公开(公告)号：US20110234342A1

公开(公告)日：2011-09-29

申请号：US12836265

申请日：2010-07-14

Applicant: CheolGi Kim ,  Sarella Ananda Kumar

Inventor： CheolGi Kim ,  Sarella Ananda Kumar

IPC: H01F13/00

CPC classification number: B03C1/253 ,  B03C2201/26

Abstract: Disclosed is a magnetic force generator for controlling an external magnetic field to magnetize a micro magnetic device and a microbead; the micro magnetic device for generating an internal magnetic field when magnetized by the external magnetic field, and controlling movement of the microbead according to a direction of magnetization; and the microbead which immobilizes a biomolecule on a surface thereof and of which movement is controlled by the internal magnetic field generated as the micro magnetic device is magnetized.

Abstract translation: 公开了一种用于控制外部磁场以磁化微型磁性装置和微珠的磁力发生器; 用于在被外部磁场磁化时产生内部磁场并根据磁化方向控制微珠的移动的微型磁性装置; 以及将生物分子固定在其表面上的微珠，其运动由微磁性装置被磁化而产生的内部磁场控制。

公开(公告)号：US20090015256A1

公开(公告)日：2009-01-15

申请号：US11807108

申请日：2007-05-24

Applicant: Paul A. Bottomley ,  Ananda Kumar

Inventor： Paul A. Bottomley ,  Ananda Kumar

IPC: G01R33/483

CPC classification number: G01R33/3415 ,  G01R33/3678

Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer ≧1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about nλ/4, where n is an integer ≧1 and λ is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract translation: 特色是用于激发核的NMR或MRI信号以及相关设备，系统和方法的设备。 该器件包括带状阵列天线，其包括一个或多个导体和N个无功调谐组件，其中N是整数> = 1，N个无功分量中的至少一个电耦合到一个或多个导体中的每一个以及接地 /虚拟地面。 导体的表观电长度用无功调谐分量调谐，因此它等于大约为nλ/ 4，其中n为≥1的整数，λ为待检测信号的波长。 条的长度也基本上在感兴趣深度的1.3倍的近似范围内。 带状导体也与环形线圈组合以形成正交检测器。

公开(公告)号：US20080093424A1

公开(公告)日：2008-04-24

申请号：US11929539

申请日：2007-10-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: B29C65/00 ,  B23K35/12

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

公开(公告)号：US20080050524A1

公开(公告)日：2008-02-28

申请号：US11733195

申请日：2007-04-09

Applicant: Ananda Kumar ,  Jorge Albarran ,  Adam Cohen ,  Kieun Kim ,  Michael Lockard ,  Uri Frodis ,  Dennis Smalley

Inventor： Ananda Kumar ,  Jorge Albarran ,  Adam Cohen ,  Kieun Kim ,  Michael Lockard ,  Uri Frodis ,  Dennis Smalley

IPC: B05D1/38 ,  B05D3/00

CPC classification number: B81C1/00666 ,  C25D5/022

Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

公开(公告)号：US20070238978A1

公开(公告)日：2007-10-11

申请号：US11761561

申请日：2007-06-12

Applicant: Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

Inventor： Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

IPC: A61B5/05

CPC classification number: G01R33/287 ,  A61B5/055 ,  A61B10/0275 ,  A61B34/20 ,  A61B2034/2051 ,  A61B2090/374 ,  A61B2090/3958 ,  G01R33/34084 ,  G01R33/341 ,  G01R33/3628 ,  G01R33/3657

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract translation: 这里公开了一种磁共振成像天线，其包括内部导体，可相对于内部导体可滑动地移位的外部屏蔽，以及将内部导体与外部屏蔽电绝缘的绝缘体。 本文公开了一种活检针状天线，包括具有外屏蔽的磁共振成像天线和通过电介质与外屏蔽电绝缘的内导体; 以及活组织检查针，其电连接到所述内部导体并且通过所述电介质与所述外部屏蔽层电绝缘。 本文公开了一种获得具有磁共振成像引导的样本的方法，包括提供采样针磁共振成像天线，将天线推进到要从其获取样本的结构，通过天线检测磁共振数据，以及耦合 样品到天线。

公开(公告)号：US07236816B2

公开(公告)日：2007-06-26

申请号：US10131601

申请日：2002-04-24

Applicant: Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

Inventor： Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

IPC: A61B5/055

CPC classification number: G01R33/287 ,  A61B5/055 ,  A61B10/0275 ,  A61B34/20 ,  A61B2034/2051 ,  A61B2090/374 ,  A61B2090/3958 ,  G01R33/34084 ,  G01R33/341 ,  G01R33/3628 ,  G01R33/3657

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract translation: 这里公开了一种磁共振成像天线，其包括内部导体，可相对于内部导体可滑动地移位的外部屏蔽，以及将内部导体与外部屏蔽电绝缘的绝缘体。 本文公开了一种活检针状天线，包括具有外屏蔽的磁共振成像天线和通过电介质与外屏蔽电绝缘的内导体; 以及活组织检查针，其电连接到所述内部导体并且通过所述电介质与所述外部屏蔽层电绝缘。 本文公开了一种获得具有磁共振成像引导的样本的方法，包括提供采样针磁共振成像天线，将天线推进到要从其获取样本的结构，通过天线检测磁共振数据，以及耦合 样品到天线。

