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    Wiring circuit board
    31.
    发明专利
    Wiring circuit board 有权
    接线电路板

    公开(公告)号：JP2009105207A

    公开(公告)日：2009-05-14

    申请号：JP2007275198

    申请日：2007-10-23

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： MOTOGAMI MITSURU

    IPC: H05K1/02

    CPC classification number: H05K1/0225 ,  H05K2201/09681

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring circuit board that suppresses noise radiation during transmission of a high frequency signal.
    SOLUTION: A grounding conductor layer 7 is formed on the lower surface of a base insulating layer 1. A mesh zone 70 is formed in a region of the grounding conductor layer 7 opposed to a signal transmission line 2 with the base insulating layer 1 disposed therebetween. A grounding surface insulating layer 8 is formed so as to cover the region of the mesh zone 70 in the grounding conductor layer 7. A grounding surface shielding layer 9 is formed so as to cover the grounding surface insulating layer 8 and so as to contact the grounding conductor layer 7 outside of the grounding surface insulating layer 8.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种抑制高频信号传输期间的噪声辐射的布线电路板。 解决方案：接地导体层7形成在基底绝缘层1的下表面上。网状区70形成在与信号传输线2相对的接地导体层7的区域中，基底绝缘层 1。 形成接地面绝缘层8，以覆盖接地导体层7中的网格区域70的区域。接地表面屏蔽层9形成为覆盖接地表面绝缘层8，并且与接地表面绝缘层8接触 接地导体层7在接地表面绝缘层8之外。版权所有（C）2009，JPO＆INPIT

    Printed circuit board having stepped conduction layer
    32.
    发明专利
    Printed circuit board having stepped conduction layer 有权
    具有阶梯式导电层的印刷电路板

    公开(公告)号：JP2009088471A

    公开(公告)日：2009-04-23

    申请号：JP2008053285

    申请日：2008-03-04

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： KIM HAN ,  CHOI HYUNG-SIK ,  PARK DAE-HYUN

    IPC: H05K1/02

    CPC classification number: H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/09745

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board having a stepped conduction layer that can be used to resolve the problem of mixed signals in a printed circuit board equipped with various parts and components, including an analog circuit and digital circuit, etc.
    SOLUTION: The printed circuit board having stepped conduction layers is provided in which at least the one conduction layer 310 or 320 configured for use as a signal transmission layer is divided into a base regions 320a and a connecting region 320b connecting any two of the base regions 320a, where the connecting region 320b is stepped to a lower height than those of the base regions 320a.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种具有台阶导电层的印刷电路板，其可以用于解决装配有包括模拟电路和数字电路的各种部件的印刷电路板中的混合信号的问题， 提供了具有阶梯状导电层的印刷电路板，其中至少将构成用作信号传输层的导电层310或320分成基极区域320a和连接任何 两个基部区域320a，其中连接区域320b被阶梯到比基部区域320a的高度更低的高度。 版权所有（C）2009，JPO＆INPIT

    Printed circuit board
    33.
    发明专利
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：JP2008160120A

    公开(公告)日：2008-07-10

    申请号：JP2007327917

    申请日：2007-12-19

    Applicant: Hon Hai Precision Industry Co Ltd ,  鴻海精密工業股▲ふん▼有限公司

    Inventor： RIN YUKYOKU ,  GO SEITATSU ,  CHAO CHIH-HANG

    IPC: H05K1/02

    CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K2201/09681

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board capable of increasing resistance and controlling resistance variation in one signal line within a predetermined scope.
    SOLUTION: The printed circuit board includes a signal line layer and a ground layer where signal lines are disposed. The ground layer has a formed trace surface by mutually connecting a plurality of traces. An orthographic projection of the signal line to the ground layer mutually intersects with sides of the traces in the ground layer through which the orthographic projection passes. Namely, because the orthographic projections of every signal line to the ground layer are not overlapped on each side of the traces in the ground layer through which the orthographic projection passes, the system can control the resistance of one signal line, vary the resistance in a small scope, and increase quality in signal transmission.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供能够在预定范围内增加一个信号线中的电阻和控制电阻变化的印刷电​​路板。

