公开(公告)号：EP0647389A1

公开(公告)日：1995-04-12

申请号：EP94913381.0

申请日：1994-04-07

Applicant: ZYCON CORPORATION

Inventor： HOWARD, James, R. ,  LUCAS, Gregory, L. ,  BRYAN, Scott, K. ,  CHOE, Jin, S. ,  BIUNNO, Nicholas

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/167 ,  H05K1/0298 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09809 ,  H05K2203/0545

Abstract: A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a through-hole or via (50, 52) and a surrounding conductive layer (24) in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors (36A), inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.

公开(公告)号：EP0379404A2

公开(公告)日：1990-07-25

申请号：EP90400092.4

申请日：1990-01-12

Applicant: TDK Corporation

Inventor： Takaya, Minoru ,  Mochizuki, Yoshinori

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/64 ,  H05K1/16

CPC classification number: H05K1/165 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49589 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/30105 ,  H03H3/00 ,  H03H7/06 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/141 ,  H05K1/142 ,  H05K1/162 ,  H05K1/167 ,  H05K3/403 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/086 ,  H05K2201/09309 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A multilayer hybrid circuit, which looks like a conventional printed circuit board, has a laminated body (1) having at least one of a plurality of dielectric layers (17, 18) magnetic layers, and conductive patterns (19), composing a capacitor, an inductor, and a resistor, and mounts a semiconductor chip. An external connection is effected by side terminals (11) positioned on side walls of the laminated body. In one embodiment, said laminated body and said semiconductor chip is molded together by plastics (4) so that it looks as if a conventional semiconductor chip. In another embodiment, a resilient relay board is coupled with the laminated body when mounted on a mother board so that stress on the mother board is not applied directly to the laminated body.

Abstract translation: 看起来像传统印刷电路板的多层混合电路具有层叠体（1），其具有多个电介质层（17,18）磁性层中的至少一个以及构成电容器的导电图案（19） 电感器和电阻器，并且安装半导体芯片。 外部连接由位于层叠体的侧壁上的侧端子（11）进行。 在一个实施例中，所述层叠体和所述半导体芯片由塑料（4）模制在一起，使得它看起来像传统的半导体芯片。 在另一个实施例中，当安装在母板上时，弹性中继板与层叠体联接，使得母板上的应力不直接施加到层压体。

公开(公告)号：EP0187771B1

公开(公告)日：1988-10-05

申请号：EP85902961.3

申请日：1985-06-11

Applicant: ROBERT BOSCH GMBH

Inventor： PFIZENMAIER, Heinz ,  SCHMIDT, Ewald

IPC: H01F17/00 ,  H03H7/09

CPC classification number: H03H7/09 ,  H01F17/00 ,  H01F17/0006 ,  H01F17/04 ,  H05K1/0237 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09672

Abstract: The high frequency transformer proposed in the printed circuit field is provided with inductances and capacities. The inductances consist of a coil arrangement (9, 17; 10, 18) presenting a ferrite core (5) which is closed and made in the form of conducting tracks on an insulating support (1). The capacities are comprised of a conductor coating (28), the coil arrangement (9, 17; 10, 18) being capacitively coupled to the conductor coating (29) by a dielectric (27).

公开(公告)号：EP0177675A2

公开(公告)日：1986-04-16

申请号：EP85107937.6

申请日：1985-06-26

Applicant: ROBERT BOSCH GMBH

Inventor： Pfizenmaier, Heinz, Dipl.-Ing. ,  Schmidt, Ewald, Ing. grad.

IPC: H03H7/48

CPC classification number: H03H7/482 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063

Abstract: Es wird eine HF-Breitbandübertragerschaltung vorgeschlagen, die gute elektrische Eigenschaften im Fernsehfrequenzbereich und im LMKU-Frequenzbereich aufweist. Die Schaltung geht von einem Breitbandübertrager mit Doppellochkern (K) aus, der vier Wicklungen (W1...W4) trägt. Wesentlich für die Erfindung ist, daß der zweite Ausgang (S) der Übertragerschaltung über die erste Wicklung (W1) und einen dazu in Reihe liegenden zweiten Widerstand (R2) und der Eingang (E) über die vierte Wicklung (W4) und einen dazu in Reihe liegenden dritten Widerstand (R3) mit dem Massepotential verbunden ist.

