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公开(公告)号:US12113039B2
公开(公告)日:2024-10-08
申请号:US17245397
申请日:2021-04-30
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor: Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/052 , B22F1/102 , B22F1/107 , B22F1/17 , B22F7/04 , B23K1/00 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/365 , B23K101/40 , B23K103/00 , H01B1/22 , H01L25/00 , H05K3/32 , H10K50/842
CPC classification number: H01L24/29 , B22F1/052 , B22F1/102 , B22F1/107 , B22F1/17 , B22F7/04 , B23K1/0016 , B23K35/025 , B23K35/3006 , B23K35/3601 , B23K35/3613 , B23K35/3618 , B23K35/365 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , B22F2007/047 , B22F2301/255 , B22F2302/45 , B23K2101/40 , B23K2103/56 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/92 , H01L25/50 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/131 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/13387 , H01L2224/1339 , H01L2224/13439 , H01L2224/1349 , H01L2224/13499 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27332 , H01L2224/27436 , H01L2224/27505 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29439 , H01L2224/2949 , H01L2224/29499 , H01L2224/32145 , H01L2224/32146 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/81075 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/8184 , H01L2224/81948 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/0665 , H01L2924/12041 , H01L2924/12044 , H01L2924/1461 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/206 , H01L2924/2064 , H05K3/321 , H10K50/8426 , H01L2224/83203 , H01L2924/00012 , H01L2224/94 , H01L2224/83 , H01L2224/29339 , H01L2924/0105 , H01L2224/29339 , H01L2924/01046 , H01L2224/29339 , H01L2924/01047 , H01L2224/29339 , H01L2924/01029 , H01L2224/29339 , H01L2924/01028 , H01L2224/29439 , H01L2924/00014 , H01L2224/29355 , H01L2924/00014 , H01L2224/29347 , H01L2924/01028 , H01L2224/29347 , H01L2924/01028 , H01L2924/0103 , H01L2224/29387 , H01L2924/0493 , H01L2924/01004 , H01L2224/2949 , H01L2924/00012 , H01L2224/2939 , H01L2924/0665 , H01L2224/271 , H01L2924/00014 , H01L2224/27436 , H01L2924/00014 , H01L2224/94 , H01L2224/27 , H01L2224/05155 , H01L2924/00014 , H01L2224/05644 , H01L2924/00014 , H01L2224/83439 , H01L2924/00014 , H01L2224/83447 , H01L2924/01074 , H01L2224/8321 , H01L2924/00014 , H01L2224/81203 , H01L2924/00012 , H01L2224/94 , H01L2224/81 , H01L2224/13339 , H01L2924/0105 , H01L2224/13339 , H01L2924/01046 , H01L2224/13339 , H01L2924/01047 , H01L2224/13339 , H01L2924/01029 , H01L2224/13339 , H01L2924/01028 , H01L2224/13439 , H01L2924/00014 , H01L2224/13355 , H01L2924/00014 , H01L2224/13347 , H01L2924/01028 , H01L2224/13347 , H01L2924/01028 , H01L2924/0103 , H01L2224/13387 , H01L2924/0493 , H01L2924/01004 , H01L2224/1349 , H01L2924/00012 , H01L2224/1339 , H01L2924/0665 , H01L2224/131 , H01L2924/00014 , H01L2224/11436 , H01L2924/00014 , H01L2224/94 , H01L2224/11 , H01L2224/8121 , H01L2924/00014 , H01L2924/00014 , H01L2224/45099 , H01L2224/1132 , H01L2924/00014 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/73265 , H01L2224/32245 , H01L2224/48247 , H01L2924/00012 , H01L2224/73265 , H01L2224/32145 , H01L2224/48247 , H01L2924/00 , H01L2224/73265 , H01L2224/32145 , H01L2224/48227 , H01L2924/00 , H01L2224/92247 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00 , H01L2224/92247 , H01L2224/73265 , H01L2224/32245 , H01L2224/48247 , H01L2924/00
Abstract: A sintering powder comprising:
a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.-
公开(公告)号:US20240413117A1
公开(公告)日:2024-12-12
申请号:US18806922
申请日:2024-08-16
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor: Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/052 , B22F1/102 , B22F1/107 , B22F1/17 , B22F7/04 , B23K1/00 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/365 , B23K101/40 , B23K103/00 , H01B1/22 , H01L25/00 , H05K3/32 , H10K50/842
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
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公开(公告)号:US10130995B2
公开(公告)日:2018-11-20
申请号:US15302712
申请日:2015-04-10
Applicant: Alpha Assembly Solutions Inc.
Inventor: Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Sutapa Mukherjee
IPC: B22F9/24 , B22F1/00 , B22F1/02 , C09C1/62 , B22F9/04 , C09J1/00 , C09J9/02 , C09J11/04 , H01L23/00
Abstract: A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.
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公开(公告)号:US20210249376A1
公开(公告)日:2021-08-12
申请号:US17245397
申请日:2021-04-30
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor: Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/00 , B23K35/02 , B22F7/04 , H01B1/22 , B22F1/02 , B23K1/00 , B23K35/30 , B23K35/36 , B23K35/365
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
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公开(公告)号:US10998284B2
公开(公告)日:2021-05-04
申请号:US15302827
申请日:2015-04-10
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor: Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/00 , B23K35/02 , B22F7/04 , H01B1/22 , B22F1/02 , B23K1/00 , B23K35/30 , B23K35/36 , B23K35/365 , B23K101/40 , B23K103/00 , H05K3/32 , H01L25/00 , H01L51/52
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
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