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    PROCESS FOR MANUFACTURING HEAT SINK STRUCTURE FOR HIGH-POWER LED
    61.
    发明公开
    PROCESS FOR MANUFACTURING HEAT SINK STRUCTURE FOR HIGH-POWER LED 审中-公开
    VERFAHREN ZUR HERSTELLUNG EINERKÜHLKÖRPERSTRUKTURFÜRHOCHLEISTUNGS-LED

    公开(公告)号：EP2642532A1

    公开(公告)日：2013-09-25

    申请号：EP12848326.0

    申请日：2012-08-30

    申请人： Dongguan Kingsun Optoelectronic Co., Ltd

    发明人： BI, Xiaofeng

    IPC分类号： H01L33/00 ,  H01L33/64

    CPC分类号： B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

    摘要： A manufacturing process of a high-power LED radiating structure includes steps of: (1) preparing parts or material such as a PCB board (4), a heat conducting plate (6) and a heat dissipating plate (9); (2) providing a first locating hole and a first fixing hole passing through the PCB board, welding a copper plate layer on one side of the PCB board, and welding an electrode weld pad on the other side of the PCB board, and then applying soldering paste on the surface of the copper plate layer; (3) providing a second locating hole and a second fixing hole passing through the heat conducting plate; (4) inserting a fixing pole into the first and second fixing holes to fixedly connect the PCB board and the heat conducting plate together; (5) inserting the heat conducting pole into the first and second locating holes; (6) proving the heat conducting plate and the PCB board resulted from step (5) on a stamping equipment, and adjusting the length of the protruding end of the heat conducting pole. The inventive process is simple, and the manufactured dissipating structure is advantageous for a simple construction and good heat conducting and dissipating effects.

    摘要翻译： 大功率LED辐射结构的制造工艺包括以下步骤：（1）制备诸如PCB板（4），导热板（6）和散热板（9）的部件或材料; （2）提供穿过PCB板的第一定位孔和第一固定孔，在PCB板的一侧焊接铜板层，并在PCB板的另一侧焊接电极焊盘，然后施加 铜板表面焊膏; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）将固定杆插入第一和第二固定孔中以将PCB板和导热板固定在一起; （5）将导热柱插入第一和第二定位孔; （6）在冲压设备上证明由步骤（5）导出的导热板和PCB板，并调整导热柱的突出端的长度。 本发明方法简单，制造的散热结构对于简单的结构和良好的导热和散热效果是有利的。

    THERMAL PAD AND METHOD OF FORMING THE SAME
    64.
    发明公开
    THERMAL PAD AND METHOD OF FORMING THE SAME 有权
    WÄRMEKISSENUND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2399289A1

    公开(公告)日：2011-12-28

    申请号：EP09840205.0

    申请日：2009-02-20

    申请人： Telefonaktiebolaget L M Ericsson (PUBL)

    发明人： ZHANG, Guangjun ,  XIE, Yuanchun

    IPC分类号： H01L23/498

    CPC分类号： H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/0959 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A thermal pad (602,612,622,702,712) formed on a Printed Circuit Board and a method (900) of formed the thermal pad (602,612,622,702,712) are provided. The thermal pad (602,612,622,702,712) comprises in its interior one or more coins (604,614,624,704,714) has a height equal to a thickness of the PCB, and is made of metal or alloy, inserted into a corresponding one of one or more plated cutouts straight through the PCB in the thermal pad, and bonded to side walls of the corresponding one of the one or more plated cutouts with a paste capable of resisting a temperature of 250° C or above. The plurality of through via (606,616,626,706,716) are plated, and lugged with a solder mask. The thermal pad (602,612,622,702,712) has a flat top surface and a flat bottom surface, either of which is coplanar with a corresponding one of top and bottom surfaces of the PCB. A PCB having formed thereon the above thermal pad (602,612,622,702,712) is also provided.

    摘要翻译： 形成在印刷电路板上的散热垫（602,612,622,702,712）和形成热垫（602,612,622,702,712）的方法（900）。 散热垫（602,612,622,702,712）在其内部包括一个或多个硬币（604,614,624,704,714）的高度等于PCB的厚度，并且由金属或 合金，通过热垫中的PCB直接插入到一个或多个电镀切口中相应的一个电镀切口中，并且用能够耐受250℃的温度的粘合剂粘合到一个或多个电镀切口中相应的一个的侧壁 或以上。 多个通孔（606,616,626,706,716）被电镀，并且用焊接掩模凸出。 热垫（602,612,622,702,712）具有平坦的顶表面和平坦的底表面，其中任一个与PCB的顶表面和底表面中的相应一个共面。 还提供了其上形成有上述散热垫（602,612,622,702,712）的PCB。

    Light emitting diode
    67.
    发明公开
    Light emitting diode 审中-公开
    发光二极管

    公开(公告)号：EP2306531A2

    公开(公告)日：2011-04-06

    申请号：EP10161031.9

    申请日：2010-04-26

    申请人： Everlight Electronics Co., Ltd.

    发明人： Hsieh, Chung-Chuan

    IPC分类号： H01L33/48 ,  H01L33/60 ,  H01L33/64

    CPC分类号： H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/2054 ,  H01L2924/00014

    摘要： A light emitting diode is provided, including an LED chip, a reflector, a lens, a circuit plate, a circuit substrate and an electrical conductivity device. The LED chip is disposed in the reflector and the lens is disposed on the reflector, covering the reflector and the LED chip. The LED chip is electrically connected to the circuit plate. The circuit plate further includes a first through hole therein and the circuit substrate further includes a second through hole therein. The electrical conductivity device passes through the first through hole and the second through hole so that the circuit plate is electrically connect to the circuit substrate. The reflector is installed between the circuit plate and the circuit substrate. The first through hole and the second through hole are not connected to the reflector.

    摘要翻译： 提供了一种发光二极管，包括LED芯片，反射器，透镜，电路板，电路基板和导电装置。 LED芯片设置在反射器中，透镜设置在反射器上，覆盖反射器和LED芯片。 LED芯片电连接到电路板。 电路板还包括第一通孔，电路基板还包括第二通孔。 导电装置穿过第一通孔和第二通孔，使得电路板电连接到电路基板。 反射器安装在电路板和电路基板之间。 第一通孔和第二通孔未连接到反射器。