公开(公告)号：EP3412121A1

公开(公告)日：2018-12-12

申请号：EP16889178.6

申请日：2016-02-01

Applicant: Elcoflex OY

Inventor： TARVAINEN, Timo

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/42 ,  B82Y30/00

CPC classification number: H05K3/4635 ,  B82Y30/00 ,  H05K3/4069 ,  H05K3/4623 ,  H05K2201/035 ,  H05K2203/0723 ,  H05K2203/1545

Abstract: In the manufacturing method of a multilayer printed circuit board and in a multilayer printed circuit board of the invention, at least part from insulating, conductive or semi-conductive layers remaining inside the multilayer printed circuit board there are manufactured a printed circuit board by using a roll-to-roll manufacturing method for two or several semi-finished printed circuit boards. Between the conductive printed layers of a semi-finished printed circuit board it is possible to manufacture electric vias connecting these by printing. A flexible multilayer printed circuit board is manufactured by connecting at least two semi-finished printed circuit boards face to face so that the pure surfaces of the metal foils of the semi-finished printed circuit boards remain outermost. After this holes can be manufactured through the flexible multilayer printed circuit board, which are metal-plated to produce an electric via.

公开(公告)号：EP1993132B1

公开(公告)日：2018-07-11

申请号：EP08008713.3

申请日：2008-05-09

Applicant: SEMIKRON Elektronik GmbH & Co. KG

Inventor： Göbl, Christian ,  Braml, Heiko, Dr.

IPC: H01L23/498 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H01L25/07 ,  H05K3/06 ,  H05K1/03 ,  H05K3/12 ,  H05K3/24 ,  C04B37/02 ,  C04B35/645

CPC classification number: H01L21/4867 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/05644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/75317 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/1283 ,  H05K3/247 ,  H05K2201/0133 ,  H05K2201/035 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

公开(公告)号：EP3217773A4

公开(公告)日：2017-11-15

申请号：EP14905484

申请日：2014-11-07

Applicant: FUJI MACHINE MFG

Inventor： HASHIMOTO YOSHITAKA ,  FUJITA MASATOSHI ,  TSUKADA KENJI ,  KAWAJIRI AKIHIRO ,  SUZUKI MASATO

IPC: H05K3/12

CPC classification number: H05K3/125 ,  C23C14/58 ,  H05K3/1283 ,  H05K3/1291 ,  H05K2201/035 ,  H05K2203/107

Abstract: To form wiring 72 on circuit board 34 and conductor body 60b, metal ink 70 containing metal particles is dispensed by inkjet head 24 straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device 26 to the dispensed metal ink. By this, the metal ink to which the laser is applied is baked and wiring 72 is formed. Here, a laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body By this, the metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

公开(公告)号：EP1774584B1

公开(公告)日：2014-10-29

申请号：EP05766971.5

申请日：2005-07-06

Applicant: EPCOS AG

Inventor： BRUNNER, Sebastian ,  FEICHTINGER, Thomas ,  PUDMICH, Günter ,  SCHLICK, Horst ,  SCHMIDT-WINKEL, Patrick

IPC: H01L21/60 ,  H05K3/40 ,  H05K3/24 ,  H05K3/28

CPC classification number: H05K3/4061 ,  H01L2924/0002 ,  H05K3/248 ,  H05K3/28 ,  H05K2201/035 ,  Y10T29/49155 ,  H01L2924/00

公开(公告)号：EP2496661A2

公开(公告)日：2012-09-12

申请号：EP10790862.6

申请日：2010-11-02

Applicant: Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd.

Inventor： MAGDASSI, Shlomo ,  GROUCHKO, Michael ,  LAYANI, Michael

IPC: C09K11/02

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Abstract translation: 本发明提供了用于制造导电透明膜的方法和包括其的电子或光电子器件。

公开(公告)号：EP1989930B1

公开(公告)日：2010-05-12

申请号：EP07751245.7

申请日：2007-02-22

Applicant: Edwards Lifesciences Corporation

Inventor： CURRY, Kenneth, M.

IPC: H05K1/11

CPC classification number: H05K3/247 ,  A61B5/1486 ,  A61B2562/125 ,  A61N1/05 ,  G01N27/3271 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2203/0574 ,  Y10T29/4916 ,  H01L2924/00

Abstract: A method of creating an active electrode (10) that includes providing a flex circuit (100) having an electrode (120) made of a first material and providin a first mask (200) over the flex circuit, the first mask having an offset region (305) and an opening (220) that exposes the electrode. The method also includes depositing a second material (300) over the offset region and the opening, the second material being different from the first material an providing a second mask (400) over the second material, the second mask havin a opening (405) over a portion of the second material that is over the offset region.

