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公开(公告)号：US07896983B2
公开(公告)日：2011-03-01
申请号：US11429983
申请日：2006-05-09
申请人： Hiroshi Koyama , Koichi Tamatsu , Masato Sugawara , Jun Umeno , Hiroshi Machida , Hiroshi Masuya , Fumiaki Kimura , Yasuaki Tsuji , Akihiro Katsuya , Takahiro Nakamura
发明人： Hiroshi Koyama , Koichi Tamatsu , Masato Sugawara , Jun Umeno , Hiroshi Machida , Hiroshi Masuya , Fumiaki Kimura , Yasuaki Tsuji , Akihiro Katsuya , Takahiro Nakamura
IPC分类号： C21D9/08
CPC分类号： B23P15/00 , B23P2700/14 , B60G21/055 , B60G21/0551 , B60G2204/1222 , B60G2204/1224 , B60G2204/416 , B60G2204/422 , B60G2204/44 , B60G2204/45 , B60G2204/82 , B60G2204/8302 , B60G2204/8306 , B60G2206/427 , B60G2206/72 , B60G2206/80 , B60G2206/8103 , B60G2206/81035 , B60G2206/8201 , B60G2206/84 , B60G2206/8403 , Y10T29/49622
摘要： In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.
摘要翻译： 在制造中空稳定器的方法中，在热状态或暖态的温度范围内压缩电泳管的管压缩步骤，以使外径相对于外径为18％至35％之间的厚度， 并且执行在冷态下形成稳定器形状的压缩的电泳管的形成步骤。 接着，进行对半成品稳定剂进行热处理的工序，对半成品稳定剂进行冲击的喷丸硬化工序，进行半成品稳定剂的涂布工序。
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公开(公告)号：US20060200990A1
公开(公告)日：2006-09-14
申请号：US11429983
申请日：2006-05-09
申请人： Hiroshi Koyama , Koichi Tamatsu , Masato Sugawara , Jun Umeno , Hiroshi Machida , Hiroshi Masuya , Fumiaki Kimura , Yasuaki Tsuji , Akihiro Katsuya , Takahiro Nakamura
发明人： Hiroshi Koyama , Koichi Tamatsu , Masato Sugawara , Jun Umeno , Hiroshi Machida , Hiroshi Masuya , Fumiaki Kimura , Yasuaki Tsuji , Akihiro Katsuya , Takahiro Nakamura
IPC分类号： B21D53/88
CPC分类号： B23P15/00 , B23P2700/14 , B60G21/055 , B60G21/0551 , B60G2204/1222 , B60G2204/1224 , B60G2204/416 , B60G2204/422 , B60G2204/44 , B60G2204/45 , B60G2204/82 , B60G2204/8302 , B60G2204/8306 , B60G2206/427 , B60G2206/72 , B60G2206/80 , B60G2206/8103 , B60G2206/81035 , B60G2206/8201 , B60G2206/84 , B60G2206/8403 , Y10T29/49622
摘要： In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.
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公开(公告)号：US06871865B2
公开(公告)日：2005-03-29
申请号：US10277109
申请日：2002-10-22
IPC分类号： B21D7/08 , B21D53/86 , B60G21/055
CPC分类号： B60G21/055 , B60G2206/012
摘要： A hollow stabilizer made of a steel pipe, comprises: a torsion portion extending in a width direction of a vehicle body; a pair of right and left arm portions positioned at both end sides of the torsion portion; and a plurality of curved portions which are bent in an arc shape in any of the torsion portion, the arm portions and portions therebetween. Bending radii of the plurality of curved portions are different from each other.
