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1.发明公开Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same 审中-公开导电粘合剂材料，方法与材料和半导体器件键合，这已经被胶合到它
公开(公告)号：EP2278032A2
公开(公告)日：2011-01-26
申请号：EP10004458.5
申请日：2010-04-27
发明人： Yasuda, Yuusuke , Morita, Toshiaki , Ide, Eiichi , Inada, Teiichi
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles (202), (B) silver oxide (203), and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.
摘要翻译： 本发明提供的接合材料和接合在能够在没有施压情况下的较低温度高的接合强度的接合界面的金属接合的方法，相比于金属颗粒具有上的不大于平均粒径的接合材料 小于100nm。导电接合材料包括：（a）银颗粒（202），（B）氧化银（203），和（C）的分散剂包含含有不超过30个碳原子作为基本组分的有机材料，worin一个 在由100％的范围内的99.0％重量，提供的总量（A）的银粉末，（B）的氧化银粉末，和（C）的分散剂包含含有不超过30个碳原子的有机材料的 ， 换句话说，没有树脂粘合剂含有。
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2.发明公开Electrically conductive bonding material and method of bonding with the same 审中-公开导电粘合剂材料，方法与材料和半导体器件键合，这已经被胶合到它
公开(公告)号：EP2722410A1
公开(公告)日：2014-04-23
申请号：EP13192408.6
申请日：2010-04-27
发明人： YASUDA, Yuusuke , MORITA, Toshiaki , IDE, Eiichi , INADA, Teiichi
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： According to the present invention an electrically conductive bonding material comprises silver particles (202), silver oxides particles (203), a dispersant comprising an organic material containing not more than 30 carbon atoms, and an organic solvent having a boiling point of not higher than 350°C as essential components. The total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is 100 mass parts and an amount of the organic solvent is not more than 90 mass parts. The silver particles (202) are in flake form; and the total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is in a range of 99.0% to 100% by weight.
摘要翻译： 。根据导电接合材料的本发明包括银颗粒（202），银氧化物粒子（203），分散剂包括含有不超过30碳原子的有机材料，和在有机溶剂中具有不高于沸点 350℃作为必须成分。 银粒子（202）的总量中，氧化物的银颗粒（203），分散剂，有机溶剂为100质量份，并且对有机溶剂的量不超过90质量份。 银粒子（202）是薄片形式; 和银颗粒（202）的总量中，氧化物的银颗粒（203），分散剂，有机溶剂是在由范围为99.0％至100％重量。
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3.发明公开ELEKTRONISCHES BAUTEIL SOWIE HALBLEITERWAFER UND BAUTEILTRÄGER ZUR HERSTELLUNG DES BAUTEILS 审中-公开电子元件和半导体晶片和分量载波用于生产COMPONENT
公开(公告)号：EP1629530A1
公开(公告)日：2006-03-01
申请号：EP04738559.6
申请日：2004-05-26
发明人： JEREBIC, Simon , THEUSS, Horst , POHL, Jens
CPC分类号： H01L24/71 , H01L23/4827 , H01L23/562 , H01L23/564 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/0401 , H01L2224/04026 , H01L2224/05599 , H01L2224/274 , H01L2224/278 , H01L2224/29138 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29187 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/75733 , H01L2224/83121 , H01L2224/83143 , H01L2224/83193 , H01L2224/839 , H01L2224/92247 , H01L2224/94 , H01L2224/95144 , H01L2924/00014 , H01L2924/0101 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01064 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01105 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/3512 , H01L2924/35121 , H01L2224/85399 , H01L2224/45099 , H01L2924/00 , H01L2224/27 , H01L2924/00012
摘要： The invention relates to an electronic component as well as a semiconductor wafer and a component support for producing said component. The inventive electronic component comprises a semiconductor chip (1) encompassing a top face (2) that is provided with an integrated circuit and a bottom face (3) which is provided with a magnetic layer (7). The top face (5) of a chip support is also provided with a magnetic layer (8). At least one of the two layers (7, 8) is permanently magnetic such that the semiconductor chip is magnetically fixed to the chip support (5).