公开(公告)号：US20050215023A1

公开(公告)日：2005-09-29

申请号：US11029221

申请日：2005-01-03

Applicant: Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

Inventor： Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

IPC: G01R31/02 ,  H01L21/20

CPC classification number: G01R1/06716 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/0483 ,  G01R1/07357 ,  G01R31/2886

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

公开(公告)号：US5209817A

公开(公告)日：1993-05-11

申请号：US748445

申请日：1991-08-22

Applicant: Umar M. Ahmad ,  Daniel G. Berger ,  Ananda Kumar ,  Susan J. LaMaire ,  Keshav B. Prasad ,  Sudipta K. Ray ,  Kwong H. Wong

Inventor： Umar M. Ahmad ,  Daniel G. Berger ,  Ananda Kumar ,  Susan J. LaMaire ,  Keshav B. Prasad ,  Sudipta K. Ray ,  Kwong H. Wong

IPC: H01L23/498 ,  H01L23/522 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4644 ,  H01L23/49827 ,  H01L23/5226 ,  H05K3/4605 ,  H05K3/465 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2203/0597 ,  H05K2203/072 ,  H05K3/0023 ,  H05K3/061 ,  H05K3/108 ,  H05K3/184 ,  H05K3/388 ,  H05K3/4661

Abstract: In a multi-level wiring structure wires and vias are formed by an isotropic deposition of a conductive material, such as copper, on a dielectric base, such as a polyimide. In a preferred embodiment of the invention copper is electroplated to a thin seed conducting layer deposited on the surface of the dielectric base in which via openings have been formed. Openings in a resist formed on the surface of the dielectric base over the seed layer forms a pattern defining the wiring and via conductor features. Electroplated copper fills the via openings and wire pattern openings in the resist isotropically so that the upper surfaces of the wiring and vias are co-planar when the plating step is complete. In adding subsequent wiring levels, the resist is removed and the via conductor and wiring pattern covered with another dielectric layer which both encapsulates the conductors of the previous layer and serves as the base for the next level which is formed in the same manner as the previous level.

Abstract translation: 在多层布线结构中，通过诸如铜之类的导电材料的各向同性的沉积，形成导线和通孔，在诸如聚酰亚胺的电介质基底上。 在本发明的一个优选实施例中，将铜电镀到沉积在已经形成通孔开口的电介质基底的表面上的薄种子传导层。 在种子层上形成在电介质基底表面上的抗蚀剂中的开口形成限定布线和通孔导体特征的图案。 电镀铜在各向同性地填充抗蚀剂中的通孔开口和线图案开口，使得当电镀步骤完成时，布线和通孔的上表面是共面的。 在添加其后的布线层次时，去除抗蚀剂，并且通孔导体和布线图案被另一个介电层覆盖，该介质层既封装了前一层的导体并用作下一层的基底，其形成方式与前述 水平。

公开(公告)号：US07816918B2

公开(公告)日：2010-10-19

申请号：US11807108

申请日：2007-05-24

Applicant: Paul A. Bottomley ,  Ananda Kumar

Inventor： Paul A. Bottomley ,  Ananda Kumar

IPC: G01V3/00

CPC classification number: G01R33/3415 ,  G01R33/3678

Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer ≧1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about nλ/4, where n is an integer ≧1 and λ is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract translation: 特色是用于激发核的NMR或MRI信号以及相关设备，系统和方法的设备。 该装置包括带状阵列天线，其包括一个或多个导体和N个非反应调谐组件，其中N是整数≥1，N个无功分量中的至少一个电耦合到一个或多个导体中的每一个以及接地/ 虚拟地面。 导体的表观电长度用无功调谐分量进行调谐，因此等于大约nλ/ 4，其中n是整数≧1，λ是待检测信号的波长。 条的长度也基本上在感兴趣深度的1.3倍的近似范围内。 带状导体也与环形线圈组合以形成正交检测器。

公开(公告)号：US20060226015A1

公开(公告)日：2006-10-12

申请号：US11325405

申请日：2006-01-03

Applicant: Dennis Smalley ,  Adam Cohen ,  Ananda Kumar ,  Michael Lockard

Inventor： Dennis Smalley ,  Adam Cohen ,  Ananda Kumar ,  Michael Lockard

IPC: C25D5/02

CPC classification number: A61N1/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  H05K3/467 ,  H05K3/4682

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least-portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.

Abstract translation: 用于生产多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层，包括用于提供绝缘材料的涂层的操作，所述介电材料的涂层隔离第一导电材料的至少一部分 从（1）第一导电材料的其他部分，（2）第二导电材料或（3）另一种介电材料，并且其中电介质涂层的厚度与用于形成结构的层的厚度相比较薄 。 在一些优选实施例中，每个单独层的部分被电介质材料包封，而在其它实施例中，材料的不同区域之间的边界通过电介质屏障彼此隔离。