摘要翻译： 一种由钢管制成的中空稳定器，包括：扭转部，其沿车体的宽度方向延伸; 位于所述扭转部的两端侧的一对左右臂部; 以及多个弯曲部分，其弯曲成任何扭转部分，臂部分和其间的部分中的弧形。 多个弯曲部的弯曲半径彼此不同。
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公开(公告)号：US20110099813A1
公开(公告)日：2011-05-05
申请号：US12674512
申请日：2008-10-02
申请人： Kazuto Kobayashi , Hiroshi Koyama
发明人： Kazuto Kobayashi , Hiroshi Koyama
IPC分类号： B21D53/10
CPC分类号： F16C33/64 , F16C19/186 , F16C2240/80 , F16C2326/02
摘要： A method for manufacturing a bearing ring member for a rolling bearing unit is provided. In this method, a blank hollow cylindrical portion having a smaller diameter than a hollow cylindrical portion is formed, the blank hollow cylindrical portion is radially expanded to form the hollow cylindrical portion, and a raceway surface is formed on either inner or outer circumferential surface of the hollow cylindrical portion along a circumferential direction thereof.
摘要翻译： 提供一种用于制造滚动轴承单元的轴承环构件的方法。 在该方法中，形成直径小于中空圆筒部的坯料中空圆筒部，使空心圆筒部径向膨胀，形成中空圆筒部，在内周面或外周面上形成有滚道面 中空圆筒部沿其圆周方向。
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公开(公告)号：US20100101091A1
公开(公告)日：2010-04-29
申请号：US12522311
申请日：2008-01-16
申请人： Kazuto Kobayashi , Hiroshi Koyama
发明人： Kazuto Kobayashi , Hiroshi Koyama
CPC分类号： B23P15/003 , B21H1/12 , B21J1/00 , B21J1/04 , B21J5/02 , B21J5/10 , B21K1/04 , B21K21/02 , F16C19/184 , F16C33/62 , F16C33/64 , Y10T29/49636 , Y10T29/49643 , Y10T29/49689
摘要： Provided is a manufacturing method of an outer ring (3) of a back-to-back arrangement double-row angular ball bearing from a raw material (10) comprising a upsetting (A to B), a backward extrusion process (C to D), a punching (D to E), a rolling (E to F) and a finishing, wherein an outer diameter of a first intermediate material (11a) produced by the upsetting is equal to or smaller than an inside diameter of an inner periphery large diameter portion (18) of the inner circumference of a die (13) used in the backward extrusion process and larger than an inside diameter of an inner periphery small portion (19) of the die (13), and in a condition with the first intermediate material (11a) sitting on the inner periphery inclined portion (20) of the die (13), the intermediate material (11a) is pushed toward a base of the die (13) by a punch (14), to thereby the middle metal material (29) with the highest cleanliness of the raw material (10) is exposed to the two outer ring raceways (2) of the outer ring (3).
摘要翻译： 本发明提供从包括镦粗（A〜B），向后挤压工序（C〜D）的原料（10）的背靠背排列双列角球轴承的外圈（3）的制造方法 ），冲压（D〜E），轧制（E〜F）和精加工，其中通过镦锻制造的第一中间材料（11a）的外径等于或小于内周的内径 在向后挤压过程中使用的模具（13）的内周的大直径部分（18）大于模具（13）的内周小部分（19）的内径，并且在 第一中间材料（11a）位于模具（13）的内周倾斜部分（20）上，中间材料（11a）通过冲头（14）被推向模具（13）的基部，由此 原料（10）清洁度最高的中间金属材料（29）暴露于t的两个外圈滚道（2） 他外圈（3）。
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公开(公告)号：US20080259473A1
公开(公告)日：2008-10-23
申请号：US11628075
申请日：2005-05-31
申请人： Takahiko Ueda , Hiroshi Koyama
发明人： Takahiko Ueda , Hiroshi Koyama
IPC分类号： G02B5/08
CPC分类号： G02B6/0055 , G02F1/133605 , Y10T428/24355
摘要： A light reflector including a laminate film having a light-diffusive layer on one surface of a substrate layer, wherein the surface roughness index of the light-reflective surface is at least 1, the reflectance thereof is at least 95%, and the regular reflectance thereof is at most 3%. The light reflector has higher brightness and higher reflectivity.
