公开(公告)号：US20120175788A1

公开(公告)日：2012-07-12

申请号：US13427085

申请日：2012-03-22

申请人： Takao OCHI

发明人： Takao OCHI

IPC分类号： H01L23/498

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The heat dissipation capability of a mounted semiconductor element can be improved, and the flexibility of circuit design of the semiconductor element and a circuit board and the productivity of the semiconductor element during a mounting step can be improved. A semiconductor element 1 and a circuit board 3 are arranged so that while the first main surfaces 1a and 3a of the semiconductor element 1 and the circuit board 3 face in the same direction and side surfaces 1c and 3c of the semiconductor element 1 and the circuit board 3 face each other, the connection electrode 2 and the electrode pad 4 are connected together. The first main surfaces 1a and 3a of the semiconductor element 1 and the circuit board 3 are covered with an encapsulation resin 7.

摘要翻译： 可以提高安装的半导体元件的散热能力，并且可以提高在安装步骤期间半导体元件和电路板的电路设计的灵活性和半导体元件的生产率。 半导体元件1和电路板3被布置成使得半导体元件1的第一主表面1a和3a与电路板3在半导体元件1的相同方向和侧表面1c和3c处面对，并且电路 板3彼此面对，连接电极2和电极焊盘4连接在一起。 半导体元件1的第一主表面1a和3a和电路板3被封装树脂7覆盖。

公开(公告)号：US06905912B2

公开(公告)日：2005-06-14

申请号：US10407185

申请日：2003-04-07

申请人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

发明人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/98 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18 ,  H01L21/44 ,  H01L21/50

CPC分类号： H05K1/186 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

摘要翻译： 半导体芯片安装在基板的第一表面上，该基板具有形成在第一表面上的布线，使得半导体芯片的电路形成表面面向基板的第一表面，并且设置在电路形成表面上的电极是 与接线连接。 然后在基板的第一表面上形成密封树脂层以覆盖半导体芯片。 密封树脂层和半导体芯片从与电路形成表面相对的表面开始研磨以使半导体芯片变薄。

公开(公告)号：US5708293A

公开(公告)日：1998-01-13

申请号：US777495

申请日：1996-12-30

申请人： Takao Ochi ,  Hisashi Funakoshi ,  Ichiro Okumura ,  Hajime Honma ,  Keiji Okuma ,  Keiichi Fujimoto

发明人： Takao Ochi ,  Hisashi Funakoshi ,  Ichiro Okumura ,  Hajime Honma ,  Keiji Okuma ,  Keiichi Fujimoto

IPC分类号： H01L23/28 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49551 ,  H01L23/49503 ,  H01L23/4951 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079

摘要： In a unit part of a lead frame for mounting a semiconductor chip, connecting leads and supporting leads extending from a lead frame main body toward a semiconductor chip mounting region are formed. Between each supporting lead and the lead frame main body, a movable part and a spring part for elastically supporting the movable part are disposed. The tip portion of the supporting lead connected with the movable part extends to the inside of the semiconductor chip mounting region in the natural state of the movable part, so that the tip portion butts against the side face of a semiconductor chip when the semiconductor chip is mounted. Thus, the semiconductor chip can be supported and fixed by using a bias force applied by the spring part. The base portions of the supporting leads, the movable part and the spring part do not remain in a package, and hence do not cause a stress in the package and do not increase the volume of the package. Thus, the invention provides a lead frame for forming a LOC package with high reliability which can contain a semiconductor chip having a large area within a regulated volume.

摘要翻译： 在用于安装半导体芯片的引线框架的单位部分中，形成从引线框架主体朝向半导体芯片安装区域延伸的连接引线和支撑引线。 在每个支撑引线和引线框架主体之间设置有用于弹性地支撑可动部件的可动部件和弹簧部件。 与可动部连接的支撑引线的前端部在可动部的自然状态下延伸到半导体芯片安装区域的内部，使得当半导体芯片为半导体芯片时，前端部抵靠半导体芯片的侧面 安装。 因此，可以通过使用由弹簧部分施加的偏压力来支撑和固定半导体芯片。 支撑引线，可动部分和弹簧部分的基部不保持在包装中，因此不会在包装中引起应力，并且不增加包装的体积。 因此，本发明提供了一种用于形成具有高可靠性的LOC封装的引线框架，其可以包含在调节体积内具有大面积的半导体芯片。

公开(公告)号：US08039941B2

公开(公告)日：2011-10-18

申请号：US12423532

申请日：2009-04-14

申请人： Takao Ochi

发明人： Takao Ochi

IPC分类号： H01L23/06

CPC分类号： H01L23/49833 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.

