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公开(公告)号：US20200073099A1
公开(公告)日：2020-03-05
申请号：US16336607
申请日：2016-09-30
Applicant: Intel Corporation
Inventor： Chia-Pin Chiu , Anna M. Prakash , Amanuel M. Abebaw , Olga Gorbounova , Ching-Ping Janet Shen , Shan Zhong , Mark Saltas
Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesave layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.
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公开(公告)号：US20190002735A1
公开(公告)日：2019-01-03
申请号：US15637960
申请日：2017-06-29
Applicant: Intel Corporation
Inventor： Mohit Gupta , Anna M. Prakash , Vladimir Malamud , Mark Saltas , Ziv Belman
Abstract: Aspects of the embodiments are directed to an optoelectronic device that includes one or more pressure sensitive adhesives to secure components during an assembly process. The optoelectronic device includes an electromagnetic interference/radio frequency interference shield. The shield can include an aperture for permitting light to enter a photodetector. An infrared filter can be secured to the shield using a pressure sensitive adhesive (PSA) film. The PSA film can be a templated film that is double sided. A PSA film can also be used to secure the shield to the printed circuit board (PCB) of the optoelectronic device. To promote electromagnetic conduction between the shield and the PCB, the PSA film can include additives. Aspects of the embodiments are directed to methods for assembling the optoelectronic device by picking and placing a PSA film and applying a pressure to certain components to activate the PSA film adhesion.
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公开(公告)号：US09991211B2
公开(公告)日：2018-06-05
申请号：US15607270
申请日：2017-05-26
Applicant: Intel Corporation
Inventor： Anna M. Prakash , Reynaldo Alberto Olmedo , Venmathy McMahan , Rajendra C. Dias , Joshua David Heppner , Ann Jinyan Xu , Sriya Sanyal , Eric Jin Li
IPC: H01L23/552 , H01L23/498 , H01L21/48 , H01L21/56 , H01L23/29
CPC classification number: H01L23/552 , H01L21/485 , H01L21/56 , H01L23/293 , H01L23/295 , H01L23/49838 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
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公开(公告)号：US20170271270A1
公开(公告)日：2017-09-21
申请号：US15074050
申请日：2016-03-18
Applicant: Intel Corporation
Inventor： Rajendra C. Dias , Anna M. Prakash , Joshua D. Heppner , Eric J. Li , Nachiket R. Raravikar
IPC: H01L23/552 , H01L21/56 , H01L21/78 , H01L23/31
CPC classification number: H01L23/552 , H01L21/565 , H01L21/78 , H01L23/3114 , H01L2224/16227 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/00012
Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.
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公开(公告)号：US11022792B2
公开(公告)日：2021-06-01
申请号：US16464257
申请日：2016-12-27
Applicant: Intel Corporation
Inventor： Kyle Yazzie , Anna M. Prakash , Suriyakala Ramalingam , Liwei Wang , Robert Starkston , Arnab Choudhury , Sandeep S. Iyer , Amanuel M. Abebaw , Nick Labanok
Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
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Patent Agency Ranking
公开(公告)号：US20190001342A1
公开(公告)日：2019-01-03
申请号：US15638167
申请日：2017-06-29
Applicant: Intel Corporation
Inventor： Amanuel M. Abebaw , Mark Saltas , Anna M. Prakash , Liwei Wang
Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material.The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.
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公开(公告)号：US20180235075A1
公开(公告)日：2018-08-16
申请号：US15434919
申请日：2017-02-16
Applicant: Intel Corporation
Inventor： Taylor Gaines , Anna M. Prakash , Ziv Belman , Baruch Schiffmann , Arnon Hirshberg , Ron Wittenberg , Vladimir Malamud
CPC classification number: H01L23/552 , H05K1/0218 , H05K1/0243 , H05K2201/0317 , H05K2201/0715 , H05K2201/10083 , H05K2201/10098 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159 , H05K2201/2018 , H05K2203/072 , H05K2203/0723
Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.
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公开(公告)号：US20170287851A1
公开(公告)日：2017-10-05
申请号：US15607270
申请日：2017-05-26
Applicant: Intel Corporation
Inventor： Anna M. Prakash , Reynaldo Alberto Olmedo , Venmathy McMahan , Rajendra C. Dias , Joshua David Heppner , Ann Jinyan Xu , Sriya Sanyal , Eric Jin Li
IPC: H01L23/552 , H01L21/56 , H01L23/29
CPC classification number: H01L23/552 , H01L21/485 , H01L21/56 , H01L23/293 , H01L23/295 , H01L23/49838 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
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公开(公告)号：US20170176495A1
公开(公告)日：2017-06-22
申请号：US14976808
申请日：2015-12-21
Applicant: INTEL CORPORATION
Inventor： Wen Yin , Anna M. Prakash , Teag R. Haughan , Dingying David Xu , Joaquin Aguilar-Santillan
CPC classification number: G01R1/06761 , C11D11/0047 , C22F1/183 , C23C8/16 , C23C8/20 , C23C8/80 , C25D3/54 , C25D5/34 , C25D5/50 , C25D7/00 , G01R1/06722
Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.
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公开(公告)号：US09685413B1
公开(公告)日：2017-06-20
申请号：US15089328
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Anna M. Prakash , Reynaldo Alberto Olmedo , Venmathy McMahan , Rajendra C. Dias , Joshua David Heppner , Ann Jinyan Xu , Sriya Sanyal , Eric Jin Li
IPC: H01L23/552 , H01L23/31 , H01L23/498 , H01L21/48 , H01L21/56
CPC classification number: H01L23/552 , H01L21/485 , H01L21/56 , H01L23/293 , H01L23/295 , H01L23/49838 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
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