公开(公告)号：US08226400B2

公开(公告)日：2012-07-24

申请号：US12656057

申请日：2010-01-14

申请人： Susumu Matsuoka ,  Seiichi Inoue ,  Haremi Ito ,  Keiji Matsumoto

发明人： Susumu Matsuoka ,  Seiichi Inoue ,  Haremi Ito ,  Keiji Matsumoto

IPC分类号： B29C47/12

CPC分类号： C23C18/1644 ,  B01J35/04 ,  B28B3/26 ,  B28B3/269 ,  B29C47/0028 ,  B29C47/0852 ,  B29C47/12 ,  B29L2031/60 ,  C23C16/045 ,  C23C16/32 ,  C23C18/165

摘要： A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 μm, wherein the surface layer is made up of tungsten carbide particles which are 5 μm or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

摘要翻译： 一种用于挤出成型蜂窝结构的模具，包括：模具基座，设置有陶瓷熔池引入孔和与陶瓷熔池引入孔连通的狭缝; 以及大致限定狭缝的最终宽度的基底层以及形成在模座上的缝隙的最终宽度的表面层，使得狭缝的最终宽度为15〜200 μm，其中表面层由平均粒径为5μm以下且含有W3C为主要成分的碳化钨颗粒构成。 根据本发明，提供了一种用于挤压成形蜂窝结构的模具，其能够抑制挤出成型时引起的挤压成形速度的波动，挤压成形时的挤压成形速度的波动非常小， 在生产率和耐久性方面都是优越的。

公开(公告)号：US08115109B2

公开(公告)日：2012-02-14

申请号：US12427991

申请日：2009-04-22

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

IPC分类号： H05K1/11

CPC分类号： H05K3/361 ,  H01L2224/11003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/01019 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/167 ,  Y10T29/49126

摘要： A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

摘要翻译： 其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路​​板，电线的端面（36b）位于从接头的端部撤出的位置 第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W） 与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

公开(公告)号：US20090032285A1

公开(公告)日：2009-02-05

申请号：US11814698

申请日：2005-01-27

申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

公开(公告)号：US07384258B2

公开(公告)日：2008-06-10

申请号：US11174657

申请日：2005-07-06

申请人： Hiroshi Kuwahara ,  Susumu Matsuoka ,  Takao Saito

发明人： Hiroshi Kuwahara ,  Susumu Matsuoka ,  Takao Saito

IPC分类号： B29C47/12

CPC分类号： B23P15/243 ,  B28B3/269 ,  B28B7/346 ,  C23C16/26 ,  C23C16/32 ,  Y10T29/49861 ,  Y10T29/49885

摘要： There is disclosed a die 1 for forming a honeycomb structure comprises: a plate-like die substrate 2 having at least two surfaces 8, 9, in which back holes 3 for introducing a green material are formed in one surface 8, and slits 4 communicating with back holes 3 are formed in the other surface 9; an underlayer 5 disposed on the substrate 2 so as to coat at least a part of a portion constituting the back hole 3 and the slit 4; an intermediate layer 6 disposed so as to coat at least a part of the underlayer 5 and constituted of tungsten carbide particles whose average particle diameter is 5 μm or less and containing W3C as a main component; and a surface layer 7 disposed so as to coat at least a part of the intermediate layer 6 and constituted of diamond and/or diamond-like carbon.

摘要翻译： 公开了一种用于形成蜂窝结构的模具1，其包括：板状模具基板2，其具有至少两个表面8,9，其中在一个表面8中形成用于引入生坯的后孔3，以及沟槽4 后孔3形成在另一个表面9中; 设置在基板2上以便涂覆构成后孔3和狭缝4的部分的至少一部分的底层5; 中间层6，其设置为涂覆底层5的至少一部分，由平均粒径为5μm以下并含有W 3 C的碳化钨颗粒构成为主要成分; 以及设置成涂覆中间层6的至少一部分并由金刚石和/或类金刚石碳构成的表面层7。

公开(公告)号：US06518514B2

公开(公告)日：2003-02-11

申请号：US09928869

申请日：2001-08-13

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01R1204

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

公开(公告)号：US5862839A

公开(公告)日：1999-01-26

申请号：US787713

申请日：1997-01-24

申请人： Chihiro Nakamura ,  Kiyohiko Kitagawa ,  Takafumi Kaneda ,  Susumu Matsuoka ,  Tsukasa Hashimoto ,  Tomoya Maeda

发明人： Chihiro Nakamura ,  Kiyohiko Kitagawa ,  Takafumi Kaneda ,  Susumu Matsuoka ,  Tsukasa Hashimoto ,  Tomoya Maeda

IPC分类号： B01D19/00 ,  G02F1/1341 ,  B65B31/02

CPC分类号： G02F1/1341

摘要： A liquid crystal material filling apparatus which includes, in a vacuum chamber, a liquid crystal pot having a liquid crystal reservoir for storing a liquid crystal material. A groove part is coupled with the liquid crystal reservoir at a certain angle and contains a medium for holding the liquid crystal material. A filling jig cassette is provided to accommodate a plurality of liquid crystal panels having injection ports faced downwardly, and an elevation device is provided for moving the liquid crystal pot up and down. Also, a posture control mechanism is provided for switching a posture of the liquid crystal pot in accordance with the up/down movement of the liquid crystal pot thereby to cause the liquid crystal material to flow from the liquid crystal reservoir to the groove part at a raised position and bring the medium in touch with lower faces of the injection ports of the liquid crystal panels.

