公开(公告)号：EP1060646B1

公开(公告)日：2007-05-09

申请号：EP99909448.5

申请日：1999-03-05

Applicant: Obducat AB

Inventor： WIKSTRÖM, Bo

IPC: H05K1/16

CPC classification number: H05K1/167 ,  H01C17/006 ,  H01C17/2416 ,  H05K3/06 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2203/105

Abstract: A method for manufacturing a resistor function in an electric conductor on the surface of a carrier, preferably a conductor on printed circuit boards, substrates and chips. By etching using an anisotropic etching technique, the conductor is provided with at least one portion which has a smaller cross-sectional area than the conductor surrounding the portion, the length and width of the portion being such that a predetermined resistance is obtained in the conductor. A resistor according to the invention is on both sides connected to a conductor on a carrier, such as a printed circuit board, a substrate or a chip. The resistor comprises a conductor portion positioned on the carrier and having a significantly smaller cross-sectional area than the conductor on both sides of the resistor.

公开(公告)号：EP1747835A1

公开(公告)日：2007-01-31

申请号：EP05106921.9

申请日：2005-07-27

Applicant: Leica Geosystems AG

Inventor： Stauffer, Laurent ,  Kipfer, Peter, Dr. ,  Bernhard, Heinz

IPC: B23K1/005 ,  G02B7/00

CPC classification number: G02B7/02 ,  B23K1/0056 ,  G02B7/00 ,  H05K3/202 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2203/0195 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/31

Abstract: Die Erfindung betrifft ein Verfahren zur hochpräzisen Befestigung eines miniaturisierten Bauteils (1), insbesondere mit einem mikrooptischen Element (2), auf einem vorgegebenen Befestigungsabschnitt (3) einer Trägerplatte (4) durch eine Lötverbindung. Die Trägerplatte ist durchgängig aus einem metallischen Werkstoff ausgebildet und weist einen den Befestigungsabschnitt (3) umschliessenden, von mindestens einem Verbindungssteg (9) der Trägerplatte (4) überbrückten Aussparungsbereich (10) auf, der den Wärmeübergang vom Befestigungsabschnitt (3) auf die restliche Trägerplatte gering hält und laterale Wärmeausdehnungen des Befestigungsabschnitts (3) ausgleicht. Lötmaterial (8) ist auf der Oberseite des Befestigungsabschnitts (3) aufgebracht. Das Verfahren umfasst insbesondere die Schritte: Anordnen des Bauteils (1) oberhalb des Befestigungsabschnitts (3), wobei sich das Lötmaterial (8) und die Basis (7) des Bauteils (1) in berührungsfreier, einen Zwischenraum bildenden Gegenüberlage befinden. Zuführen elektromagnetischer Strahlung (12) auf die Unterseite (6) des Befestigungsabschnitts (3) zum Schmelzen des Lötmaterials (8'), so dass sich durch Tropfenbildung und gegebenenfalls durch Absenken des Bauteils (1) der Zwischenraum zur gegenseitigen Befestigung mit geschmolzenem Lötmaterial (8') füllt. Warten auf die gegenseitige Befestigung durch Wiedererstarren des geschmolzenen Lötmaterials (8').

Abstract translation: 上固定的微小型化的组件的支撑板的高精密方法（4），所有这些是尤其是在金属化陶瓷材料的合金制成的金属材料的爱基因反弹和包围固定部（3）由至少一个固定件 幅材（9）的凹进区域跨过所述载体板（4）包括将固定部（3）检测并焊接材料（8）和所述基部（7）该部件的都高于组分的高精度排列 位于不接触，并且在反覆盖间隔开。

公开(公告)号：EP1698033A2

公开(公告)日：2006-09-06

申请号：EP04817915.4

申请日：2004-12-22

Applicant: X2Y Attenuators, L.L.C.

Inventor： ANTHONY, David ,  ANTHONY, Anthony ,  ANTHONY, William, M. ,  MUCCIOLI, James ,  NEIFELD, Richard, A.

IPC: H02H9/00

CPC classification number: H01G4/35 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/203 ,  H05K1/0233 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1006 ,  H05K2201/10454 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An energy conditioner structure comprising a first electrode (120), a second electrode (80), and a shield structure (70, 110, 150) provides improved energy conditioning in electrical circuits. The structures may exist as discrete components or part of an integrated circuit. The shield structure in the energy conditioner structure does not electrically connect to any circuit element.

