公开(公告)号：EP1825729A1

公开(公告)日：2007-08-29

申请号：EP04809017.9

申请日：2004-11-30

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： SANDWALL, Johan

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/341 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/09845 ,  H05K2201/10416

Abstract: The invention discloses a printed board assembly, a PBA, (100, 300) comprising a first support layer (130, 350) with a first main surface (101) and a first layer (115, 319’) of a conducting material. The PBA additionally comprises a first electronics component (110, 310) and a first cooling component (190, 390) for transporting heat from the first component to a cooling structure (395) external to the PBA. The first component (110, 310) is surface mounted on the PBA at least partially over the first cooling component (190, 390), and the first cooling component (190, 390) is arranged integrally in the PBA (100, 300), to conduct heat in a direction (D) which is essentially perpendicular to the first main surface (101) of the first support layer (130, 350). The first cooling component (190, 390) is arranged in the PBA (100, 300) by means of soldering.

Abstract translation: 本发明公开了一种印刷板组件，PBA（100,300），其包括具有第一主表面（101）和导电材料的第一层（115,319'）的第一支撑层（130,350）。 PBA还包括用于将热量从第一部件传输到PBA外部的冷却结构（395）的第一电子部件（110,310）和第一冷却部件（190,390）。 第一部件（110,310）在PBA上至少部分地在第一冷却部件（190,390）上方表面安装，并且第一冷却部件（190,390）一体地设置在PBA（100,300）中， 以基本垂直于第一支撑层（130,350）的第一主表面（101）的方向（D）传导热量。 第一冷却部件（190,390）通过焊接设置在PBA（100,300）中。

公开(公告)号：EP1805797A2

公开(公告)日：2007-07-11

申请号：EP05791648.8

申请日：2005-08-23

Applicant: Gelcore LLC

Inventor： PETROSKI, James

IPC: H01L23/34 ,  H01L33/00

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V19/001 ,  F21V19/045 ,  F21V21/096 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  H01L2224/95144 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A light engine ( 16 ) includes at least one LED ( 12 ) for generating light of one of a plurality of wavelengths. The LED ( 12 ) is disposed on the magnetic core printed circuit board ( 14 ). A heatsink ( 26 ) is disposed in thermal communication with a base ( 24 ) and the LED ( 12 ) for conducting thermal energy away from the LED ( 12 ). The light engine ( 16 ) is magnetically attached to the heatsink ( 26 ) via a magnet ( 50 ) which is attached to the heatsink ( 26 ) to create that a magnetic force between the magnetic core board ( 14 ) and the heatsink ( 26 ).

公开(公告)号：EP1622432A3

公开(公告)日：2007-06-20

申请号：EP05014706.5

申请日：2005-07-06

Applicant: Patent -Treuhand-Gesellschaft für elektrische Glühlampen mbH

Inventor： Müller, Patrick ,  Hockel, Jens Florian

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: Es wird eine Leiterplatte angegeben, mit einer thermisch leitende und elektrisch isolierenden Schicht (1) an der Oberseite der Leiterplatte (6) und ein Wärmeleitelement (2), das die Schicht (1) thermisch mit der Unterseite der Leiterplatte (6) verbindet. Ferner wird ein Verfahren zur Herstellung einer solchen Leiterplatte (6) angegeben. Die Leiterpatte (6) zeichnet sich dabei besonders durch ihre guten Wärmeleiteigenschaften aus.

公开(公告)号：EP1197128B1

公开(公告)日：2007-05-23

申请号：EP00946643.4

申请日：2000-06-26

Applicant: Infineon Technologies AG

Inventor： OLOFSSON, Lars-Anders

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/4046 ,  H05K2201/10416

Abstract: The present invention relates to a method of providing thermal vias in a printed circuit board for conducting heat from surface mounted components through said board and away therefrom. One or more holes are formed in a board material that includes a metal layer on a top side and a bottom side thereof, to form said printed circuit board. Metal plugs are pressed into the holes and affixed therein so as to seal against an inner wall of said holes in said metal layers, by causing the plugs to expand radially in said holes. A conductor pattern that includes electrical connection sites is then provided on the board material, such as to obtain said printed circuit board. The invention also relates to a printed circuit board that includes vias arranged in accordance with the aforesaid method.