摘要翻译： 一种液晶材料填充装置，在真空室中包括具有用于储存液晶材料的液晶容器的液晶罐。 槽部与液晶储存器以一定角度联接，并且包含用于保持液晶材料的介质。 提供填充夹具盒以容纳多个具有面向下的注射口的液晶面板，并且提供用于上下移动液晶罐的升降装置。 此外，提供了一种姿势控制机构，用于根据液晶盒的上/下移动来切换液晶罐的姿势，从而使液晶材料从液晶容器流到槽部分 使介质与液晶面板的注入口的下表面接触。

公开(公告)号：US5229915A

公开(公告)日：1993-07-20

申请号：US928665

申请日：1992-08-17

申请人： Chihiro Ishibashi ,  Hiroyuki Abe ,  Susumu Matsuoka

发明人： Chihiro Ishibashi ,  Hiroyuki Abe ,  Susumu Matsuoka

IPC分类号： H01L23/427

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L2924/0002

摘要： A power semiconductor device such as power thyristor including a semiconductor substrate which is clamped by first and second conductive members serving as the electrodes as well as heat sinks, and a plurality of heat pipes whose ends are inserted directly into the conductive members. A plurality of semiconductor substrates and temperature compensating plates are alternatively stacked on another and conductive members are provided on outermost temperature compensating plates to form an assembly. The assembly is hermetically sealed by an insulating package formed by an insulator having a corrugated outer surface such that outer surfaces of the conductive members are exposed out of the package. One or more heat pipes are inserted into the insulating package such that electrically insulating cooling medium filled in the heat pipes can be in direct contact with the semiconductor substrates. The heat pipes may be inserted into the conductive members or heat sinks provided in the assembly.

摘要翻译： 功率半导体装置，例如功率晶闸管，其包括被用作电极的第一和第二导电构件以及散热器夹持的半导体衬底，以及多个热管，其端部直接插入到导电构件中。 多个半导体衬底和温度补偿板交替堆叠在另一个上，并且导电构件设置在最外面的温度补偿板上以形成组件。 组件通过由具有波纹状外表面的绝缘体形成的绝缘封装气密地密封，使得导电构件的外表面暴露于封装外。 一个或多个热管被插入到绝缘包装中，使得填充在热管中的电绝缘的冷却介质可以与半导体衬底直接接触。 热管可以插入设置在组件中的导电构件或散热器中。

公开(公告)号：US20100119640A1

公开(公告)日：2010-05-13

申请号：US12656057

申请日：2010-01-14

申请人： Susumu Matsuoka ,  Seiichi Inoue ,  Haremi Ito ,  Keiji Matsumoto

发明人： Susumu Matsuoka ,  Seiichi Inoue ,  Haremi Ito ,  Keiji Matsumoto

IPC分类号： B29C47/30

CPC分类号： C23C18/1644 ,  B01J35/04 ,  B28B3/26 ,  B28B3/269 ,  B29C47/0028 ,  B29C47/0852 ,  B29C47/12 ,  B29L2031/60 ,  C23C16/045 ,  C23C16/32 ,  C23C18/165

摘要： A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 μm, wherein the surface layer is made up of tungsten carbide particles which are 5 μm or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

摘要翻译： 一种用于挤出成型蜂窝结构的模具，包括：模具基座，设置有陶瓷熔池引入孔和与陶瓷熔池引入孔连通的狭缝; 以及大致限定狭缝的最终宽度的基底层以及形成在模座上的缝隙的最终宽度的表面层，使得狭缝的最终宽度为15〜200 μm，其中表面层由平均粒径为5μm以下且含有W3C为主要成分的碳化钨颗粒构成。 根据本发明，提供了一种用于挤压成形蜂窝结构的模具，其能够抑制挤出成型时引起的挤压成形速度的波动，挤压成形时的挤压成形速度的波动非常小， 在生产率和耐久性方面都是优越的。

公开(公告)号：US20090266592A1

公开(公告)日：2009-10-29

申请号：US12427991

申请日：2009-04-22

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

IPC分类号： H05K1/02 ,  H05K3/36

CPC分类号： H05K3/361 ,  H01L2224/11003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/01019 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/167 ,  Y10T29/49126

摘要： A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

摘要翻译： 其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路​​板，电线的端面（36b）位于从接头的端部撤出的位置 第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W） 与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

公开(公告)号：US20090229120A1

公开(公告)日：2009-09-17

申请号：US12280907

申请日：2007-02-22

申请人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

发明人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

IPC分类号： H05K3/00 ,  B23P19/00

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0776 ,  H05K2203/087 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/532 ,  Y10T29/53204 ,  H01L2924/00

摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线基板31的电极32上形成凸块19的方法中，将含有导电粒子16和气泡生成剂的流体14供给到布线基板31上的包含电极32的第一区域17上。然后， 40具有与第一区域17具有相同面积并形成在具有比第一区域17的面积大的面积的基板40的主表面18上的突出表面13，使得突出表面13面向 然后，流体14被加热，从包含在流体14中的气泡发生剂产生气泡30。