公开(公告)号：EP2161748A2

公开(公告)日：2010-03-10

申请号：EP09167725.2

申请日：2009-08-12

Applicant: Biotronik CRM Patent AG

Inventor： Schwanke, Dieter ,  Zeilmann, Christian ,  Krenkel, Michael

IPC: H01L23/498 ,  H01L21/607 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/73265 ,  H01L2224/85099 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85469 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/167 ,  H05K3/248 ,  H05K3/28 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/035 ,  Y10T29/49149 ,  Y10T29/49163 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2224/45624

Abstract: Die vorliegende Erfindung betrifft eine LTCC-Substratstruktur mit mindestens einem Kontaktelement zum Anschluss eines Drahtleiters, das eine erste, auf und/oder in dem keramischen Substrat angeordnete Metallisierung (20) zur elektrischen Verbindung mit dem Drahtleiter aufweist, wobei die erste Metallisierung (20) vorzugsweise Silber oder einer Silberlegierung enthält. Zur Vermeindung von Via-Posting oder eines Plattierungsprozesses sind eine die erste Metallisierung (20) überdeckende Diffusionssperrschicht (22), welche mit einem lokal wirkenden Aufbringungsverfahren hergestellt ist, und eine auf der Diffusionssperrschicht (22) angeordnete zweite Metallschicht (24) vorgesehen, wobei die zweite Metallschicht (24) vorzugsweise Gold und/oder Platin und/oder eine Legierung enthält, die mindestens eines dieser Elemente aufweist. Die Erfindung gibt außerdem ein Herstellungsverfahren für eine derartige LTCC-Substratstruktur an.

Abstract translation: 低温共烧陶瓷基板结构具有用于连接布线在陶瓷基板上或陶瓷基板上的线导体的接触元件，该线导体具有用于与线导体电连接的金属化。 金属化包含银或银合金。 扩散阻挡层（22）包围用本地工作创建程序制造的金属化。 金属层（24）布置在扩散阻挡层上，该层包含金或铂或合金。 扩散阻挡层含有镍或镍合金。 包括低温共烧陶瓷基板结构的制造方法的独立权利要求。

公开(公告)号：EP2131635A1

公开(公告)日：2009-12-09

申请号：EP09011820.9

申请日：2007-02-22

Applicant: Edwards Lifesciences Corporation

Inventor： Curry, Kenneth M.

IPC: H05K1/11

CPC classification number: H05K3/247 ,  A61B5/1486 ,  A61B2562/125 ,  A61N1/05 ,  G01N27/3271 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2203/0574 ,  Y10T29/4916 ,  H01L2924/00

Abstract: The present invention relates to a flex circuit having one or more active electrodes, comprising:
a substrate (105) having one or more electrodes (120) made of a first material;
a first mask (200) over the conductive trace, the first mask having a first opening (220) over a portion of the electrode;
a second material (300) over a portion of the conductive trace and over a portion of the first mask (200); and
a second mask (400) over the second material, the second mask having a second opening (405) over a portion of the second material (300), the second opening (405) being offset from the first opening (220); and
a membrane (500) in the opening (405) of the second material.

Abstract translation: 本发明涉及一种具有一个或多个有源电极，包括一个柔性电路：一个衬底（105），其具有由第一材料制成的一个或多个电极（120）; 第一掩模（200）在所述导电迹线，具有在所述电极的一部分的第一开口（220）所述第一掩模; 的第二材料（300）在所述导电迹线的一部分，并在所述第一掩模（200）的一部分; 和第二掩模（400）在所述第二材料具有比所述第二材料（300）的一部分的第二开口（405）的第二掩模，所述第二开口（405）从第一开口（220）偏移; 和在所述第二材料的所述开口（405）的膜（500）。

公开(公告)号：EP2115819A1

公开(公告)日：2009-11-11

申请号：EP07822811.1

申请日：2007-11-22

Applicant: Gigaset Communications GmbH

Inventor： BUSCH, Georg ,  HÜNTING, Ralf ,  FELS, Christoph

IPC: H01R12/32 ,  H01H19/58 ,  H04R1/10 ,  H05K3/32

CPC classification number: H01R12/57 ,  H01H1/04 ,  H01H1/403 ,  H01R12/52 ,  H01R13/03 ,  H05K3/249 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10265

Abstract: The invention relates to a contact system comprising a spring and an accordingly associated printed circuit board surface, with which the spring is in contact. The printed circuit board surface to be contacted is a carbon printed circuit board surface. Increased contact resistance between the spring and the carbon printed circuit board surface, which is associated with the contact system according to the invention, is furthermore compensated for by electric and/or electronic means. The spring that is used is provided with a spring force adapted to the carbon printed circuit surface.

公开(公告)号：EP1542518A4

公开(公告)日：2009-08-26

申请号：EP03730747

申请日：2003-06-02

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAYASHI N ,  OKA Y ,  KANDA MASAHIKO ,  YAGI N ,  MIYAZAKI K ,  NAKATSUGI K

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/10 ,  H05K3/16 ,  H05K3/24 ,  H05K3/38

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (1) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterized in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the mean particle diameter of which is 4 mum or less and the maximum particle diameter of which is 15 mum or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.