultrasonic vibrations and a counter electrode associated therewith. The conductors which are to be connected are to be arranged on a surface (48) of a carrier (50) extending between the sonotrode and the counter electrode. The carrier can be embodied as a counter electrode.

公开(公告)号：EP1187520A3

公开(公告)日：2003-01-15

申请号：EP01121380.8

申请日：2001-09-06

Applicant: Visteon Global Technologies, Inc.

Inventor： Jairazbhoy, Vivek Amir ,  Pham, Cuong Van ,  Glovatsky, Andrew Z. ,  Krautheim, Thomas Bernd ,  Belke, Robert Edward, Jr.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4084 ,  H05K1/056 ,  H05K3/062 ,  H05K3/4092 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156

Abstract: The present invention discloses a multi-layer circuit board assembly (10) having a first circuit portion (12) having a top surface and a bottom surface. A first pre-circuit assembly (24) is attached to the top surface of the first circuit portion (12) and includes a top conductive layer (22). A second pre-circuit assembly (32) is attached to the bottom surface of the first circuit portion (12) and includes a bottom conductive layer (30). An aperture is formed through the first circuit portion (12), the first pre-circuit assembly (24) and the second pre-circuit assembly (32). A plurality of tab portions are integrally formed from the top conductive layer (18,22), which extend through the aperture and which are coupled to the bottom conductive layer (12,18).

公开(公告)号：EP1120449A4

公开(公告)日：2002-10-23

申请号：EP98937808

申请日：1998-08-13

Applicant: HITACHI CHEMICAL CO LTD

Inventor： WATANABE ITSUO ,  TAKEMURA KENZO ,  NAGAI AKIRA ,  ISAKA KAZUHIRO ,  WATANABE OSAMU ,  KOJIMA KAZUYOSHI

IPC: C09J9/02 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  C09J9/00 ,  C09J7/00

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

公开(公告)号：EP1094693A2

公开(公告)日：2001-04-25

申请号：EP00122607.5

申请日：2000-10-17

Applicant: Sony Chemicals Corporation

Inventor： Kurita, Hideyuki, c/o Sony Chemicals Corporation ,  Hishinuma, Hiroyuki c/o Sony Chemicals Corp.

IPC: H05K3/46 ,  H05K3/36

CPC classification number: H05K3/4635 ,  H01L24/05 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4084 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2203/0285 ,  Y10S439/943

Abstract: The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces.
A metal coating 26 is formed on the surface of a contact region 18 1 of a metal wiring 28 of each of two flexible wiring board pieces 10, 30 and ultrasonic wave is individually applied by an ultrasonic resonator 45 to the contact regions 18 1 in contact with each other. The metal coatings 26 are bonded to form a multilayer flexible wiring board 50. The bumpless process eliminates any plating step for forming bumps without being influenced by non-uniformity bump height. A thermoplastic resin film 33 may be formed on the surface of one flexible wiring board piece 30 to bond flexible wiring board pieces 10, 30 by the adhesion of the resin film 33.

Abstract translation: 本发明提供的柔性布线板件无扰动超声波接合。 金属涂层26形成在每个的两个柔性布线板件10，30和超声波的金属布线28的接触区域181的表面上分别施加由超声波振子45的接触区域181中接触与每个 其他。 金属涂层26相连接，以形成多层柔性布线板50的无凸块的过程消除了对不被不均匀凸点高度的影响形成凸点任何电镀工序。 一种热塑性树脂薄膜33可在一个挠性电路板片30的表面上形成由所述树脂膜33的粘附性粘合柔性布线板件10，30。

公开(公告)号：EP0645948B1

公开(公告)日：1996-12-11

申请号：EP94306928.6

申请日：1994-09-21

Applicant: AT&T Corp.

Inventor： Degani, Yinon ,  Dudderar, Thomas Dixon ,  Woods, William Lonzo, Jr.

IPC: H05K3/34 ,  B23K3/06

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L2224/13111 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/1225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0379 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/0545 ,  Y02P70/613

公开(公告)号：EP0396484A2

公开(公告)日：1990-11-07

申请号：EP90480051.3

申请日：1990-03-27

Applicant: International Business Machines Corporation

Inventor： Behun, John Richard ,  Miller, William Robert ,  Newman, Bert Harrison ,  Yankowski, Edward Louis

IPC: H05K3/34 ,  H01L21/48

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H05K3/3478 ,  H05K2201/0379 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0557 ,  Y02P70/613 ,  Y10T29/49149

Abstract: A low cost process for fabricating solder column intercon­nections for an electronic package is described. The process includes the steps of filling an array of pin holes in a pin mold (14) with a lead/tin solder, which array of pin holes is in substantial registration with the array of conductive pads (12) on one side of a chip carri­er (2); heating the lead/tin solder in the pin mold such that the solder becomes molten and coalesces with the array of conductive pads of the chip carrier, thereby forming an array of miniature pins (4) bonded to the array of conductive pads of the chip carrier; joining circuit components to the other side of the chip carrier; and reflowing an eutectic lead/tin solder paste screened to the corresponding array of conductive pads of a circuit board to bond the free ends of the array of miniature pins of the carrier to the corresponding array of conductive pads, thereby forming the solder column connections be­tween the chip carrier and the circuit board. The process is suitable for mass production of reliable, high-density electrical inter-connections between a chip carrier and a supporting circuit board.

Abstract translation: 描述了用于制造用于电子封装的焊料柱互连的低成本工艺。 该方法包括以下步骤：用引脚/锡焊料在引脚模具（14）中填充针孔阵列，该引脚阵列与芯片的一侧上的导电焊盘阵列（12）基本上对齐， 载体（2）; 加热引脚模具中的引线/锡焊料，使得焊料变得熔化并与芯片载体的导电焊盘的阵列聚结，由此形成结合到芯片载体的导电焊盘阵列的微型引脚（4）的阵列 ; 将电路组件连接到芯片载体的另一侧; 并且将一个共晶的铅/锡焊膏回流到电路板的相应的导电焊盘阵列上，以将载体的微型引脚阵列的自由端结合到相应的导电焊盘阵列上，从而形成焊料柱连接 芯片载体和电路板。 该工艺适用于批量生产芯片载体和支撑电路板之间可靠的高密度电连接。

公开(公告)号：EP2891390A4

公开(公告)日：2016-05-25

申请号：EP13832479

申请日：2013-08-10

Applicant: INCO INNOVATION

Inventor： BERGLUND JAN

IPC: H05K1/02 ,  H01B5/02 ,  H02G5/00

CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K2201/0379 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power chain consisting of a chain comprising links that are electrically conductive elements mounted on a circuit board in at least two layers and in such a way that the elements included in the power chain are assembled shifted and overlapping and in electrical contact with each other.

公开(公告)号：EP0994508B1

公开(公告)日：2015-08-05

申请号：EP99307990.4

申请日：1999-10-11

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Murayama, Kei, Shinko Electric Industries Co Ltd

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/10992 ,  H05K2203/043 ,  Y02P70/613 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/05599