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    Laser processing method and apparatus
    36.
    发明专利
    Laser processing method and apparatus 有权

    公开(公告)号：JP5025158B2

    公开(公告)日：2012-09-12

    申请号：JP2006124084

    申请日：2006-04-27

    Applicant: 日立造船株式会社

    Inventor： 茂昭 中山 ,  和良 國塩 ,  直晃 福田

    IPC: B23K26/06 ,  B23K26/067 ,  B23K101/42 ,  H05K3/00

    CPC classification number: B23K26/0604 ,  B23K26/0006 ,  B23K26/0608 ,  B23K26/0676 ,  B23K2201/42 ,  B23K2203/00 ,  B23K2203/56 ,  H05K3/0026 ,  H05K3/027 ,  H05K2201/0338 ,  H05K2203/108

    Abstract: [PROBLEMS] The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages. [MEANS FOR SOLVING PROBLEMS] A laser processing apparatus is provided with first and second laser oscillators (2a, 2b) for emitting laser beams (3a, 3b) of which at least the wavelength or the intensities are different from each other; a stage apparatus (5) for moving a workpiece (1) to be processed; and optical systems (4a, 4b) for guiding the laser beams (3a, 3b) to prescribed positions of the workpiece (1). The optical systems (4a, 4b) can be moved by means of an adjusting device (6) according to the relative moving direction of the laser beams (3a, 3b) and the workpiece (1) to permit the prescribed position of the workpiece (1) to be irradiated with laser beams (3a, 3b) in that order so that the workpiece (1) can be processed by the laser beams (3a, 3b). Thus, efficient laser processing can be performed without limiting the relative moving direction of the laser beams and the workpiece and without unnecessary movement.

    Method for forming plated layer of printed board
    37.
    发明专利
    Method for forming plated layer of printed board 审中-公开
    形成印刷电路板层的方法

    公开(公告)号：JP2012060121A

    公开(公告)日：2012-03-22

    申请号：JP2011192424

    申请日：2011-09-05

    Applicant: Samsung Electro-Mechanics Co Ltd ,  サムソン エレクトロ−メカニックス カンパニーリミテッド.

    Inventor： MUN JON-HO ,  OH SAN-HYOK

    IPC: H05K3/42

    CPC classification number: C25D7/123 ,  H01L2924/0002 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0338 ,  H05K2203/1476 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To reduce the deviation in plating thickness of a copper plated layer filling a circuit pattern part and a through-hole part in a SIP product group with a narrow through-hole pitch and a large through-hole volume.SOLUTION: A method for forming a plated layer of a printed board comprises: a step of forming a through-hole for a CCL (Copper clad lamination) 10; a step of forming a seed plated layer 20 at the through-hole; a step of coating the CCL 10 and the seed plated layer 20 with a resist 40; a step of light-exposing and developing the resist 40 on the seed plated layer 20; a step of forming a primary plated layer 50 on the seed plated layer 20; a step of forming a copper plated layer 60 on the primary plated layer 50; and a step of forming a circuit pattern 61 by removing the resist 40 and the seed plated layer 20 remaining on the primary plated layer 50.

    Abstract translation: 要解决的问题：为了减少填充具有窄通孔间距和大通孔容积的SIP产品组中的电路图形部分和通孔部分的镀铜层的电镀厚度的偏差 。 解决方案：一种用于形成印刷电路板的镀层的方法，包括：形成用于CCL（覆铜层压）10的通孔的步骤; 在通孔处形成种子镀层20的步骤; 用抗蚀剂40涂覆CCL 10和种子镀层20的步骤; 在种子镀层20上曝光和显影抗蚀剂40的步骤; 在种皮镀层20上形成初级镀层50的工序; 在主镀层50上形成镀铜层60的工序; 以及通过去除残留在主镀层50上的抗蚀剂40和种子镀层20形成电路图案61的步骤。（C）2012，JPO＆INPIT

    Display device
    39.
    发明专利
    Display device 审中-公开
    显示设备

    公开(公告)号：JP2011053651A

    公开(公告)日：2011-03-17

    申请号：JP2010133234

    申请日：2010-06-10

    Applicant: Samsung Mobile Display Co Ltd ,  三星モバイルディスプレイ株式會社

    Inventor： LEE JUNG-MIN ,  LEE CHOONG-HO

    IPC: G09F9/30 ,  H01L21/60 ,  H01L51/50 ,  H05B33/04 ,  H05B33/06 ,  H05B33/08

    CPC classification number: H01L27/3276 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/0338 ,  H05K2201/10674

    Abstract: PROBLEM TO BE SOLVED: To provide a display device capable of suppressing an increase in contact resistance between a substrate and an integrated circuit chip by fixing the compressed form of a conductive ball. SOLUTION: The display device includes: a wiring substrate having a wiring part formed therein; an integrated circuit chip mounted on the wiring substrate; and a pad part extended from the wiring part to be set between the wiring substrate and the integrated circuit chip, and coupled to the integrated circuit chip. The pad part includes: a first conductive layer extended from the wiring part; and a second conductive layer positioned on the first conductive layer and harder than the first conductive layer. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 解决的问题：提供一种能够通过固定导电球的压缩形式来抑制基板和集成电路芯片之间的接触电阻增加的显示装置。 解决方案：显示装置包括：布线基板，其中形成有布线部分; 安装在所述布线基板上的集成电路芯片; 以及从布线部分延伸以设置在布线基板和集成电路芯片之间的焊盘部分，并且耦合到集成电路芯片。 焊盘部分包括：从布线部分延伸的第一导电层; 以及位于所述第一导电层上并且比所述第一导电层硬的第二导电层。 版权所有（C）2011，JPO＆INPIT

    Coated conductive particle and manufacturing method therefor
    40.
    发明专利
    Coated conductive particle and manufacturing method therefor 有权
    涂层导电颗粒及其制造方法

    公开(公告)号：JP2011029178A

    公开(公告)日：2011-02-10

    申请号：JP2010151205

    申请日：2010-07-01

    Applicant: Hitachi Chem Co Ltd ,  日立化成工業株式会社

    Inventor： TAKAI KENJI ,  EJIRI YOSHINORI ,  NAGAHARA YUKO ,  MATSUZAWA MITSUHARU

    IPC: H01B5/00 ,  H01B1/00 ,  H01B13/00 ,  H01L21/60 ,  H01R11/01

    CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F1/025 ,  B22F2998/10 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0338 ,  B22F1/02

    Abstract: PROBLEM TO BE SOLVED: To inexpensively provide a conductive particle for providing an anisotropic conductive adhesive capable of maintaining a sufficient insulating characteristic and conduction characteristic even in connection of a microcircuit, and excellent in anti-hygroscopicity.
    SOLUTION: This coated conductive particle 5 includes a composite conductive particle 3 having a resin particle 4 and a metal layer 6 for coating the resin particle 4, and an insulating fine particle 1 provided in an outside of the metal layer 6, and for coating one part of a surface of the metal layer 6. The metal layer 6 includes a nickel-palladium alloy plated layer 6a.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了廉价地提供一种用于提供能够保持足够的绝缘特性和导电特性的各向异性导电粘合剂的导电颗粒，即使在微电路的连接和抗吸湿性也优异的情况下。 ＆lt;解决方案＆gt;该涂覆导电粒子5包括具有树脂颗粒4和用于涂覆树脂颗粒4的金属层6的复合导电颗粒3和设置在金属层6外侧的绝缘细颗粒1，以及 用于涂覆金属层6的一部分表面。金属层6包括镍 - 钯合金镀层6a。 版权所有（C）2011，JPO＆INPIT

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