公开(公告)号：EP1667502A2

公开(公告)日：2006-06-07

申请号：EP06003856.9

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： The designation of the inventor has not yet been filed

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/24

CPC classification number: H05K3/28 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: A manufacturing method of a printed wiring board, wherein a conductor circuit is formed on the surface of an insulating substrate. A solder resist made of thermosetting resin is next printed on the surface of said insulating substrate. An insulating film having a coefficient of thermal expansion equal to or smaller than 100 ppm/°C is next formed by thermally curing the solder resist. The conductor circuit is next exposed by irradiating a laser beam to an opening portion forming portion in the insulating film and burning-out the insulating film of said opening portion forming portion and forming an opening portion.

公开(公告)号：EP1559296B1

公开(公告)日：2006-04-12

申请号：EP03778393.3

申请日：2003-10-15

Applicant: SAINT-GOBAIN GLASS FRANCE

Inventor： CRUMBACH, Richard ,  REUL, Bernhard ,  SZNERSKI, Andreas

IPC: H05B3/86 ,  H01Q1/32 ,  C03C17/36 ,  B32B17/06

CPC classification number: B32B17/10036 ,  B23K1/0008 ,  B32B17/10174 ,  B32B17/10761 ,  H01R4/02 ,  H01R2201/26 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/363 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0969

Abstract: The invention concerns a transparent window (1.1), in particular a glass window, having at least one electrically conductive non-transparent contact surface (3), provided on one of its surfaces, for its being bonded by soldering to a connection piece (4). The invention is characterized in that in the region of the soldering site, the contact surface is provided with at least one cutout (3A) whereby the soldering input metal (5) is visible through the window (1) after the connection piece (4) has been soldered at the contact surface (3). Such a configuration enables reliable visual verification of the soldering sites, even when the soldering site is incorporated inside a composite glazing and has been soldered, as the case may be by input of induction heat.

公开(公告)号：EP1599076A1

公开(公告)日：2005-11-23

申请号：EP05010862.0

申请日：2005-05-19

Applicant: NITTO DENKO CORPORATION

Inventor： Kakamura, Kei ,  Ishizaka, Hitoshi ,  Yoshida, Atsushi ,  Hikita, Takami

IPC: H05K1/05 ,  H05K1/02 ,  H05K3/30 ,  H01L23/498

CPC classification number: H05K1/056 ,  H01L23/49572 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/382 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A wired circuit board on which a highly reliable conductor pattern is formed, to allow an electronic component to be mounted on it with improved accuracy. An insulating layer 3 is formed on a metal supporting layer 2 having a degree of surface brilliancy of 150-500% in such a manner as to have a haze value of 20-50% and also a conductor pattern 4 is formed on the insulating layer 3, thereby producing a TAB tape carrier 1. In this TAB tape carrier 1, since the metal supporting layer 2 has a specified degree of surface brilliancy of 500% or less, the pattern design of the conductor pattern 4 is optically examined to determine whether it is good or bad with high accuracy. Also, since the metal supporting layer 2 has a specified degree of surface brilliancy of 150% or more and the insulating layer 3 has a specified haze value ranging from 20% to 50%, the light for the alignment of an electronic component 21 can be allowed to smoothly pass through the insulating layer 3, and as such can allow the electronic component 21 to be mounted with high accuracy.

Abstract translation: 其上形成有高度可靠的导体图案的布线电路板允许以更高的精度安装电子部件。 在具有150-500％表面辉度的金属支撑层2上形成绝缘层3，使得雾度值为20-50％，并且还在绝缘层上形成导体图案4 从而产生TAB带载体1.在该TAB带载体1中，由于金属支撑层2具有500％或更小的特定程度的表面辉度，光学检查导体图案4的图案设计以确定是否 它具有高精度的好坏。 另外，由于金属支承层2具有规定的150％以上的表面辉度，绝缘层3具有规定的20％〜50％的雾度值，因此能够使电子部件21的定位用光 允许顺利地穿过绝缘层3，并且因此可以允许高精度地安装电子部件21。

