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    ELECTRONIC APPARATUS WITH A WIRING TERMINAL
    71.
    发明公开
    ELECTRONIC APPARATUS WITH A WIRING TERMINAL 审中-公开
    与导线连接电子设备

    公开(公告)号：EP1651997A1

    公开(公告)日：2006-05-03

    申请号：EP04744640.6

    申请日：2004-07-26

    Applicant: Koninklijke Philips Electronics N.V.

    Inventor： Matsuura, Noriyoshi, c/o Philips Japan, Ltd.

    IPC: G02F1/13 ,  G02F1/1362 ,  H05K3/36

    CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  G02F1/1362 ,  H05K1/111 ,  H05K1/117 ,  H05K3/244 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/09745 ,  H05K2201/099 ,  Y02P70/611

    Abstract: An object of the invention is to provide a terminal structure which can reduce a connection resistance and prevent corrosion and to provide an electronic apparatus based on the terminal structure. An electronic apparatus comprising a transparent conductive layer (10) supported by a substrate (8) and a metal layer (20) of a material having a resistivity lower than that of the transparent conductive layer (10), the metal layer (20) being extended on the transparent conductive layer (10), the transparent conductive layer (10) having an oxidation resistivity higher than that of the metal layer (20) and forming a terminal (10T) for connecting to peripheral circuitry (50). The metal layer (20) extends on an extending portion (10L) of the transparent conductive layer (10) outside the terminal (10T) of the transparent conductive layer (10), and/or on the periphery of or in the vicinity of a coupling area (11) for making the transparent conductive layer (10) to be exposed to the exterior within an area of the terminal (10T) of the transparent conductive layer (10). There is provided an electrically insulating layer (30) which covers at least a part of the terminal (10T) of the transparent conductive layer (10) and the whole of the metal layer (20) and which extends on the area other than the coupling area (11) within the area of the terminal (10T) of the transparent conductive layer (10).

    Bonding pads of printed circuit board capable of holding solder balls securely
    73.
    发明公开
    Bonding pads of printed circuit board capable of holding solder balls securely 审中-公开
    适合于焊料球的安全保持的印刷电路板的接触面

    公开(公告)号：EP1387604A1

    公开(公告)日：2004-02-04

    申请号：EP02255351.5

    申请日：2002-07-31

    Applicant: United Test Center Inc.

    Inventor： Tsai, Chung-Che ,  Shan, Wei-Heng

    IPC: H05K3/34 ,  H01L23/498

    CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/244 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/099 ,  H05K2203/0594 ,  H01L2924/00

    Abstract: The present invention is to provide a printed circuit board, which comprises a substrate (10), a conductive pattern disposed on a surface of said substrate (10) and a solder mask (30) coated on the surface of said substrate (10) and covered over the conductive pattern. The conductive pattern has a bonding pad (20). The solder mask (30) has an opening (31) corresponding in location to the bonding pad (20) such that a portion of the bonding pad (20) is exposed outside. A space (24) is left between said solder mask (30) and said bonding pad (20) and is communicated with the opening (31). Whereby, a solder ball (50) can be received in the opening (31) and the space (24) and electrically connected to the bonding pad (20), such that the solder ball (50) is held on the printed circuit board securely.

    Abstract translation: 本发明是提供一种印刷电路板，它包括基片（10）;设置的所说基片（10）的表面上的导体图案和涂覆所说基片（10）的表面上的焊接掩模（30）和 覆盖在导电图案。 所述导电图案具有接合焊盘（20）。 焊接掩模（30）具有在开口（31）中的位置对应于所述接合焊盘（20）检测所做的焊盘（20）的一部分被暴露于外部。 的空间（24）是所述焊料掩模（30）和所述接合垫（20）之间的左和连通于开口（31）。 由此，焊料球（50）可在开口（31）和所述空间（24）和电连接到所述键合焊盘被接收（20）检测所做的焊球（50）被保持在印刷电路板牢固地 ，

    Method of mounting a leadless package and structure therefor
    74.
    发明公开
    Method of mounting a leadless package and structure therefor 审中-公开
    Verfahren zum Montieren eines drahtlosenGehäusesund Strukturdafür

    公开(公告)号：EP1377144A2

    公开(公告)日：2004-01-02

    申请号：EP03076653.9

    申请日：2003-05-28

    Applicant: Delphi Technologies, Inc.

    Inventor： Delheimer, Charles I.

    IPC: H05K3/34 ,  G06F1/20

    CPC classification number: H01L23/498 ,  H01L23/3677 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0206 ,  H05K3/0094 ,  H05K3/341 ,  H05K3/3452 ,  H05K3/42 ,  H05K2201/099 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/0455 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A method and circuit structure (10) for mounting a leadless IC package (30) to a substrate (12) having a thermal pad (14) on a first surface thereof, a plurality of contact pads (16) surrounding the thermal pad (14), and one or more plated vias (18) in the thermal pad (14). The leadless package (30) is attached to the substrate (12) with solder (36) that thermally connects the package (30) to the thermal pad (14). To prevent solder flow into the plated vias (18) during reflow, a solder mask (20,21,22) is provided on the first surface of the substrate (12), at least a portion (21) of which is deposited on the thermal pad (14) and surrounds the plated vias (18) but does not block the plated vias (18). The solder mask portion (21) defines a barrier between the solder (36) and the plated vias (18), but allows for outgassing through the vias (18) during solder reflow.

