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    Monitoring of electroplating additives
    2.
    发明申请
    Monitoring of electroplating additives 有权
    电镀添加剂监测

    公开(公告)号：US20110025338A1

    公开(公告)日：2011-02-03

    申请号：US12462354

    申请日：2009-08-03

    Applicant: Mark J. Willey ,  Lian Guo ,  Steven T. Mayer

    Inventor： Mark J. Willey ,  Lian Guo ,  Steven T. Mayer

    IPC: G01N27/06

    CPC classification number: G01N27/42

    Abstract: The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by flowing a preconditioning electroplating solution with preconditioner species through the flow channel while applying a negative potential. Flow of liquid through the flow channel is rapidly switched from preconditioning solution to a target solution containing an organic target solute to be measured. The transient response of the system resulting from exposure of the working electrode to organic target solute is detected by measuring current density during an initial transient time period. An unknown concentration of target solute is determined by comparing the transient response with one or more transient responses characteristic of known concentrations. A preferred measuring system is operable to switch flow from preconditioning solution to target solution in about 200 milliseconds or less.

    Abstract translation: 通过电流检测单元的流动通道中的工作电极通过在施加负电位的情况下通过流动通道流动具有预调节剂种类的预处理电镀溶液来预处理。 通过流动通道的液体流从预处理溶液快速切换到含有待测量的有机靶溶质的目标溶液。 通过在初始瞬变时间段内测量电流密度来检测由工作电极暴露于有机靶溶质而产生的系统的瞬态响应。 通过将瞬态响应与已知浓度特征的一个或多个瞬态响应进行比较来确定目标溶质浓度未知。 优选的测量系统可操作以在大约200毫秒或更短的时间内将流从预处理溶液切换到目标溶液。

    Through silicon via filling using an electrolyte with a dual state inhibitor
    4.
    发明授权
    Through silicon via filling using an electrolyte with a dual state inhibitor 有权
    通过使用具有双重状态抑制剂的电解质填充硅

    公开(公告)号：US08992757B2

    公开(公告)日：2015-03-31

    申请号：US13110488

    申请日：2011-05-18

    Applicant: Mark J. Willey ,  Steven T. Mayer

    Inventor： Mark J. Willey ,  Steven T. Mayer

    IPC: C25D3/38 ,  H01L21/768 ,  H01L21/288 ,  C25D7/12 ,  C25D5/02

    CPC classification number: C25D3/38 ,  C25D5/022 ,  C25D7/123 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76879 ,  H01L21/76898 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method for electrofilling large, high aspect ratio recessed features with copper without depositing substantial amounts of copper in the field region is provided. The method allows completely filling recessed features having aspect ratios of at least about 5:1 such as at least about 10:1, and widths of at least about 1 μm in a substantially void-free manner without depositing more than 5% of copper in the field region (relative to the thickness deposited in the recessed feature). The method involves contacting the substrate having one or more large, high aspect ratio recessed features (such as a TSVs) with an electrolyte comprising copper ions and an organic dual state inhibitor (DSI) configured for inhibiting copper deposition in the field region, and electrodepositing copper under potential-controlled conditions, where the potential is controlled not exceed the critical potential of the DSI.

    Abstract translation: 提供了一种用于电镀大量，高纵横比的凹陷特征与铜而不在现场区域中沉积大量铜的方法。 该方法允许以基本无空隙的方式完全填充具有至少约5:1的纵横比（例如至少约10:1）和至少约1μm的宽度的凹陷特征，而不沉积超过5％的铜 场区域（相对于沉积在凹陷特征中的厚度）。 该方法包括将具有一个或多个大的，高纵横比的凹陷特征（例如TSV）的基底与包含铜离子的电解质和被配置用于抑制场区中的铜沉积的有机双态抑制剂（DSI）接触，以及电沉积 在电势控制条件下，电位控制的铜不超过DSI的临界电位。

    Systems and methods for monitoring plating and etching baths
    6.
    发明授权
    Systems and methods for monitoring plating and etching baths 失效
    用于监测电镀和蚀刻浴的系统和方法