摘要翻译： 半导体器件包括：元件安装构件，包括第一电极; 安装在所述元件安装构件上并包括第二电极的半导体元件; 以及安装在所述元件安装构件上的插入元件，所述插入器元件的所述第一侧面朝向所述半导体元件的一侧。 所述中介层元件是平面图中的三角形和梯形形状之一，并且包括：通过第一线电连接到所述第二电极的第一插入电极; 电连接到第一电极的第二插入电极; 以及将第一插入电极和第二插入电极彼此电连接的内部互连。

公开(公告)号：US07882957B2

公开(公告)日：2011-02-08

申请号：US11210866

申请日：2005-08-25

申请人： Takao Ochi

发明人： Takao Ochi

IPC分类号： B65D85/00 ,  B65D21/00 ,  B65D85/62

CPC分类号： H01L21/67333 ,  B65D1/36 ,  B65D21/0233 ,  B65D2585/86

摘要： An object of the present invention is to provide a storing tray and a storing device whereby an object such as an electronic component to be stored can be picked up in a preferred manner and a plurality of stored objects can be flipped and transferred at once. Another object is to form the storing tray as a soft tray. The storing tray includes a storing part on its main surface, the storing part including a storing base for placing therein an object such as an electronic component, a plurality of convex portions formed along the outer periphery of the storing base to protrude upward more than the storing base, and concave portions formed along the outer periphery of the storing base between the plurality of convex portions to be recessed downward more than the storing base. The storing tray has an uneven back surface opposite in shape to the main surface.

摘要翻译： 本发明的目的是提供一种存储托盘和存储装置，由此可以以优选的方式拾取诸如要存储的电子部件的对象，并且可以一次翻转和传送多个存储的对象。 另一个目的是形成作为软盘的存放托盘。 存储托盘包括在其主表面上的存储部分，该存储部分包括用于放置诸如电子部件的物体的存储基座，沿着存储基座的外周形成的多个凸部向上突出多于 存储基座和沿着存储基座的外周形成的多个凸部之间的凹部比存储基座向下凹陷。 储存托盘具有与主表面相反形状的不平坦的后表面。

公开(公告)号：US07482701B2

公开(公告)日：2009-01-27

申请号：US11812154

申请日：2007-06-15

申请人： Tetsuo Ito ,  Takayuki Yoshida ,  Toshiyuki Fukuda ,  Takao Ochi

发明人： Tetsuo Ito ,  Takayuki Yoshida ,  Toshiyuki Fukuda ,  Takao Ochi

IPC分类号： H01L23/28

CPC分类号： H01L21/565 ,  B29C45/14655 ,  B29C45/2708 ,  B29C45/34 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753

摘要： A production equipment includes a substrate 2 placed inside and having a plurality of semiconductor elements 3 mounted thereon, and a resin molding mold 20 having a cavity 21. The mold 20 has resin injection ports 29a and air release ports 30a. Each of the resin injection ports 29a is formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element 3. Each of the air release ports 30a is formed around each of the resin injection ports 29a.

摘要翻译： 制造设备包括放置在内部并具有安装在其上的多个半导体元件3的基板2和具有空腔21的树脂模制件20.模具20具有树脂注入口29a和空气释放口30a。 每个树脂注入口29a与相应的半导体元件3相关联地形成在模具中的空腔的顶表面部分中。每个空气释放口30a围绕每个树脂注入口29a形成。

公开(公告)号：US07268417B2

公开(公告)日：2007-09-11

申请号：US10420985

申请日：2003-04-22

申请人： Takao Ochi ,  Takashi Takata

发明人： Takao Ochi ,  Takashi Takata

IPC分类号： H01L23/02 ,  H01L23/48

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49855 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00012

摘要： A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

摘要翻译： 电子电路装置具有设置有电极的电子部件，具有安装有电子部件的上表面的基板，形成在安装于基板的上表面的电子部件附近形成的外部电极， 电极，设置在外部电极的上表面的绝缘突起，以及密封电子部件而不覆盖外部电极的密封树脂。 外部电极的上表面被突起分隔成位于密封树脂侧的第一区域和位于与第一区域相对的一侧的第二区域。 能够抑制密封树脂的薄片等细小颗粒附着在外部电极上，能够维持外部电极与电气设备之间的稳定的电连接。

公开(公告)号：USD525214S1

公开(公告)日：2006-07-18

申请号：US29219666

申请日：2004-12-20

申请人： Takao Ochi ,  Junichi Shinyashiki

设计人： Takao Ochi ,  Junichi Shinyashiki

公开(公告)号：US20050121761A1

公开(公告)日：2005-06-09

申请号：US11035986

申请日：2005-01-18

申请人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

发明人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/98 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18 ,  H01L23/02

CPC分类号： H05K1/186 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

公开(公告)号：US06582991B1

公开(公告)日：2003-06-24

申请号：US09886997

申请日：2001-06-25

申请人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

发明人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

IPC分类号： H01L2144

CPC分类号： H05K1/186 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.