Patent search ap:("Infineon Technologies AG") AND inv:"Peter Strobel" Page 1

1.

发明申请
Batch Process for Connecting Chips to a Carrier 有权
Title translation: 将芯片连接到载体的批处理

公开(公告)号：US20160043054A1

公开(公告)日：2016-02-11

申请号：US14451868

申请日：2014-08-05

Applicant: Infineon Technologies AG

Inventor： Rupert Fischer , Peter Strobel , Joachim Mahler , Konrad Roesl , Alexander Heinrich

IPC: H01L23/00 , H01L25/00 , H01L23/495

CPC classification number: H01L24/97 , H01L21/6835 , H01L23/295 , H01L23/3121 , H01L23/3142 , H01L23/49575 , H01L24/83 , H01L25/0655 , H01L25/18 , H01L25/50 , H01L2221/68354 , H01L2221/68363 , H01L2221/68381 , H01L2224/04026 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/06181 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/40227 , H01L2224/40247 , H01L2224/48227 , H01L2224/48247 , H01L2224/83005 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8381 , H01L2224/8382 , H01L2224/83851 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/95001 , H01L2224/95091 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/13055 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2224/83 , H01L2224/85 , H01L2224/84 , H01L2224/27 , H01L2924/014 , H01L2224/03 , H01L2924/00

Abstract: Methods for connecting chips to a chip carrier are disclosed. In some embodiments the method for connecting a plurality of chips to a chip carrier includes placing first chips on a transfer carrier, placing second chips on the transfer carrier, placing the transfer carrier with the first and second chips on the chip carrier and forming connections between the first chips and the chip carrier and the second chips and the chip carrier.

Abstract translation: 公开了将芯片连接到芯片载体的方法。在一些实施例中，用于将多个芯片连接到芯片载体的方法包括将第一芯片放置在转移载体上，将第二芯片放置在转移载体上，将具有第一和第二芯片的转移载体放置在芯片载体上并形成第一芯片和芯片载体以及第二芯片和芯片载体。

2.

发明授权
Package with separate substrate sections 有权

公开(公告)号：US11710684B2

公开(公告)日：2023-07-25

申请号：US17070427

申请日：2020-10-14

Applicant: Infineon Technologies AG

Inventor： Frank Singer , Martin Gruber , Thorsten Meyer , Thorsten Scharf , Peter Strobel , Stefan Woetzel

IPC: H01L23/495 , H01L21/56 , H01L23/31 , H01L21/54 , H01L23/16

CPC classification number: H01L23/49575 , H01L21/54 , H01L21/56 , H01L23/16 , H01L23/31 , H01L23/49541

Abstract: A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.

3.

发明申请
PACKAGE WITH SEPARATE SUBSTRATE SECTIONS 有权

公开(公告)号：US20210111108A1

公开(公告)日：2021-04-15

申请号：US17070427

申请日：2020-10-14

Applicant: Infineon Technologies AG

Inventor： Frank Singer , Martin Gruber , Thorsten Meyer , Thorsten Scharf , Peter Strobel , Stefan Woetzel

IPC: H01L23/495 , H01L23/16 , H01L23/31 , H01L21/54 , H01L21/56

Abstract: A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.

4.

发明申请
Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods 审中-公开

公开(公告)号：US20180040530A1

公开(公告)日：2018-02-08

申请号：US15663956

申请日：2017-07-31

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler , Benjamin Reichert , Chen Wen Lee , Giovanni Ragasa Garbin , Peter Strobel

IPC: H01L23/29 , H01L23/00 , C08K3/36 , H01L21/56

CPC classification number: H01L23/49513 , H01L21/563 , H01L24/01 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/01 , H01L2224/04026 , H01L2224/05639 , H01L2224/05644 , H01L2224/05687 , H01L2224/27312 , H01L2224/2732 , H01L2224/29015 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/32013 , H01L2224/32058 , H01L2224/32105 , H01L2224/32106 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/83192 , H01L2224/83385 , H01L2224/83424 , H01L2224/83439 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83815 , H01L2224/8384 , H01L2224/8385 , H01L2224/83851 , H01L2224/83948 , H01L2225/06513 , H01L2924/07802 , H01L2924/07811 , H01L2924/014 , H01L2924/00014 , H01L2924/01028 , H01L2924/01015 , H01L2924/0665 , H01L2924/05442 , H01L2924/00012