Abstract translation: 提出了一种RF宽带变压器电路，其在电视频率范围和LMKU频率范围内具有良好的电气特性。 该电路基于带双孔磁芯（K）的宽带变压器，该变压器带有四个绕组（W1 ... W4）。 对于本发明来说，重要的是变压器电路的第二输出（S）经由第一绕组（W1）和第二电阻串联（R2）并且输入（E）经由第四绕组（W4）和其中的输入 行躺在第三电阻器（R3）连接到地电位。

公开(公告)号：EP0146585A1

公开(公告)日：1985-07-03

申请号：EP84902195.0

申请日：1984-05-26

Applicant: ROBERT BOSCH GMBH

Inventor： BAUM, Helmut ,  PFIZENMAIER, Heinz ,  SCHMIDT, Ewald ,  STRAUSS, Franz

IPC: H01F17 ,  H01F19 ,  H01F27 ,  H05K1

CPC classification number: H05K1/165 ,  H01F17/0006 ,  H01F27/2804 ,  H05K2201/0133 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: Elément inductif, en particulier un transformateur possèdant au moins une bobine (2, 3 resp. 37, 38 resp. 55) placée sur un support isolant (1 resp. 30 resp. 50) sous forme de pistes conductives imprimées (10 à 13 resp. 31 à 36 resp. 51 à 54), ainsi qu'un tore de ferrite fermé (6 resp. 41 resp. 56). Le support isolant (1 resp. 30 resp. 50) est formé d'un matériau élastique qui revient élastiquement après déformation automatiquement dans son plan. Dans le support isolant (1 resp. 30 resp. 50) sont prévus des évidements (4, 5 resp. 39, 40 resp. 58) pour recevoir le tore de ferrite (6 resp. 41 resp. 56) ainsi que des fentes d'introduction (7, 8 resp. 42, 43 resp. 57) débouchant dans ceux-ci pour le tore (6 resp. 41 resp. 56). Le pont (15 resp. 48 resp. 60) traversant le tore de ferrite (6 resp. 41 resp. 56) et le segment (16 resp. 45 resp. 61) du support isolant (1 resp. 30 resp. 50) qui est délimité par deux fentes voisines (7, 8 resp. 42, 43) forment une langue élastique (17 resp. 46 resp. 59) qui peut être soulevée du plan du support isolant (1 resp. 30 resp. 50) pour l'introduction du tore (6 resp. 41 resp. 56) dans les évidements (4, 5 resp. 39, 40 resp. 58) et qui reprend sa place dans le plan après avoir été lâchée, sous l'action de sa propre élasticité, le pont de langue (15 resp. 48 resp. 60) centrant et maintenant de manière imperdable le tore de ferrite (6 resp. 41 resp. 56) dans les évidements (4, 5 resp. 39, 40 resp. 58).

公开(公告)号：EP3351060A1

公开(公告)日：2018-07-25

申请号：EP16778935.3

申请日：2016-09-16

Applicant: The Esab Group, Inc.

Inventor： GHARIB, Awad ,  ANJANAPPA, Muniswamappa ,  SANGHAVI, Pranav

IPC: H05K1/02 ,  B23K9/10 ,  H05K1/14 ,  H05K7/14

CPC classification number: H02M7/003 ,  B23K9/013 ,  B23K9/1043 ,  B23K9/16 ,  B23K9/32 ,  H02M1/42 ,  H05K1/0263 ,  H05K1/14 ,  H05K1/181 ,  H05K3/303 ,  H05K7/1427 ,  H05K7/1432 ,  H05K2201/086 ,  H05K2201/1003

Abstract: A power supply to provide welding power. The power supply may include a first printed circuit board (PCB) disposed on a primary side of the power supply; a first set of components mounted on the first PCB; a second PCB disposed on a secondary side of the power supply; a second set of components mounted on the second PCB; a transformer stage coupled to the first PCB and to the second PCB, wherein the first PCB and the second PCB are independently detachable from the power supply.

公开(公告)号：EP2618442A3

公开(公告)日：2018-01-17

申请号：EP12162716.0

申请日：2012-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youn, Jae-sub

IPC: H02H9/00 ,  H02H9/04 ,  H02H9/02 ,  H05K1/02

CPC classification number: H05K9/0067 ,  H02H9/00 ,  H02H9/005 ,  H02H9/026 ,  H02H9/041 ,  H02H9/046 ,  H05K1/0259 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10265

Abstract: An electronic device (100) includes an exterior portion (110) of a conductive material, a circuit portion (120) including circuit elements, and a protection circuit portion (130) connected between the exterior portion and the circuit portion. The protection circuit portion (130) includes a switching unit (132) to intercept leakage current that flows from the circuit portion and leaks to the exterior portion, and a conversion unit (131) to reduce a voltage level of an electrostatic component that flows through the exterior portion and to transfer the electrostatic component to the switching unit.

Abstract translation: 一种电子装置（100），包括导电材料的外部部分（110），包括电路元件的电路部分（120）以及连接在外部部分和电路部分之间的保护电路部分（130）。 保护电路部（130）包括：切换单元（132），用于拦截从电路部分流出并泄漏到外部的泄漏电流;以及转换单元（131），用于降低流过的静电元件的电压电平 外部部分并且将静电部件转移到切换单元。

公开(公告)号：EP2670035A4

公开(公告)日：2017-12-20

申请号：EP11856797

申请日：2011-08-31

Applicant: MURATA MANUFACTURING CO

Inventor： HIEI TOMOYOSHI

IPC: H02M3/155

CPC classification number: H05K1/0233 ,  H01F37/005 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/15313 ,  H01L2924/19105 ,  H02M1/44 ,  H02M3/04 ,  H02M3/158 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/10015 ,  Y10T307/74

