公开(公告)号：US11676952B2

公开(公告)日：2023-06-13

申请号：US17225731

申请日：2021-04-08

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/02 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/20 ,  H01L33/48 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/005 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20210313305A1

公开(公告)日：2021-10-07

申请号：US17225731

申请日：2021-04-08

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/02 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/20 ,  H01L33/48 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20190259739A1

公开(公告)日：2019-08-22

申请号：US16284125

申请日：2019-02-25

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/60 ,  H01L27/02 ,  H01L33/08 ,  H01L33/44 ,  H01L33/52 ,  H01L33/48 ,  H01L33/20 ,  H01L27/12 ,  H01L25/075 ,  H01L23/00 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L33/30 ,  H01L33/06

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20240014195A1

公开(公告)日：2024-01-11

申请号：US18315758

申请日：2023-05-11

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/02 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/20 ,  H01L33/48 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L25/167 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/0203 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/124 ,  H01L33/20 ,  H01L33/486 ,  H01L27/1244 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/0008 ,  H01L33/54 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/12041 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/005

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20220293876A1

公开(公告)日：2022-09-15

申请号：US17804715

申请日：2022-05-31

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  H01L27/15 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683 ,  H01L27/32

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US20210257572A1

公开(公告)日：2021-08-19

申请号：US17186362

申请日：2021-02-26

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  H01L27/15 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US10573629B2

公开(公告)日：2020-02-25

申请号：US16284125

申请日：2019-02-25

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/02 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/20 ,  H01L33/48 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20180182746A1

公开(公告)日：2018-06-28

申请号：US15850862

申请日：2017-12-21

Applicant: Apple Inc

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/48 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/62 ,  H01L33/60 ,  H01L33/56 ,  H01L33/54 ,  H01L33/52 ,  H01L23/00 ,  H01L33/44 ,  H01L33/30 ,  H01L33/20 ,  H01L33/08 ,  H01L33/06

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US09876000B2

公开(公告)日：2018-01-23

申请号：US15405060

申请日：2017-01-12

Applicant: Apple Inc

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/54 ,  H01L33/00 ,  H01L33/56 ,  H01L33/62 ,  H01L33/30 ,  H01L33/06 ,  H01L27/12 ,  H01L23/00 ,  H01L33/20 ,  H01L25/075 ,  H01L33/48 ,  H01L33/44 ,  H01L33/60 ,  H01L33/08 ,  H01L33/52

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US09865832B2

公开(公告)日：2018-01-09

申请号：US14798298

申请日：2015-07-13

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L27/15 ,  H01L27/12 ,  H01L51/50 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683 ,  G09G3/3208

CPC classification number: H01L51/50 ,  G09G3/006 ,  G09G3/3208 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/32 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L27/1214 ,  H01L27/156 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32237 ,  H01L2224/32503 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75725 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/97 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/053 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.