    公开(公告)号：US08475642B2

    公开(公告)日：2013-07-02

    申请号：US11867399

    申请日：2007-10-04

    Applicant: Alan C. West ,  Mark J. Willey ,  Robert J. von Gutfeld

    Inventor： Alan C. West ,  Mark J. Willey ,  Robert J. von Gutfeld

    IPC: G01N27/416 ,  G01N27/403

    CPC classification number: G01N27/42

    Abstract: Methods and systems for monitoring electrolyte bath fluids are provided. The electrolyte bath fluids can be electroplating, electroless plating or etching solutions. The monitoring systems employ microfluidic devices, which have built in microfluidic channels and microfabricated thin-film electrodes. The devices are configured with fluid pumps to control the movement and mixing of test fluids through the microfluidic channels. The microfabricated thin-film electrodes are configured so that the plating or etching bath fluid composition can be characterized by electrochemical measurements. The monitoring methods and system provide faster measurement times, generate minimal waste, and occupy dramatically reduced physical space compared to conventional bath-monitor systems. The monitoring systems and method also provide low-cost system and methods for measuring or monitoring electroless plating bath rates.

    Abstract translation: 提供了用于监测电解液液体的方法和系统。 电解液液体可以是电镀，无电镀或蚀刻溶液。 监测系统采用微流体装置，其内置微流体通道和微细的薄膜电极。 这些装置配置有流体泵，以控制测试流体通过微流体通道的移动和混合。 微制造的薄膜电极被配置为使得电镀或蚀刻浴液组合物可以通过电化学测量来表征。 监测方法和系统提供更快的测量时间，产生最少的浪费，并且与传统的浴室监视系统相比，占据显着减少的物理空间。 监测系统和方法还提供了用于测量或监测化学镀浴率的低成本系统和方法。

    Monitoring of electroplating additives
    7.
    发明授权
    Monitoring of electroplating additives 有权
    电镀添加剂监测

    公开(公告)号：US08372258B2

    公开(公告)日：2013-02-12

    申请号：US12462354

    申请日：2009-08-03

    Applicant: Mark J. Willey ,  Lian Guo ,  Steven T. Mayer

    Inventor： Mark J. Willey ,  Lian Guo ,  Steven T. Mayer

    IPC: C25D21/14 ,  G01N27/42

    CPC classification number: G01N27/42

    Abstract: The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by flowing a preconditioning electroplating solution with preconditioner species through the flow channel while applying a negative potential. Flow of liquid through the flow channel is rapidly switched from preconditioning solution to a target solution containing an organic target solute to be measured. The transient response of the system resulting from exposure of the working electrode to organic target solute is detected by measuring current density during an initial transient time period. An unknown concentration of target solute is determined by comparing the transient response with one or more transient responses characteristic of known concentrations. A preferred measuring system is operable to switch flow from preconditioning solution to target solution in about 200 milliseconds or less.

    Abstract translation: 通过电流检测单元的流动通道中的工作电极通过在施加负电位的情况下通过流动通道流动具有预调节剂种类的预处理电镀溶液来预处理。 通过流动通道的液体流从预处理溶液快速切换到含有待测量的有机靶溶质的目标溶液。 通过在初始瞬变时间段内测量电流密度来检测由工作电极暴露于有机靶溶质而产生的系统的瞬态响应。 通过将瞬态响应与已知浓度特征的一个或多个瞬态响应进行比较来确定目标溶质浓度未知。 优选的测量系统可操作以在大约200毫秒或更短的时间内将流从预处理溶液切换到目标溶液。

    BY-PRODUCT MITIGATION IN THROUGH-SILICON-VIA PLATING
    8.
    发明申请
    BY-PRODUCT MITIGATION IN THROUGH-SILICON-VIA PLATING 审中-公开
    通过硅酸盐的副产物减少

    公开(公告)号：US20120064462A1

    公开(公告)日：2012-03-15

    申请号：US13229615

    申请日：2011-09-09

    Applicant: Mark J. WILLEY ,  Hyosang LEE

    Inventor： Mark J. WILLEY ,  Hyosang LEE

    IPC: C25D3/38 ,  G03F7/20 ,  C25B15/02 ,  C25D5/54 ,  C25D5/34

    CPC classification number: H01L21/76898 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  H01L21/2885

    Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 10 parts per million or less of an accelerator and about 300 parts per million or less of a suppressor. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is then electroplated onto the wafer substrate in the plating cell.

    Abstract translation: 描述了用具有低氧浓度的电镀液将金属电镀到工件上的方法，系统和装置。 在一个方面，一种方法包括降低电镀溶液的氧浓度。 电镀溶液包含约10ppm或更少的促进剂，约300ppm或更少的抑制剂。 在降低电镀液的氧浓度后，将晶片基板与电镀液中的电镀液接触。 电镀液中电镀液的氧浓度约为百万分之一以下。 然后将金属电镀到电镀单元中的晶片衬底上。

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