Abstract: A semiconductor device includes a carrier, a semiconductor die and a die attach material arranged between the carrier and the semiconductor die. A fillet height of the die attach material is less than about 95% of a height of the semiconductor die. A maximum extension of the die attach material over edges of a main surface of the semiconductor die facing the die attach material is less than about 200 micrometers.

5.

发明授权
Processing of one or more carrier bodies and electronic components by multiple alignment 有权

公开(公告)号：US11502042B2

公开(公告)日：2022-11-15

申请号：US16917947

申请日：2020-07-01

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer , Thomas Behrens , Martin Gruber , Thorsten Scharf , Peter Strobel

IPC: H01L21/301 , H01L21/46 , H01L21/78 , H01L23/544 , H01L23/00

Abstract: A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.

6.

发明申请
Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods 有权

公开(公告)号：US20210013132A1

公开(公告)日：2021-01-14

申请号：US17036271

申请日：2020-09-29

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler , Giovanni Ragasa Garbin , Chen Wen Lee , Benjamin Reichert , Peter Strobel

IPC: H01L23/495 , H01L23/00

Abstract: A semiconductor device includes a carrier, a power semiconductor die that includes first and second opposite facing main surfaces, a side surface extending from the first main surface to the second main surface, and first and second electrodes disposed on the first and second main surfaces, respectively, a die attach material arranged between the carrier and the first electrode, wherein the die attach material forms a fillet at the side surface of the power semiconductor die, wherein a fillet height of the fillet is less than about 95% of a height of the power semiconductor die, wherein the height of the power semiconductor die is a length of the side surface, and wherein a maximum extension of the die attach material over edges of a main surface of the power semiconductor die facing the die attach material is less than about 200 micrometers.

7.

发明授权
Die attach methods and semiconductor devices manufactured based on such methods 有权

公开(公告)号：US10832992B2

公开(公告)日：2020-11-10

申请号：US16518351

申请日：2019-07-22

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler , Giovanni Ragasa Garbin , Chen Wen Lee , Benjamin Reichert , Peter Strobel

IPC: H01L21/00 , H01L29/40 , H01L23/495 , H01L23/00

Abstract: A method includes providing a carrier, depositing a die attach material on the carrier, and arranging a semiconductor die on the die attach material, wherein a main surface of the semiconductor die facing the die attach material at least partly contacts the die attach material, wherein immediately after arranging the semiconductor die on the die attach material, a first maximum extension of the die attach material over edges of the main surface is less than about 100 micrometers.

8.

发明申请
PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS BY MULTIPLE ALIGNMENT 有权

公开(公告)号：US20210005557A1

公开(公告)日：2021-01-07

申请号：US16917947

申请日：2020-07-01

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer , Thomas Behrens , Martin Gruber , Thorsten Scharf , Peter Strobel

IPC: H01L23/544 , H01L23/00

Abstract: A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.

9.

发明授权
Die attach methods and semiconductor devices manufactured based on such methods 有权

公开(公告)号：US10396015B2

公开(公告)日：2019-08-27

申请号：US15663956

申请日：2017-07-31

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler , Benjamin Reichert , Chen Wen Lee , Giovanni Ragasa Garbin , Peter Strobel

IPC: H01L29/40 , H01L21/00 , H01L23/495 , H01L21/56 , H01L23/00

Abstract: A semiconductor device includes a carrier, a semiconductor die and a die attach material arranged between the carrier and the semiconductor die. A fillet height of the die attach material is less than about 95% of a height of the semiconductor die. A maximum extension of the die attach material over edges of a main surface of the semiconductor die facing the die attach material is less than about 200 micrometers.