公开(公告)号：US10781095B2

公开(公告)日：2020-09-22

申请号：US16222589

申请日：2018-12-17

Applicant: Infineon Technologies AG

Inventor： Jochen Dangelmaier ,  Manfred Schindler ,  Horst Theuss ,  Mathias Vaupel

IPC: B81B7/00 ,  B81C1/00

Abstract: Examples provided herein are associated with a molded lead frame of a sensor package. An example sensor package may include a molded lead frame that includes an opening in the molded lead frame, wherein the opening extends from a mount-side of the molded lead frame to a chip-side of the molded lead frame, wherein the chip-side of the molded lead frame is opposite the mount-side; and a sensor mounted to the chip-side of the molded lead frame.

公开(公告)号：US20200043836A1

公开(公告)日：2020-02-06

申请号：US16595546

申请日：2019-10-08

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US10438878B2

公开(公告)日：2019-10-08

申请号：US15949533

申请日：2018-04-10

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US11094619B2

公开(公告)日：2021-08-17

申请号：US16595546

申请日：2019-10-08

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L43/04 ,  H01L23/00 ,  H01L23/492 ,  H01L21/48

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

公开(公告)号：US10515879B2

公开(公告)日：2019-12-24

申请号：US15992958

申请日：2018-05-30

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Klaus Elian ,  Volker Strutz ,  Horst Theuss ,  Michael Weber

IPC: H01L23/495 ,  H01L23/31

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.

公开(公告)号：US20180350727A1

公开(公告)日：2018-12-06

申请号：US15992958

申请日：2018-05-30

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Klaus Elian ,  Volker Strutz ,  Horst Theuss ,  Michael Weber

IPC: H01L23/495 ,  H01L23/31

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.

公开(公告)号：US20150214204A1

公开(公告)日：2015-07-30

申请号：US14165769

申请日：2014-01-28

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L23/495

CPC classification number: H01L25/18 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/32503 ,  H01L2224/83005 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/20101 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/0665 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2224/83

Abstract: A method for fabricating an electronic device includes simultaneously attaching a first and a second semiconductor chip to a carrier using a transfer means, wherein attaching the first semiconductor chip includes a first attaching method and attaching the second semiconductor chip includes a second attaching method different from the first attaching method.

Abstract translation: 一种电子设备的制造方法，其特征在于，使用转印单元将第一和第二半导体芯片同时附着在载体上，其中，安装所述第一半导体芯片包括第一附着方法，并且所述第二半导体芯片的附着包括与 第一连接方法。

公开(公告)号：US11422144B2

公开(公告)日：2022-08-23

申请号：US16841870

申请日：2020-04-07

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Horst Theuss ,  Michael Weber

IPC: G01P3/44 ,  H01L25/16 ,  H01L23/62 ,  H01L49/02 ,  H01L23/31 ,  G01D5/14 ,  G01D5/16 ,  H01L23/00

Abstract: A magnetic field sensor package comprises a chip carrier, a magnetic field sensor which is arranged on the chip carrier and designed to detect a magnetic field, an integrated circuit which is arranged on the chip carrier and designed to logically process sensor signals provided by the magnetic field sensor, and at least one integrated passive component which is electrically coupled to at least one of the magnetic field sensor or the integrated circuit.

公开(公告)号：US20180294210A1

公开(公告)日：2018-10-11

申请号：US15949533

申请日：2018-04-10

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Franz-Peter Kalz ,  Volker Strutz

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/16 ,  H01L21/48 ,  H01L23/00 ,  H01L23/492 ,  H01L43/04

CPC classification number: H01L23/49586 ,  H01L21/4825 ,  H01L23/3121 ,  H01L23/4924 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49589 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L43/04 ,  H01L2224/13101 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.