-
公开(公告)号：JP2012186431A
公开(公告)日：2012-09-27
申请号：JP2011050361
申请日：2011-03-08
Inventor： SEKINE SHIGENOBU , SEKINE YURINA
CPC classification number: H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
Abstract: PROBLEM TO BE SOLVED: To provide an electronic apparatus which is excellent in conductivity, electrochemical stability, oxidation resistance, repletion, denseness, and mechanical and physical strength and has a high quality metalization wiring having high bonding and adhesive force to substrates and achieving high reliability.SOLUTION: A substrate 11 has metalization wiring 12 having a predetermined pattern. The metalization wiring 12 includes a metalization layer 121 and an insulation layer 122. The metalization layer 121 includes a high melting metal component and a low melting metal component, and the high melting metal component and the low melting metal component are diffusively joined to each other. The insulation layer 122 is formed at the same time as the metalization layer 121 and covers an exterior surface of the metalization layer 121. An electronic component 14 electrically connects with the metalization layer 121 of the metalization wiring 12.
Abstract translation: 要解决的问题：提供导电性，电化学稳定性，抗氧化性，补充性，致密性和机械和物理强度优异的电子设备，并且具有对基底具有高粘合力和粘合力的高质量金属化布线， 实现高可靠性。 解决方案：基板11具有预定图案的金属化布线12。 金属化布线12包括金属化层121和绝缘层122.金属化层121包括高熔点金属成分和低熔点金属成分，高熔点金属成分和低熔点金属成分彼此扩散接合 。 绝缘层122与金属化层121同时形成并覆盖金属化层121的外表面。电子部件14与金属化布线12的金属化层121电连接。（C ）2012，JPO＆INPIT
-
Patent Agency Ranking
公开(公告)号：JP4778120B1
公开(公告)日：2011-09-21
申请号：JP2011050361
申请日：2011-03-08
Applicant: 有限会社ナプラ
IPC: H05K1/09
CPC classification number: H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
Abstract: An electronic device includes a substrate and an electronic component. The substrate has a metallized trace. The metallized trace has a metallized layer and an insulation layer. The metallized layer has a high melting point metal component and a low melting point metal component, the high melting point metal component and the low melting point metal component being diffusion bonded together. The insulation layer is formed simultaneously with the metallized layer to cover an outer surface of the metallized layer. The electronic component is electrically connected to the metallized layer.
-
公开(公告)号：JP6128495B2
公开(公告)日：2017-05-17
申请号：JP2014523553
申请日：2013-02-21
Applicant: パナソニックIPマネジメント株式会社
IPC: H05K3/10 , H05K3/32 , H05K1/09 , H05K1/18 , H01L21/60 , H01L23/12 , H01B1/22 , G06K19/077 , H05K3/12
CPC classification number: H05K1/097 , G06K19/07718 , G06K19/07745 , H01L21/4853 , H01L23/145 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/75 , H01L24/81 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0652 , H05K1/0274 , H05K1/0313 , H05K1/181 , H05K3/321 , G02F1/1303 , H01L2223/6677 , H01L2224/11312 , H01L2224/1132 , H01L2224/13008 , H01L2224/13016 , H01L2224/13019 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/13301 , H01L2224/13311 , H01L2224/13318 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13364 , H01L2224/13369 , H01L2224/1339 , H01L2224/1349 , H01L2224/13644 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17106 , H01L2224/73204 , H01L2224/7526 , H01L2224/75262 , H01L2224/7565 , H01L2224/75651 , H01L2224/75702 , H01L2224/7598 , H01L2224/81127 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8159 , H01L2224/81601 , H01L2224/81611 , H01L2224/81618 , H01L2224/81624 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/81657 , H01L2224/8166 , H01L2224/81664 , H01L2224/81669 , H01L2224/81815 , H01L2224/8184 , H01L2224/81871 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/19105 , H05K2201/0108 , H05K2201/10674 , H05K3/12
