公开(公告)号：JP2005022174A

公开(公告)日：2005-01-27

申请号：JP2003188944

申请日：2003-06-30

Applicant: Brother Ind Ltd ,  ブラザー工業株式会社

Inventor： NAMIGATA HIDEKI ,  AOKI HIKOHARU ,  SAKAIDA ATSUO ,  KOBAYASHI KAZUO ,  SUZUKI YOSHIBUMI

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1623 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1626 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2202/20 ,  Y10T29/42 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49401

Abstract: PROBLEM TO BE SOLVED: To surely perform metal-joining of a plurality of metal plates located near a common ink chamber even when the common ink chamber is formed inside. SOLUTION: An upside structure 61 is formed by joining a cavity plate 22, a base plate 23, an aperture plate 24 and a supply plate 25 through diffusion joining. A manifold structure 62 is formed by joining three sheets of manifold plates 26, 27 and 28 through diffusion joining. A downside structure 63 is formed by joining a cover plate 29 and a nozzle plate 30 through diffusion joining. The upside structure 61, manifold structure 62 and downside structure 63 are joined by an adhesive. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：即使在内部形成公共墨水室时，也可以确实地进行位于公共墨水室附近的多个金属板的金属接合。 解决方案：通过扩散接合将腔板22，基板23，孔板24和供给板25接合而形成上侧结构61。 歧管结构62通过通过扩散接合连接三片歧管板26,27和28而形成。 通过扩散接合将盖板29和喷嘴板30接合而形成下侧结构63。 上侧结构61，歧管结构62和下侧结构63通过粘合剂连接。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004288796A

公开(公告)日：2004-10-14

申请号：JP2003077637

申请日：2003-03-20

Applicant: Matsushita Electric Ind Co Ltd ,  松下電器産業株式会社

Inventor： SHIDA SATOSHI ,  KANAYAMA SHINJI ,  ONOBORI SHUNJI ,  HIRATA SHUICHI ,  NAKAO MAMORU ,  OE KUNIO ,  KUKIHARA SATOSHI ,  NARITA MASACHIKA ,  EGASHIRA NOBUTAKA ,  HAJI HIROSHI

IPC: H01L21/00 ,  H05K13/04

CPC classification number: H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

Abstract: PROBLEM TO BE SOLVED: To provide component mounting equipment and a component mounting method which can perform effective component mounting by reducing the influence of the time necessary for supplying bonding auxiliary agent to for component mounting, in component mounting wherein a plurality of projection electrodes formed on the mounting side surface of a component to a substrate are brought into contact with the bonding auxiliary agent, the bonding auxiliary agent is supplied, and the components to which the bonding auxiliary agent has been supplied are mounted on the substrate, when the plurality of components are mounted on the substrate. SOLUTION: The bonding auxiliary agent is supplied to a first component out of the plurality of components, and supply of the bonding auxiliary agent is started to a second component out of the plurality of components until mounting of the first component on the substrate is completed to which component the bonding auxiliary agent has been supplied. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP3513444B2

公开(公告)日：2004-03-31

申请号：JP29813899

申请日：1999-10-20

Applicant: 株式会社新川

Inventor： 一夫 杉浦 ,  博文 諸江

IPC: B23K20/00 ,  H01L21/60 ,  H01L23/485

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/742 ,  H01L2224/78301 ,  H01L2224/85009 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  Y10T29/49149 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

公开(公告)号：JP2004079998A

公开(公告)日：2004-03-11

申请号：JP2003154269

申请日：2003-05-30

Applicant: Kotatsu Kokusai Denshi Kofun Yugenkoshi ,  宏達國際電子股▲ふん▼有限公司

Inventor： YO KUNI

IPC: C22C13/00 ,  B23K3/06 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34

CPC classification number: B23K3/0623 ,  B23K2201/40 ,  H05K3/3478 ,  Y10T29/49149

Abstract: PROBLEM TO BE SOLVED: To provide a sticking device capable of sticking a plurality of solder balls speedily and accurately to corresponding positions of a BGA package to solve problems caused by prior arts. SOLUTION: The sticking device 30 comprises a main board 32 and a fixture. The main board 32 is formed with a plurality of openings 34 for respectively accommodating a plurality of solder balls. The fixture fixes a chip 72 to the lower part of the main board 32. The chip 72 is coated with an adhesive for sticking the solder balls held in the openings 34 to the chip 72. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004063787A

公开(公告)日：2004-02-26

申请号：JP2002220085

申请日：2002-07-29

Applicant: Mitsumi Electric Co Ltd ,  ミツミ電機株式会社

Inventor： NISHIO ATSUSHI ,  KAWASAKI TAKASHI

IPC: H05K1/18 ,  H01L23/32 ,  H04N5/225 ,  H05K3/30

CPC classification number: H04N5/2253 ,  H01R12/7076 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/53178

Abstract: PROBLEM TO BE SOLVED: To increase a working efficiency and a mounting accuracy in mounting a camera module on a substrate. SOLUTION: A method of mounting the camera module on the substrate is provided wherein a connector 14 to assemble the camera module 11 therein is mounted on a printed circuit board 12, and then the camera module 11 is assembled in the connector 14. The connector 14 is mounted on the printed circuit board 12 by automatic reflow mounting. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP3387726B2