公开(公告)号：EP1774841A1

公开(公告)日：2007-04-18

申请号：EP05747522.0

申请日：2005-04-23

Applicant: Electrovac AG

Inventor： SCHULZ-HARDER, Jürgen

IPC: H05K3/38 ,  H05K3/02 ,  C04B37/02

CPC classification number: C04B37/021 ,  B32B2311/12 ,  C04B35/645 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/54 ,  H05K1/0306 ,  H05K3/38 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0355 ,  H05K2201/10416 ,  H05K2203/074 ,  H05K2203/1105 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Disclosed is a method for producing a metal-ceramic substrate. According to said method, a metal layer (3, 4) is applied to at least one face of a ceramic substrate or a ceramic layer (2) by means of a direct bonding process, and the metal-ceramic substrate or partial substrate is aftertreated in a subsequent step at a gas pressure (aftertreatment pressure) ranging approximately between 400 and 2000 bar and an aftertreatment temperature ranging approximately between 450 and 1060° C.

公开(公告)号：EP1755023A1

公开(公告)日：2007-02-21

申请号：EP05743287.4

申请日：2005-05-20

Applicant: NISSHA PRINTING CO., LTD.

Inventor： NISHIKAWA, Kazuhiro, c/o NISSHA PRINTING CO., LTD. ,  KAI, Yoshihiro, c/o NISSHA PRINTING CO., LTD. ,  NAKAMURA, Kazuto, c/o NISSHA PRINTING CO., LTD.

IPC: G06F3/033 ,  H01H9/02 ,  H01H13/70

CPC classification number: G06F3/045 ,  H01H13/785 ,  H01H2201/036 ,  H01H2207/00 ,  H05K1/116 ,  H05K3/4046 ,  H05K3/4069 ,  H05K2201/09909 ,  H05K2201/10416

Abstract: There is provided a touch panel capable of obtaining a stable connection resistance without requiring fitting accuracy at the time of the connection to an external terminal, and a protective panel for a display window of an electronic device using the same. The analog type touch panel includes a touch side substrate 2 and a non-touch side substrate 3 each having resistive films 2a, 3a provided on opposed inner surfaces thereof. Through-holes 4a, 4b, 4c, 4d formed at the periphery of the non-touch side substrate 3. A connecting part 5 for electrically connecting electrodes of the resistive films 2a, 3a to an external terminal, in which a conductive paste is injected into the through-holes and a rivet 14 is inserted into each of the through-holes from the lower surface side so that a head of the rivet 14 forms flat connecting electrodes 15a, 15b for connection to the external terminal on the lower surface of the non-touch side substrate 3.

Abstract translation: 提供了一种能够获得稳定的连接电阻而不需要在与外部端子连接时的配合精度的触摸面板，以及使用该触摸面板的电子设备的显示窗口的保护面板。 模拟型触摸面板包括在其相对的内表面上设置有电阻膜2a，3a的触摸侧基板2和非接触侧基板3。 形成在非接触侧基板3周边的通孔4a，4b，4c，4d。用于将电阻膜2a，3a的电极与外部端子电连接的连接部分5，其中注入导电浆料 并且铆钉14从下表面侧插入到每个通孔中，使得铆钉14的头部形成平坦的连接电极15a，15b，用于连接到外部端子的下表面 非接触侧基板3。

公开(公告)号：EP1199746B1

公开(公告)日：2007-02-14

申请号：EP01302527.5

申请日：2001-03-20

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/31 ,  H01L23/433 ,  H01L21/56

CPC classification number: H01L24/32 ,  G11B5/4853 ,  H01L21/4832 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP0849981B1

公开(公告)日：2007-02-14

申请号：EP97250381.7

申请日：1997-12-22

Applicant: PPC Electronic AG

Inventor： Richter, Dietrich ,  Berchtold, Dieter ,  Lancki, Marian ,  Wissmeier, Hans-Georg ,  Straub, Peter ,  Diehm, Peter

IPC: H05K1/02 ,  H01L23/36 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H05K1/0206 ,  H05K3/341 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/1581 ,  Y02P70/613 ,  Y10S428/901

公开(公告)号：EP1369917A3

公开(公告)日：2006-09-27

申请号：EP03012908.4

申请日：2003-06-06

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Ishizaki, Toshio

IPC: H01L23/367

CPC classification number: H05K1/0243 ,  H01L23/3677 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A ceramic laminated board is provided which has thermal via holes penetrating the inside from the main face of the board. In the thermal via hole, a heat transfer body is placed which has a metallic body and a composite material provided entirely or partially between the metallic body and the ceramic laminated board. The composite material is higher in thermal conductivity than air and is lower in thermal expansion coefficient than the metallic body.

公开(公告)号：EP1458018B1

公开(公告)日：2006-04-19

申请号：EP04001572.9

申请日：2004-01-26

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Maeda, Takenobu, Murata Manufacturing Co., Ltd.

IPC: H01L21/607 ,  H01L21/60

CPC classification number: H05K1/0271 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014