-
公开(公告)号：JP5124693B1
公开(公告)日：2013-01-23
申请号：JP2012098837
申请日：2012-04-24
Applicant: 有限会社 ナプラ
CPC classification number: H01L23/48 , H01B1/22 , H01L21/4867 , H01L21/563 , H01L23/498 , H01L23/49838 , H01L23/49866 , H01L23/49883 , H01L23/49894 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/0332 , H01L2224/0341 , H01L2224/03848 , H01L2224/0401 , H01L2224/05023 , H01L2224/05205 , H01L2224/05209 , H01L2224/05211 , H01L2224/05213 , H01L2224/05318 , H01L2224/05324 , H01L2224/05338 , H01L2224/05339 , H01L2224/05344 , H01L2224/05347 , H01L2224/05355 , H01L2224/0536 , H01L2224/05366 , H01L2224/05369 , H01L2224/05562 , H01L2224/0569 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/81375 , H01L2224/81395 , H01L2224/81505 , H01L2224/81509 , H01L2224/81511 , H01L2224/81513 , H01L2224/81618 , H01L2224/81624 , H01L2224/81638 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/8166 , H01L2224/81666 , H01L2224/81669 , H01L2224/831 , H01L2225/06513 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/01327 , H01L2924/12041 , H01L2924/15747 , H01L2933/0016 , H01L2933/0066 , Y02E10/547 , H01L2924/01014 , H01L2924/00 , H01L2224/05552
Abstract: An electronic device includes a substrate (11, 14B) and an electronic component (141-146, 14A, 14C, 140). The substrate (11, 14B) has a metallization trace (12, 12n, 12p). The metallization trace (12, 12n, 12p) has a metallization layer (121, 121n, 121p) and a synthetic resin layer (122, 122n, 122p). The metallization layer (121, 121n, 121p) has a high-melting-point metallic component (124) and a low-melting-point metallic component (123). The high-melting-point metallic component (124) and the low-melting-point metallic component (123) are diffusion bonded together and adhered to a surface of the substrate (11, 14B). The synthetic resin layer (122, 122n, 122p) is formed simultaneously with the metallization layer (121, 121n, 121p) to cover a surface of the metallization layer (121, 121n, 121p) with a thickness in the range of 5 nm to 1000 nm, preferably 5 nm to 500 nm. The electronic component (141-146, 14A, 14C, 140) is electrically connected to the metallization layer (121, 121n, 121p). The high-melting-point metallic particles (124) and the low-melting-point metallic particles (123) may have a nanocomposite structure.
-
公开(公告)号：JPWO2014006787A1
公开(公告)日：2016-06-02
申请号：JP2014523553
申请日：2013-02-21
Applicant: パナソニックIpマネジメント株式会社
CPC classification number: H05K1/097 , G02F1/1303 , G06K19/07718 , G06K19/07745 , H01L21/4853 , H01L23/145 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/75 , H01L24/81 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0652 , H01L2223/6677 , H01L2224/11312 , H01L2224/1132 , H01L2224/13008 , H01L2224/13016 , H01L2224/13019 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/13301 , H01L2224/13311 , H01L2224/13318 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13364 , H01L2224/13369 , H01L2224/1339 , H01L2224/1349 , H01L2224/13644 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17106 , H01L2224/73204 , H01L2224/7526 , H01L2224/75262 , H01L2224/7565 , H01L2224/75651 , H01L2224/75702 , H01L2224/7598 , H01L2224/81127 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8159 , H01L2224/81601 , H01L2224/81611 , H01L2224/81618 , H01L2224/81624 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/81657 , H01L2224/8166 , H01L2224/81664 , H01L2224/81669 , H01L2224/81815 , H01L2224/8184 , H01L2224/81871 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/19105 , H05K1/0274 , H05K1/0313 , H05K1/181 , H05K3/12 , H05K3/321 , H05K2201/0108 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/00012 , H01L2924/01048 , H01L2224/81 , H01L2224/11 , H01L2924/00
Abstract: 電子部品実装構造体は、基板と、基板の表面に形成されたCu等の高融点金属を主体とする導電性配線パターンと、導電性配線パターンの端子接合位置を内包する、前記基板の表面の搭載位置に搭載された、外部端子を有する電子部品と、を含む。外部端子は、端子接合位置で、導電性配線パターンの内部に没入した状態で、導電性配線パターンと接合されている。このため、単に導電性配線パターンの表面で、電子部品の外部端子と導電性配線パターンとを接合する接合部と比較すると、より強度の高い接合部で、外部端子と導電性配線パターンとを接合することができる。
Abstract translation: 电子部件安装结构包括衬底和形成在衬底的表面上的主要由难熔金属的导电布线图案如Cu，含有底物的表面的导电性布线图案的终端键合位置 它安装在所述安装位置时，其包括具有外部端子的电子部件。 外部端子是一个终端连接位置，而浸入在导电布线图案的内侧接合到导电布线图案。 因此，只是在导电布线图案的表面上，相对于接头接合所述外部端子与所述电子元件的导电性的布线图案，具有更高的强度接合，接合外部端子与所述导电布线图案时 它可以。
-
公开(公告)号：JP2013229376A
公开(公告)日：2013-11-07
申请号：JP2012098837
申请日：2012-04-24
Inventor： SEKINE SHIGENOBU , SEKINE YURINA
CPC classification number: H01L23/48 , H01B1/22 , H01L21/4867 , H01L21/563 , H01L23/498 , H01L23/49838 , H01L23/49866 , H01L23/49883 , H01L23/49894 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/0332 , H01L2224/0341 , H01L2224/03848 , H01L2224/0401 , H01L2224/05023 , H01L2224/05205 , H01L2224/05209 , H01L2224/05211 , H01L2224/05213 , H01L2224/05318 , H01L2224/05324 , H01L2224/05338 , H01L2224/05339 , H01L2224/05344 , H01L2224/05347 , H01L2224/05355 , H01L2224/0536 , H01L2224/05366 , H01L2224/05369 , H01L2224/05562 , H01L2224/0569 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/81375 , H01L2224/81395 , H01L2224/81505 , H01L2224/81509 , H01L2224/81511 , H01L2224/81513 , H01L2224/81618 , H01L2224/81624 , H01L2224/81638 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/8166 , H01L2224/81666 , H01L2224/81669 , H01L2224/831 , H01L2225/06513 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/01327 , H01L2924/12041 , H01L2924/15747 , H01L2933/0016 , H01L2933/0066 , Y02E10/547 , H01L2924/01014 , H01L2924/00 , H01L2224/05552
Abstract: PROBLEM TO BE SOLVED: To provide an electronic apparatus in which when connecting an external electric conductor or an electronic component to metalized wiring, it is possible to ensure oxidation resistance and to securely ensure electrical conduction between them.SOLUTION: A base plate 11 has metalized wiring 12. The metalized wiring 12 includes a metalized layer 121 and a synthetic resin film 122. The metalized layer 121 includes a high melting-point metal component and a low melting-point metal component, and the high melting-point metal component and the low melting-point metal component are diffusion-bonded to each other. The synthetic resin film 122 covers a surface of the metalized layer 121 and has a film thickness ranging 5 nm to 1000 nm.
Abstract translation: 要解决的问题：为了提供一种电子设备，其中当将外部电导体或电子部件连接到金属化布线时，可以确保抗氧化性并且可靠地确保它们之间的导电。解决方案：基板11具有金属化 金属化布线12包括金属化层121和合成树脂膜122.金属化层121包括高熔点金属成分和低熔点金属成分，高熔点金属成分和高熔点金属成分 低熔点金属成分彼此扩散接合。 合成树脂膜122覆盖金属化层121的表面，膜厚为5nm〜1000nm。
-
-
-
-
-
Search Results
6
records
(took 0.015 seconds)