Abstract: Provided is a DC-DC converter module having good noise characteristics. A DC-DC converter module (1) includes a multi-layer substrate (5), a switching IC (2), and a coil (4). The multi-layer substrate (5) includes component mounting electrodes provided on the top surface and an input terminal, an output terminal, and ground terminals (GND1, GND2) provided on the bottom surface. The switching IC (2) switches an input voltage and includes an input electrode, an output electrode, and a ground electrode, and is mounted on the top surface of the substrate by connecting the electrodes to the component mounting electrodes. The coil (4) is formed within the multi-layer substrate (5) in a spiral shape with an axis in the substrate stacking direction. The bottom surface side end of the coil (4) is connected to the input/output electrode of the switching IC (2).

公开(公告)号：EP2277179B1

公开(公告)日：2017-11-29

申请号：EP09749972.7

申请日：2009-03-05

Applicant: Nokia Technologies Oy

Inventor： SEPPÄLÄ, Eira ,  HEINO, Markku ,  OKSANEN, Markku ,  LEHTINIEMI, Reijo ,  IKONEN, Pekka ,  POHJAKALLIO, Maija ,  JOHANS, Christoffer ,  RAS, Robin ,  TIMONEN, Jaakko

IPC: H01F1/28 ,  H01F1/44 ,  H05K1/02 ,  H05K3/30 ,  C08J3/24 ,  C08K3/08 ,  C08K3/22 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/552 ,  H01L23/64 ,  B05D3/06 ,  H01Q9/04

CPC classification number: H01F1/44 ,  B05D3/06 ,  C08J3/24 ,  C08K3/08 ,  C08K3/22 ,  H01F1/28 ,  H01L21/563 ,  H01L23/295 ,  H01L23/552 ,  H01L23/645 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/83222 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q9/0407 ,  H01Q9/0421 ,  H05K1/0233 ,  H05K3/305 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2203/101 ,  H05K2203/104 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/249986 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31938 ,  Y10T428/32 ,  H01L2924/00

Abstract: A material contains a curable liquid polymer containing suspended nanoparticles capable of exhibiting a magnetic property. The nanoparticles are present in a concentration sufficient to cause the curable liquid polymer to flow in response to application of a magnetic field, enabling the material to be guided into narrow regions to completely fill such regions prior to the polymer being cured. A method includes applying a filler material to at least one component, the filler material including a heat curable polymer containing nanoparticles, and applying an electromagnetic field to at least part of the filler material. The nanoparticles contain a core capable of experiencing localized heating sufficient to at least partially cure surrounding polymer. Also disclosed is an assembly for use at radio frequencies. The assembly includes a substrate and at least one component supported by the substrate. The substrate contains a thermoplastic or thermoset polymer with suspended nanoparticles capable of exhibiting a magnetic property. The nanoparticles are of a type and have a concentration in the polymer selected to provide a certain dielectric permittivity, magnetic permeability and dissipation factor.

公开(公告)号：EP3142132A1

公开(公告)日：2017-03-15

申请号：EP16188092.7

申请日：2016-09-09

Applicant: Leopold Kostal GmbH & Co. KG

Inventor： Neumann, Carsten

IPC: H01F27/26 ,  H05K1/00

CPC classification number: H01F27/263 ,  H01F2027/065 ,  H05K1/165 ,  H05K2201/086

Abstract: Beschrieben wird eine Planarinduktivität, mit mindestens einer Spule, die auf einem ebenen Schaltungsträger angeordnet ist, und mit einem Spulenkern, bestehend aus einem ersten Kernelement, dessen Schenkel durch Ausnehmungen des Schaltungsträgers hindurchgeführt und dessen Schenkelstirnflächen durch ein zweites Kernelement abgedeckt sind, wobei das erste Kernelement und das zweite Kernelement durch ein Federelement aneinander gefügt sind, wobei auf das zweite Kernelement ein Führungsrahmen mit angeformten Führungselementen aufgesetzt ist, wobei Führungselemente mindestens an zwei nichtparallelen Seitenflächen des zweiten Kernelements anliegen, und sich über die Seitenflächen hinaus senkrecht in Richtung auf das erste Kernelement erstrecken, und wobei ein extern abgestütztes Federelement den Führungsrahmen gegen den Spulenkern und den Spulenkern gegen eine Grundfläche presst.

Abstract translation: 公开了一种平面电感线圈，具有至少一个线圈，该线圈设置在平面电路基板上，并且具有由第一芯构件通过在电路载体的凹部和其腿端面导引其腿通过第二芯构件，其中，所述第一芯构件被覆盖的线圈芯 和第二芯构件通过弹簧元件彼此连接，被安放的第二芯构件上，具有形成为一体的导向元件的导向框架，所述导向元件支承在第二芯构件中的至少两个非平行的侧表面，并垂直于所述第一芯元件也延伸过侧面的方向 并且其中外部abgestütztes弹簧构件压靠在线圈芯和抵靠基面线圈芯引导框架。