    解决方案：印刷电路板包括信号线层和设置信号线的接地层。 接地层通过相互连接多个迹线具有形成的迹线表面。 信号线到接地层的正交投影与正交投影通过的接地层中的迹线的侧面相互相交。 也就是说，由于正交投影通过的接地层中的每个信号线的正交投影不与重叠在接地层中的迹线的每一侧，所以系统可以控制一个信号线的电阻，改变一个信号线的电阻 范围小，信号传输质量提高。 版权所有（C）2008，JPO＆INPIT

    Flexible printed board
    34.
    发明专利
    Flexible printed board 审中-公开
    柔性印刷板

    公开(公告)号：JP2008124317A

    公开(公告)日：2008-05-29

    申请号：JP2006307933

    申请日：2006-11-14

    Applicant: Toshiba Matsushita Display Technology Co Ltd ,  東芝松下ディスプレイテクノロジー株式会社

    Inventor： OTA TSUTOMU

    IPC: H05K1/02

    CPC classification number: H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/09609 ,  H05K2201/09681

    Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed board which copes fully with noise while maintaining durability and flexibility at a bent part of an FPC.
    SOLUTION: This flexible printed board is produced by a method comprising: forming a second ground bent line in a mesh shape in the surface side of the base layer 12 of the bent part 2 of FPC 1; forming a third ground bent line crossing transversely the second ground bent line; forming a first ground bent line 16 along the bent direction in the reverse surface side of the base layer 12; and connecting electrically the first ground bent line 16, the second ground bent line 20 and the third ground bent line 22 by a through hole 26.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种柔性印刷板，其在FPC的弯曲部分保持耐用性和柔性的同时充分地处理噪声。 解决方案：该柔性印刷电路板通过以下方法制造：包括：在FPC1的弯曲部分2的基底层12的表面侧形成网状的第二接地弯曲线; 形成横向穿过第二地面弯曲线的第三地面弯曲线; 在基层12的背面侧沿弯曲方向形成第一接地弯曲线16; 并且通过通孔26将第一接地弯曲线16，第二接地弯曲线20和第三接地弯曲线22电连接。版权所有（C）2008，JPO和INPIT

    Light source module, light source apparatus, and liquid crystal display apparatus
    35.
    发明专利
    Light source module, light source apparatus, and liquid crystal display apparatus 有权
    光源模块，光源装置和液晶显示装置

    公开(公告)号：JP2008028171A

    公开(公告)日：2008-02-07

    申请号：JP2006199437

    申请日：2006-07-21

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： FUJINO TOYOMI ,  FUKAZAWA HIROYUKI ,  FUJII MASARU

    IPC: H01L33/62 ,  F21S2/00 ,  F21V29/00 ,  F21Y101/02 ,  G02F1/13357 ,  H01L33/64

    CPC classification number: G02F1/133621 ,  G02F1/133603 ,  G02F1/133608 ,  G02F1/133609 ,  G02F1/133611 ,  G02F2001/133612 ,  G02F2001/133628 ,  H01L24/45 ,  H01L2224/45 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0209 ,  H05K2201/09318 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/43 ,  H01L2924/01006

    Abstract: PROBLEM TO BE SOLVED: To provide a light source module, a light source apparatus, and a liquid crystal display apparatus whereby the luminance can be uniformized and the heat dissipation performance of LED elements can be enhanced. SOLUTION: The light source module 11 includes LED chip groups 12 each comprising red, green, blue color LED chips 12R, 12G, 12B, and wiring boards 13 on which a plurality of sets of the LED chip groups 12 are mounted. In each of the LED chip groups 12 of each set, the LED chips 12R, 12G, 12B are respectively located on the apices of a triangle so that the interval among the LED chips 12R, 12G, 12B is substantially equal to each other. One side of each of the wiring boards 13 is formed as an element forming side 13A located with the plural sets of the LED chip groups 12, an external connection terminal 15, and a wiring pattern 14 for electrically connecting the LED chip groups 12 and the external connection terminal 15. The other side of each of the wiring boards 13 is formed as a heat dissipation side 13B thermally connected to the element forming side 13A for externally dissipating the heat produced by the element forming side 13A. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种光源模块，光源装置和液晶显示装置，由此能够使亮度均匀化，并且可以提高LED元件的散热性能。 解决方案：光源模块11包括LED芯片组12，每个LED芯片组12包括红色，绿色，蓝色LED芯片12R，12G，12B和布线板13，多个LED芯片组12组装在该芯片组12上。 在每组的LED芯片组12中，LED芯片12R，12G，12B分别位于三角形的顶点上，使得LED芯片12R，12G，12B之间的间隔基本相等。 每个布线板13的一侧形成为位于多组LED芯片组12，外部连接端子15和布线图案14之间的元件形成侧13A，用于将LED芯片组12和 外部连接端子15.每个布线板13的另一侧形成为与元件形成侧13A热连接的散热侧13B，用于从元件形成侧13A产生的热量外部散发。 版权所有（C）2008，JPO＆INPIT