公开(公告)号：EP1596369A1

公开(公告)日：2005-11-16

申请号：EP05008760.0

申请日：2005-04-21

Applicant: NITTO DENKO CORPORATION

Inventor： Funada, Yasuhito ,  Ohsawa, Tetsuya

IPC: G11B5/48 ,  H05K1/02

CPC classification number: H05K1/028 ,  G11B5/484 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0969 ,  H05K2201/0989

Abstract: A suspension board with circuit that can allow precise adjustment of floatation (floatation angle) of even a small-sized slider to a magnetic disc even when the outrigger portions are reduced in rigidity. A gimbal portion 6 of the suspension board with circuit 1 is formed by a tongue portion 10 for mounting a magnetic head thereon, and outrigger portions 11 provided at both sides of the tongue portion 10, and an opening 12 is formed in the insulating cover layer 5 so that the conductor layer 4 can be exposed therefrom in the outrigger portions 11. This can allow reduction in rigidity of the outrigger portions 11, and as such can allow precise adjustment of floatation (floatation angle) of the slider to the magnetic disc even when a small-sized slider is mounted on the gimbal portion.

Abstract translation: 具有电路的悬挂板，即使当外伸支架部分的刚性降低时，也能够将即使小尺寸的滑块的浮动（浮动角）精确地调整到磁盘。 具有电路1的悬架板的万向节6由用于在其上安装磁头的舌部10和设置在舌部10的两侧的外伸支架部分11形成，并且开口12形成在绝缘覆盖层 5，使得导体层4可以在外伸支架部分11中暴露出来。这可以允许外伸支架部分11的刚度降低，并且因此可以允许精确地调节滑块对磁盘的浮动（浮动角），甚至 当小型滑块安装在万向节部分上时。

公开(公告)号：EP1536673A1

公开(公告)日：2005-06-01

申请号：EP03733093.3

申请日：2003-05-27

Applicant: Taiyo Yuden Co., Ltd.

Inventor： MIYAZAKI, Masashi ,  TAKAYAMA, Mitsuhiro 217-18-103, Nishiakiya ,  SAWATARI, Tatsuro Mezon-Lumiere B202, 170-1

IPC: H05K3/46 ,  H05K1/18 ,  H05K3/28 ,  H01L23/12 ,  H01L25/04

CPC classification number: H05K1/185 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/021 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0969 ,  H05K2201/09745 ,  H01L2924/00

Abstract: A composite multi-layer substrate (20) comprising a flat plate-like core member (21) formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer (22) and a rear resin layer (23) covering at least the front and rear surfaces of the core member (21), and a bottomless hole (24) formed in the core member (21) through the front and rear sides of the core member (21), wherein an electronic component (25) is installed in the bottomless hole (24), whereby since the strength of the composite multi-layer substrate (20) can be assured by the rigidity of the core member (21), conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

公开(公告)号：EP0805614B1

公开(公告)日：2005-04-13

申请号：EP96938496.5

申请日：1996-11-18

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： SASAOKA, Kenji ,  ODAIRA, Hiroshi ,  FUJIWARA, Madoka ,  IKEGAYA, Fumitoshi ,  MORI, Takahiro

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01L23/48

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/17 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/095 ,  H05K1/116 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K2201/09863 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A multilayered wiring board using conductive pillars for the interconnection of wiring layers. Since through holes are bored in the via lands of the wiring layers of the multilayered wiring board, the stress applied between the conductive pillars and wiring layers can be released at the time of connecting the conductive pillars to the via lands. Since the external side face of each conductive pillar smoothly continues to the surface of the via land at the contact section between the conductive pillar and the via land, the notch effect is relieved. Therefore, the reliability of the interconnection is secured even when a stress is applied to the connections during the manufacturing of the multilayered wiring board, and the mounting of electronic parts, etc.

公开(公告)号：EP1214741B1

公开(公告)日：2005-02-02

申请号：EP00963990.7

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： MAURER, Thomas ,  HAUPT, Detlef

IPC: H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: The control device (1) is equipped with an electrical component (2) in which heat is generated. Said heat is dissipated over an elongated metal part (10) whose one face (12) is soldered to the component (2). The face (12) oriented toward the component (2) has a shape that increases the size of its surface. The shape is outwardly arched and can be provided with a ribbing.