摘要翻译： 1.一种光反射器，包括在基板层的一个表面上具有光扩散层的层压膜，其中所述光反射表面的表面粗糙度指数至少为1，其反射率为至少95％，并且所述反射率为 至多3％。 光反射器具有更高的亮度和更高的反射率。
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7.发明申请Method and apparatus for prediction of amount of deformation due to shrinkage of molded article 有权用于预测模制品收缩引起的变形量的方法和装置公开(公告)号：US20080246188A1
公开(公告)日：2008-10-09
申请号：US12078865
申请日：2008-04-07
IPC分类号： B29C45/00
CPC分类号： B29C45/76 , B29C2945/76588
摘要： The method of predicting the amount of deformation due to shrinkage of a molded article of the present invention finds a support point P of the bending moment M from a distribution of shrinkage rates of a molding material forming a molded article 10 and uses the support point P to predict the amount of deformation. At that time, it is preferable to use the support point P to find the bending moment M and to use the bending moment M to predict the amount of deformation.
摘要翻译： 由本发明的成形品收缩引起的变形量的预测方法根据成型品10的成形材料的收缩率的分布求出弯矩M的支撑点P，并使用支承点P 预测变形量。 此时，优选使用支撑点P来找到弯矩M，并且使用弯矩M来预测变形量。
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公开(公告)号：US07344283B2
公开(公告)日：2008-03-18
申请号：US11282658
申请日：2005-11-21
IPC分类号： F21V7/22
CPC分类号： G02B6/0043 , G02B1/105 , G02B1/14 , G02B5/0808 , G02B5/0841 , G02B6/0055 , G02F1/133615 , G02F2201/34 , G09F13/14 , G09F13/18
摘要： Disclosed is a light reflector formed of a white polyolefin film which contains a polyolefin resin and a filler and is oriented at least monoaxially to have an areal draw ratio of from 1.3 to 80 times, which has a whole ray reflectance of at least 95% and undergoes a dimensional change of at most 1.5% when left at 70° C. for 300 hours, and which has a melting-starting temperature of 70° C. or higher. The light reflector hardly causes brightness unevenness of the planar light source when it is built in a planar light source device and used for a long period of time.
摘要翻译： 公开了一种由聚烯烃树脂和填料构成的白色聚烯烃膜形成的光反射体，其至少单轴取向，其面积拉伸比为1.3〜80倍，全光线反射率为95％以上， 当在70℃下放置300小时，其熔融起始温度为70℃以上时的尺寸变化为1.5％以下。 当平面光源内置在平面光源装置中并且长时间使用时，光反射器几乎不引起平面光源的亮度不均匀。
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公开(公告)号：US07291302B2
公开(公告)日：2007-11-06
申请号：US11484577
申请日：2006-07-12
申请人： Hiroshi Koyama , Tetsuya Kuno
发明人： Hiroshi Koyama , Tetsuya Kuno
IPC分类号： B29C45/14
CPC分类号： B29C45/1671 , B29C45/0062 , B29C45/0416 , B29C45/162 , B29C45/2681 , B29C2045/0063 , B29L2023/22 , B29L2031/246 , B29L2031/601
摘要： A manufacturing method for a synthetic resin hollow molded body includes a first injection molding process, a positioning process and a second injection molding process in which each of the contact portions of the first split assembly member, second split assembly member, and the third split assembly member is made to contact the corresponding contact portion and each of the contact portions is joined with the corresponding contact portion by a second injection between the first die and the second die.
摘要翻译： 合成树脂中空成型体的制造方法包括第一注射成型工艺，定位工艺和第二注射成型工艺，其中第一分割组件部件，第二分割组件部件和第三分割组件中的每个接触部分 使第一模具和第二模具之间通过第二次注射将构件与对应的接触部分接触，并且每个接触部分与对应的接触部分接合。
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公开(公告)号：US07091620B2
公开(公告)日：2006-08-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
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