    Flexible rigid wiring board
    37.
    发明专利
    Flexible rigid wiring board 有权
    柔性刚性接线板

    公开(公告)号：JP2005353827A

    公开(公告)日：2005-12-22

    申请号：JP2004172679

    申请日：2004-06-10

    Applicant: Ibiden Co Ltd ,  イビデン株式会社

    Inventor： MIKADO YUKINOBU ,  KOSAKA KATSUMI ,  KAWAGUCHI KATSUO ,  MURAKI TETSUYA

    IPC: H05K1/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

    CPC classification number: H05K1/0281 ,  H05K1/0366 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4691 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/2009 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/31663

    Abstract: PROBLEM TO BE SOLVED: To provide a flexible rigid wiring board that is excellent in connection reliability, by preventing the deformation of a substrate which easily occurs in a bent section, the disconnection of a conductor circuit, and the formation of swelling etc. SOLUTION: The flexible rigid wiring board is provided with a hard rigid substrate and a bendable flexible substrate having the conductor circuit covered with a cover lay on an insulating substrate. In the wiring board, the insulating substrate is composed of a glass cloth formed in a bendable state by impregnating a resin into the substrate. In addition, the wiring pattern in the bent section of the conductor circuit has a wide width or is curved in the width direction. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供连接可靠性优异的柔性刚性布线板，通过防止弯曲部容易发生的基板的变形，导体电路的断开以及膨胀等的形成 解决方案：柔性刚性布线板设置有硬刚性基板和可弯曲柔性基板，其中导体电路覆盖有覆盖在绝缘基板上的盖。 在布线板中，绝缘基板由通过将树脂浸渍到基板中而以可弯曲状态形成的玻璃布构成。 此外，导体电路的弯曲部分中的布线图案具有宽的宽度或在宽度方向上弯曲。 版权所有（C）2006，JPO＆NCIPI

    Signal transport substrate and connection structure of signal transport substrate and connector
    38.
    发明专利
    Signal transport substrate and connection structure of signal transport substrate and connector 审中-公开
    信号传输基板和信号传输基板和连接器的连接结构

    公开(公告)号：JP2005244029A

    公开(公告)日：2005-09-08

    申请号：JP2004053558

    申请日：2004-02-27

    Applicant: Molex Inc ,  モレックス インコーポレーテッドMolex Incorporated

    Inventor： NODA ATSUTO ,  SUZUKI TERUHITO ,  NIITSU TOSHIHIRO

    IPC: H01B7/08 ,  H01P3/08 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H01R12/22

    CPC classification number: H01P3/08 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/0715 ,  H05K2201/09681

    Abstract: PROBLEM TO BE SOLVED: To provide a signal transport substrate that is electromagnetically shielded to obtain a much higher degree of freedom when designing a trace pattern or trace width of a signal line and to obtain a much higher degree of freedom also when adjusting a characteristic impedance. SOLUTION: A signal line 20 is provided along a lengthwise direction on one surface of a flat band-like flexible insulating substrate 30, net conductors 50, 60 are laminated for electromagnetically shielding the signal line 20 on both sides of the flexible insulating substrate 30, and meshes 56, 66 of the net conductors 50, 60 are formed at random to comprise a flat flexible cable 10 that is a signal transport substrate. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供电磁屏蔽的信号传输基板，以便在设计信号线的迹线图案或迹线宽度时获得高得多的自由度，并且当调节时获得高得多的自由度 特征阻抗。 解决方案：在扁平带状柔性绝缘基板30的一个表面上沿着长度方向设置信号线20，将导体50,60层压以对软性绝缘体两侧的信号线20进行电磁屏蔽 基板30和网状导体50,60的网孔56,66随机地形成为包括作为信号传输基板的扁平柔性电缆10。 版权所有（C）2005，JPO＆NCIPI

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