摘要翻译： 一种电子部件，包括具有顶侧芯片集成电路和芯片背面的半导体芯片。 该芯片背面侧包括磁性层。 该电子部件还包括在其顶侧载体的磁性层的芯片载体。 至少两个磁性层中的一个是永磁检查所做的半导体芯片被磁性固定在芯片载体上。
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公开(公告)号：EP3172349A2
公开(公告)日：2017-05-31
申请号：EP15744284.9
申请日：2015-07-15
发明人： CHOUDHURY, Pritha , DE AVILA RIBAS, Morgana , MUKHERJEE, Sutapa , SARKAR, Siuli , PANDHER, Ranjit , BHATKAL, Ravindra , SINGH, Bawa
IPC分类号： C22C13/00 , C22C13/02 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/08 , B23K35/00 , B23K35/02 , B23K35/26
CPC分类号： B23K35/262 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/085 , B23K35/00 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K2201/40 , B23K2201/42 , C22C13/00 , C22C13/02 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29117 , H01L2224/29123 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29149 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29172 , H01L2224/2918 , H01L2224/83815 , H01L2924/01015 , H01L2924/0102 , H01L2924/01032 , H01L2924/01034 , H01L2924/01052 , H01L2924/01058
摘要： A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
摘要翻译： 一种无铅无锑焊料合金，包括：（a）1-4重量％银（b）0.5-6重量％铋（c）3.55-15重量％铟（d）3重量％ （e）任选的一种或多种以下元素0至1重量％的镍0至1重量％的钛0至1重量％的锰0至1重量％的稀土，例如 作为铈0-1重量％的铬0-1重量％的锗0-1重量％的镓0-1重量％的钴0-1重量％的铁0-1重量％的铝0 至1重量％的磷0至1重量％的金0至1重量％的碲0至1重量％的硒0至1重量％的钙0至1重量％的钒0至1 （重量）的0-1％（重量）的铂0-1％（重量）的镁（f）余量的锡以及任何不可避免的杂质。
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5.发明公开Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same 审中-公开导电粘合剂材料，方法与材料和半导体器件键合，这已经被胶合到它
公开(公告)号：EP2278032A3
公开(公告)日：2012-06-20
申请号：EP10004458.5
申请日：2010-04-27
发明人： Yasuda, Yuusuke , Morita, Toshiaki , Ide, Eiichi , Inada, Teiichi
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles (202), (B) silver oxide (203), and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.
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公开(公告)号：EP2389337A4
公开(公告)日：2016-09-07
申请号：EP10738898
申请日：2010-01-13
发明人： MONTEZ RUBEN B , PAMATAT ALEX P
CPC分类号： H01L23/10 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L21/50 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/02 , H01L2224/022 , H01L2224/036 , H01L2224/0391 , H01L2224/04026 , H01L2224/05558 , H01L2224/05572 , H01L2224/05638 , H01L2224/2745 , H01L2224/27452 , H01L2224/2746 , H01L2224/276 , H01L2224/29013 , H01L2224/29016 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29138 , H01L2224/29144 , H01L2224/29155 , H01L2224/29157 , H01L2224/29166 , H01L2224/29169 , H01L2224/29181 , H01L2224/29184 , H01L2224/32145 , H01L2224/32225 , H01L2224/32502 , H01L2224/32506 , H01L2224/83193 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83455 , H01L2224/83457 , H01L2224/83466 , H01L2224/83469 , H01L2224/83481 , H01L2224/83484 , H01L2224/83805 , H01L2224/94 , H01L2924/10157 , H01L2924/15159 , H01L2924/164 , H01L2924/01032 , H01L2924/01014 , H01L2924/01029 , H01L2924/00014 , H01L2924/00012 , H01L2224/83
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公开(公告)号：EP2389337A2
公开(公告)日：2011-11-30
申请号：EP10738898.5
申请日：2010-01-13
发明人： MONTEZ, Ruben B. , PAMATAT, Alex P.
CPC分类号： H01L23/10 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L21/50 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/02 , H01L2224/022 , H01L2224/036 , H01L2224/0391 , H01L2224/04026 , H01L2224/05558 , H01L2224/05572 , H01L2224/05638 , H01L2224/2745 , H01L2224/27452 , H01L2224/2746 , H01L2224/276 , H01L2224/29013 , H01L2224/29016 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29138 , H01L2224/29144 , H01L2224/29155 , H01L2224/29157 , H01L2224/29166 , H01L2224/29169 , H01L2224/29181 , H01L2224/29184 , H01L2224/32145 , H01L2224/32225 , H01L2224/32502 , H01L2224/32506 , H01L2224/83193 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83455 , H01L2224/83457 , H01L2224/83466 , H01L2224/83469 , H01L2224/83481 , H01L2224/83484 , H01L2224/83805 , H01L2224/94 , H01L2924/10157 , H01L2924/15159 , H01L2924/164 , H01L2924/01032 , H01L2924/01014 , H01L2924/01029 , H01L2924/00014 , H01L2924/00012 , H01L2224/83
摘要： A method that in one embodiment is useful in bonding a first substrate (103) to a second substrate (303) includes forming a layer including metal over the first substrate. The layer including metal in one embodiment surrounds a semiconductor device, which can be a micro electromechanical system (MEMS) device. On the second substrate (303) is formed a first layer comprising silicon (401). A second layer (403) comprising germanium and silicon is formed on the first layer. A third layer (405) comprising germanium is formed on the second layer. The third layer is brought into contact with the layer including metal. Heat (and pressure in some embodiments) is applied to the third layer and the layer including metal to form a mechanical bond material between the first substrate and the second substrate in which the mechanical bond material is electrically conductive. In the case of the mechanical bond surrounding a semiconductor device such as a MEMS, the mechanical bond can be particularly advantageous as a hermetic seal for protecting the MEMS.
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