    Abstract translation: 一种用于将无铅IC封装（30）安装到其第一表面上具有热垫（14）的衬底（12）的方法和电路结构（10），围绕所述散热垫（14）的多个接触焊盘 ）和一个或多个电镀通孔（18）在散热焊盘（14）中。 无引线封装（30）通过将封装（30）热连接到散热焊盘（14）的焊料（36）附接到基板（12）。 为了防止在回流期间焊料流入镀覆通孔（18）中，在衬底（12）的第一表面上提供焊料掩模（20,21,22），其中至少一部分（21）沉积在衬底 热垫（14）并且围绕镀覆的通孔（18），但不阻挡镀覆的通孔（18）。 焊接掩模部分（21）限定焊料（36）和镀覆通孔（18）之间的阻挡层，但是允许在回流焊时通过通孔（18）而脱气。

    Electronic circuit unit useful for portable telephones or the like, and a method of manufacturing the same
    77.
    发明公开
    Electronic circuit unit useful for portable telephones or the like, and a method of manufacturing the same 有权
    的电子电路单元，其被用于便携式电话或类似物，以及它们的制备方法

    公开(公告)号：EP0996322A3

    公开(公告)日：2002-01-02

    申请号：EP99308015.9

    申请日：1999-10-12

    Applicant: ALPS ELECTRIC CO., LTD.

    Inventor： Harada, Hiroshi ,  Terashima, Kiminori

    IPC: H05K3/34 ,  H05K3/36

    CPC classification number: H05K3/3452 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10984 ,  H05K2203/042 ,  Y02P70/613

    Abstract: The electronic circuit unit (7) of the present invention is provided with the broad width lands (4a) and the thin width lands (4b) tied with the broad width lands (4a), which are configured by a solder resist (5) that is formed on the surface of the circuit board (1). Owing to this configuration, the solders (12) placed on the thin width lands (4b) are drawn toward the broad width lands (4a), which increases the quantity of the solder build-up (6) on the broad width lands (4b), and accompanied with this increase, swells the heights of the solder build-up (6) on the broad width lands (4b). Thus, the electronic circuit unit (7) of the present invention ensures the soldering.

    Abstract translation: 本发明的电子电路部设置有宽幅的土地（4a）和所述薄宽度土地（4b）上的宽幅的土地，其通过焊料配置并列抗蚀剂（5）没有被形成的表面上 所述电路板（1）。 由于该构造，放置在薄宽度土地（4b）的焊料被拉向广阔的宽度的土地（4a）中，这增加了在宽的宽度的土地焊料积聚的量，并与这种增加的陪同下，膨胀 上广阔的宽度土地上的焊料堆积的高度。 因此，本发明的电子电路单元确保焊接。

    METHOD FOR MOUNTING TERMINAL ON CIRCUIT BOARD AND CIRCUIT BOARD
    80.
    发明公开
    METHOD FOR MOUNTING TERMINAL ON CIRCUIT BOARD AND CIRCUIT BOARD 失效
    程序安装连接元件在电路板和电路板与连接元件来提供

    公开(公告)号：EP0907308A1

    公开(公告)日：1999-04-07

    申请号：EP97924262.5

    申请日：1997-05-28

    Applicant: ROHM CO., LTD.

    Inventor： NAKAMURA, Satoshi

    IPC: H05K3/34

    CPC classification number: H05K3/3405 ,  H05K1/111 ,  H05K3/0097 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/403 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0545 ,  Y10T29/49144 ,  Y10T29/49149

    Abstract: The method for installing terminals comprises a coating step for coating solder paste (3) onto a desired circuit board (1), a superimposing step for superimposing the connecting end (4a) of a terminal (4) having a connecting end (4a) and non-connecting end (4b), and a step for heating and melting the solder paste in order that the connecting end (4a) is soldered to the circuit board (1). In the aforementioned coating step, a plurality of mutually separate solder paste coated regions (3a - 3d) are provided on the circuit board (1). In the aforementioned superimposing step, the connecting end (4a) is superimposed such that it extends over the aforementioned plurality of solder paste coated regions (3a - 3d).

    Abstract translation: 对接线端的安装方法，包括用于涂覆焊料膏（3）涂布工序到所期望的电路板（1），用于叠加一个端子的连接端部（4a）的一个重叠工序（4），其具有一个连接端（4a）和 非连接端（4b）中，并用于加热的步骤，并且为了熔化焊料膏那样的连接端（4a）的被焊接到电路板（1）。 在上述的包覆工序中，相互分开的焊膏涂沫部（3A - 3D）的设置有多个在电路板（1）。 在上述叠加步骤中，将连接端（4a）的叠加检查做到了延伸过焊膏涂沫部（3A - 3D）的前述的多个。

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