公开(公告)日：2003-03-17

申请号：JP8697096

申请日：1996-04-10

Applicant: 松下電器産業株式会社

Inventor： 義則 和田 ,  輝樹 枝廣 ,  浩一 熊谷

IPC: H05K1/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/202 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/10575 ,  H05K2203/0264 ,  H05K2203/063 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T428/24917

公开(公告)号：JP2003506667A

公开(公告)日：2003-02-18

申请号：JP2001501900

申请日：2000-06-06

Applicant: フォームファクター,インコーポレイテッド

Inventor： エスラミィ，モハマド ,  コブ，ハーリー，ディー ,  ペダーセン，デイビッド，ブイ

IPC: G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/66

CPC classification number: G01R31/2886 ,  G01R3/00 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49171 ,  Y10T29/49178 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211

Abstract: (57)【要約】 大面積でエレメントを多数備えたコンタクタの製造方法である。 ウェーハ上の半導体デバイスをテストするために、セグメントコンタクタが提供され、これは基板に対して実装された複数のコンタクタユニットを含む。 コンタクタユニットは形成され、テストされ、支持基板に対して組み付けられる。 コンタクタユニットは、バーンイン基板のような外部機器に対して接続するための、横方向に延びるリードを含むことができる。 コンタクタユニットはパッドのような導電領域を含み、これらはテストされるデバイスの導電端子と接触するように配置される。

公开(公告)号：JP2003009289A

公开(公告)日：2003-01-10

申请号：JP2001185357

申请日：2001-06-19

Applicant: Nippon Dempa Kogyo Co Ltd ,  日本電波工業株式会社

Inventor： KIKUCHI MANABU ,  TAWARA YOSHIHIRO

IPC: A61B8/00 ,  B06B1/06 ,  B06B3/04 ,  H01L41/09 ,  H01L41/22 ,  H01L41/313 ,  H01L41/338 ,  H04R17/00

CPC classification number: B06B1/0629 ,  Y10T29/42 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: PROBLEM TO BE SOLVED: To provide a matrix probe piezoelectric elements of which is prevented from collapsing and to provide its manufacturing method. SOLUTION: The matrix type ultrasonic wave probe comprises a backing member having a 1st pedestal on its surface, a plurality of signal wires that are imbedded in the backing member in a two-dimensional direction and one-side ends of which are exposed on the 1st pedestal, and a plurality of piezoelectric elements fixed onto a conductive adhesive, connected electrically to the signal wires and arranged in a two-dimensional direction. A 2nd pedestal having a through-hole is provided to one major side of the piezoelectric elements opposed to the 1st pedestal, with the configuration and the manufacturing method of the ultrasonic wave probe.

Abstract translation: 要解决的问题：提供一种矩阵探针，其压电元件被防止塌陷并提供其制造方法。 解决方案：矩阵型超声波探头包括在其表面上具有第一基座的背衬构件，多个信号线，其以二维方向嵌入背衬构件中，其一侧端部暴露在第一座 基座和固定到导电粘合剂上的多个压电元件，电连接到信号线并沿二维方向布置。 具有通孔的第二基座通过超声波探头的结构和制造方法设置在与第一基座相对的压电元件的一侧。

公开(公告)号：JPS5963792A

公开(公告)日：1984-04-11

申请号：JP14044483

申请日：1983-07-29

Applicant: Burroughs Corp

Inventor： JIYAAN KUROODO UERI ,  MITSUSHIERU JIEI ,  ANDORE JIYOBU

IPC: B23K11/34 ,  B23K20/00 ,  B23K20/24 ,  H05K1/11 ,  H05K1/14 ,  H05K3/22 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L24/85 ,  B23K11/34 ,  B23K20/005 ,  B23K20/24 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/4809 ,  H01L2224/48096 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K1/116 ,  H05K1/141 ,  H05K3/225 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2203/1115 ,  Y10T29/49124 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49204 ,  Y10T29/49732 ,  Y10T156/1052 ,  Y10T156/1092 ,  Y10T156/1339 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/45099

Abstract: An apparatus in the form of a multilayered pad (P1,P2) is provided which has an adhesive layer (32) over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet (46) of pads into individual pads (P1,P2), placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads (P1,P2) to bond them to the board, and stitching (welding) wire (24) to a succession of pads (p1,P2) to complete a series of new connections. Some pads (P1) include plated-through-holes (40) enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.

公开(公告)号：JP2018125297A

公开(公告)日：2018-08-09

申请号：JP2018076496

申请日：2018-04-12

Applicant: モレックス エルエルシー

Inventor： スコット ディー ソマーズ ,  ケント イー レグニール ,  マイケル アール カマラウスカス ,  エマニュエル ジー バナキス ,  ガレン エフ フロム

IPC: H01R13/6471

CPC classification number: H05K3/00 ,  H01R12/57 ,  H01R12/707 ,  H01R12/725 ,  H01R13/658 ,  H01R23/6873 ,  Y10T29/49149

Abstract: 【課題】端子をより密に実装し、且つ、入出力のデータチャネルがより高い周波数で機能するコネクタを提供する。 【解決手段】基板取付型コネクタはシールド124及び舌状部122aを有する絶縁性ハウジングを有し、端子T1〜T19はハウジングによって2列に支持され、列は嵌(かん)合面から基板取付面まで延在しており、端子は表面実装技術によって0.4〔mm〕ピッチで2列に基板に取付けられ、2列の端子は嵌合面から取付面まで延在する三角端子配置を有するように接地三角構成で構成されている。 【選択図】図10